All items tagged with Thread networking (21)

STMicroelectronics Reveals New STM32 Ultra-Low Power MCUs and Wireless Microcontrollers

March 5, 2025 by Joao Martins

STMicroelectronics Reveals New STM32 Ultra-Low Power MCUs and Wireless Microcontrollers

STMicroelectronics has introduced new STM32U3 microcontrollers (MCUs) with power-saving innovations that ease deployment of smart connected devices, especially in remote locations. The company has also unveiled the next generation of its STM32 power-efficient short-range wireless microcontrollers that simplify connecting consumer and industrial devices. The two new MCUs leverage near-threshold chip design to set a record performance-per-watt efficiency benchmark.

Silicon Labs Introduces New Concurrent Multiprotocol SoCs for Matter

March 3, 2025 by Joao Martins

Silicon Labs Introduces New Concurrent Multiprotocol SoCs for Matter

Silicon Labs announced that its MG26 family of wireless SoCs is now generally available and ready to provide developers with the highest performance for smart home applications, while leveraging AI/ML processing capabilities. The company calls it the industry’s most advanced, high-performance Matter and concurrent multiprotocol SoCs to date, with double the Flash and RAM of other Silicon Labs multiprotocol devices and best-in-class security.

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

July 23, 2024 by audioXpress Staff

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

Ceva announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers. The Balletto family is a complete Edge AI/ML microcontroller solution for wireless audio and smart home connected products with integrated Bluetooth Low Energy 5.3 and 802.15.4 (Matter) wireless subsystem and a dedicated network co-processor, enabling connectivity and class leading machine learning performance in a single chip.

Teledyne LeCroy's Frontline X500e Wireless Sniffer Captures Wi-Fi 7, Bluetooth, and 802.15.4 Traffic Simultaneously

April 12, 2024 by Joao Martins

Teledyne LeCroy's Frontline X500e Wireless Sniffer Captures Wi-Fi 7, Bluetooth, and 802.15.4 Traffic Simultaneously

Teledyne LeCroy is enabling the development of the latest wireless devices and connected applications with the launch of the Frontline X500e wireless protocol analyzer with Wi-Fi 7. For any application involving Bluetooth, Wi-Fi, 802.15.4-based technologies (including Matter, Thread, and Zigbee), or wired interfaces such as HCI-UART, USB, SPI, and Audio I2S, the X500e delivers precise insights for network professionals.

Realtek Showcases Switchable Wi-Fi/Bluetooth Audio Solution at 2024 AWE China Expo

March 13, 2024 by Joao Martins

Realtek Showcases Switchable Wi-Fi/Bluetooth Audio Solution at 2024 AWE China Expo

Under the theme of "Realtek AI Changing the Future," the Taiwan semiconductor company will exhibit at the AWE China Expo (March 14-17, 2024), at the Shanghai New International Expo Centre (SNIEC). Showcasing the possibilities of AI in connected applications, Realtek will present a hybrid AIoT Audio SoC that supports both dual‑band Wi‑Fi 6 (2.4GHz/5GHz) and dual-mode Bluetooth 5.2 to enable low-latency, high resolution audio playback applications.

STMicroelectronics Introduces Secure Wireless Microcontrollers Supporting Matter and Bluetooth LE Audio

March 6, 2024 by Cristina Costa

STMicroelectronics Introduces Secure Wireless Microcontrollers Supporting Matter and Bluetooth LE Audio

STMicroelectronics has revealed the next generation of its short-range wireless microcontrollers. These innovative, all-in-one components enable advanced smart home and audio applications, with more miniaturized, efficient, secure and affordable designs. The new STM32WBA ecosystem offers full support and integration of Bluetooth Low Energy 5.4, Zigbee, and Thread stacks, and enables new LE Audio and Auracast applications.

Apple Updates AirPods Pro (2nd generation) with USB-C and Upcoming Lossless Wireless Audio Protocol

September 12, 2023 by Joao Martins

Apple Updates AirPods Pro (2nd generation) with USB-C and Upcoming Lossless Wireless Audio Protocol

As expected, on September 12, Apple announced the new iPhone 15 series models, which now all have USB-C connectors (but only use USB3). More importantly, Apple introduced new AirPods Pro (2nd generation) with USB-C charging capabilities and anticipated new audio experiences to all AirPods Pro models with iOS 17 updates. Between the lines there is an announcement about an upcoming "groundbreaking wireless audio protocol" supporting lossless audio over 5GHz.

The Return of the Apple HomePod, Now with UWB, Matter, Bluetooth 5 and... Spatial Audio

January 18, 2023 by Joao Martins

The Return of the Apple HomePod, Now with UWB, Matter, Bluetooth 5 and... Spatial Audio

Following a surprise announcement of new M2 silicon for its MacBook Pro and Mac mini models, Apple surprised us even more with the announcement of the return of the infamous HomePod. Now packed full of innovations, more sensors, improved Siri features like the HomePod mini, and Matter-compatible smart home capabilities, the new HomePod returns with the same form factor, but now with updated Bluetooth 5 technology, UWB, Airplay 2, and the same smart, adaptive listening experience.

Texas Instruments Unifies Smart Home Connected Ecosystems with Matter-Enabled SimpleLink Wireless MCUs

November 22, 2022 by Cristina Costa

Texas Instruments Unifies Smart Home Connected Ecosystems with Matter-Enabled SimpleLink Wireless MCUs

Enabling smarter connections to the world around us, Texas Instruments (TI) introduced new Matter-enabled software development kits for Wi-Fi and Thread SimpleLink wireless microcontrollers (MCUs) that will streamline adoption of the Matter protocol in connected applications (also named sometimes as Internet of Things or IoT). The software builds on TI’s close involvement with the Connectivity Standards Alliance and innovation in the 2.4-GHz connectivity space.

Infineon Expands Support to Matter Smart Home Designs With New AIROC Bluetooth LE and 802.15.4 Low-Power SoC Solution

December 17, 2021 by audioXpress Staff

Infineon Expands Support to Matter Smart Home Designs With New AIROC Bluetooth LE and 802.15.4 Low-Power SoC Solution

Infineon announced the launch of the new AIROC Bluetooth LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market. Infineon’s new AIROC CYW30739 Bluetooth LE and 802.15.4 system on chip (SoC) is offered as a reliable, secure and scalable solution to connect low-power devices in the smart home. To further demonstrate the company’s commitment to Matter, Infineon expanded its role with the Connectivity Standards Alliance (CSA) by joining the Alliance’s Board of Directors as a Promoter Member.

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