All items tagged with IEEE 802.15.4 Thread (13)

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

July 23, 2024 by audioXpress Staff

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

Ceva announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers. The Balletto family is a complete Edge AI/ML microcontroller solution for wireless audio and smart home connected products with integrated Bluetooth Low Energy 5.3 and 802.15.4 (Matter) wireless subsystem and a dedicated network co-processor, enabling connectivity and class leading machine learning performance in a single chip.

Silicon Labs Streamlines Energy Harvesting Product Development for Battery-Free Wireless Connected Designs

April 22, 2024 by Cristina Costa

Silicon Labs Streamlines Energy Harvesting Product Development for Battery-Free Wireless Connected Designs

Silicon Labs has announced its most energy-efficient Wireless SoC to date with energy harvesting-ready capabilities. To signal Earth Day 2024, Silicon Labs launched its new xG22E family of Wireless SoCs, Silicon Labs' first-ever family designed to operate within the ultra-low power envelope required for battery-free, energy harvesting applications. The new family consists of the BG22E, MG22E, and FG22E, with "E" standing for "energy conservation."

Ceva Accelerates Enhanced Connectivity with Multiprotocol Wireless Platform IP Family

April 8, 2024 by audioXpress Staff

Ceva Accelerates Enhanced Connectivity with Multiprotocol Wireless Platform IP Family

Ceva announced Ceva-Waves Links, a new family of multiprotocol wireless platform IPs that delivers fully integrated connectivity solutions with Wi-Fi, Bluetooth, UWB, Thread, Zigbee, and Matter, simplifying development and accelerating time to market for next generation, connectivity-rich, MCUs and SoCs. Ceva-Waves Links100, a connectivity platform IP with RF implemented on TSMC 22nm is currently being deployed by a leading OEM in connected devices.

Synaptics Launches Triple Combo 16nm Ultra-Low-Power SoC to Drive New Automotive and Multimedia Use Cases

March 24, 2023 by Joao Martins

Synaptics Launches Triple Combo 16nm Ultra-Low-Power SoC to Drive New Automotive and Multimedia Use Cases

Offering enhanced connectivity and streaming features, Synaptics latest SYN4382 Triple Combo offers Matter-compliant Wi-Fi 2.4/5/6/6E, Bluetooth 5.3, and IEEE 802.15.4 wireless, with the ability for simultaneous operation of two radios and multiple Bluetooth channels to stream multimedia content. This state-of-the-art system-on-chip enables new exciting audio and video experiences, while lowering power consumption, cost, and system complexity.

Nordic Semiconductor Announces Its First Wi-Fi Chip

August 19, 2022 by Cristina Costa

Nordic Semiconductor Announces Its First Wi-Fi Chip

Following the acquisition of the Wi-Fi development team, core Wi-Fi expertise, and Wi-Fi IP tech assets of Imagination Technologies Group in 2020, Nordic Semiconductor announced its entry into the Wi-Fi wireless market with the introduction of the nRF7002, an ultra-low power, dual-band Wi-Fi 6 companion IC. The launch enables Nordic Semiconductor to offer all three of the world’s most popular wireless connectivity technologies: Bluetooth, Wi-Fi, and cellular, paving the way for new market opportunities.

Qorvo Accelerates UWB Adoption with Fully Integrated Module and Certification for Apple U1 Interoperability

July 26, 2022 by Joao Martins

Qorvo Accelerates UWB Adoption with Fully Integrated Module and Certification for Apple U1 Interoperability

Qorvo announced that it completed MFi certification of interoperability for its Ultra-Wideband (UWB) solutions with the Apple U1 chip used in supported iPhone and Apple Watch models. Qorvo UWB solutions comply with the Nearby Interaction accessory protocol and allow developers to easily design new commercial UWB-enabled accessories. The company also announced a fully integrated Ultra-Wideband (UWB) module that enables robust UWB implementation in automation, safety, and industrial systems.

Synaptics’ Triple Combo Wireless System-on-Chip Wins "2022 Best of Sensors" Award

June 29, 2022 by audioXpress Staff

Synaptics’ Triple Combo Wireless System-on-Chip Wins "2022 Best of Sensors" Award

Synaptics received the "2022 Best of Sensors” Award for Connectivity with its SYN4381 Triple Combo, the industry’s first Matter-compliant SoC with integrated Wi-Fi 6/6E, Bluetooth 5.2, and 802.15.4/Thread. The award was presented at Sensors Converge 2022 in a ceremony that honors the best technologies in the large and growing ecosystem. Synaptics’ FlexSense 4-in-1 sensor fusion processor was also recognized as a Finalist in the “Best of Sensors” Awards’ for wearables.

Nordic Semiconductor nRF5340 Audio DK Accelerates Bluetooth LE Audio Developments

May 20, 2022 by Cristina Costa

Nordic Semiconductor nRF5340 Audio DK Accelerates Bluetooth LE Audio Developments

The next generation of wireless audio projects is now getting on the bench, as developers get access to the first Bluetooth LE Audio evaluation platforms. Nordic Semiconductor has long been a reference in Bluetooth development platforms and has now released its nRF5340 Bluetooth LE Audio DK board, which includes everything required for developers to take advantage of the latest Bluetooth standard, including LC3 codec, low power consumption, and wireless stereo enhancements.

Synaptics Launches Matter-Compliant Triple Combo SoC for Seamless Connectivity

February 3, 2022 by Joao Martins

Synaptics Launches Matter-Compliant Triple Combo SoC for Seamless Connectivity

Synaptics announced the SYN4381 Triple Combo system-on-chip (SoC), the first to combine Wi-Fi 6/6E (802.11ax with extended 6 GHz operation), Bluetooth 5.2 (BT 5.2) with BLE Audio and High Accuracy Distance Measurement (HADM), and IEEE 802.15.4 with built-in support for the Thread protocol and Matter application layer. The solution simplifies product development while supporting 600 Mbps video and data, low-power Thread communication, and platform-agnostic device setup and interoperability.

STMicroelectronics Introduces Next-Generation Wireless Platform for Higher-Performing Bluetooth Devices

February 23, 2018 by Joao Martins

STMicroelectronics Introduces Next-Generation Wireless Platform for Higher-Performing Bluetooth Devices

Powering the next generation of smart connected objects like digital-home products and wearable electronics, STMicroelectronics has revealed an advanced dual-processor wireless chip that supports new features and enhanced performance with extended battery life. The fusion of 32-bit ultra-low-power microcontroller and highly integrated Bluetooth 5 (BLE) and IEEE 802.15.4 radio creates a high-performing wireless platform for feature-rich smart connected objects.

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