Artilux Offers USB4-Over-Fiber IC Solution for Longer Data Transfers

Artilux, a pioneer in GeSi (Germanium Silicon) photonic technology as well as CMOS-based SWIR sensing, imaging and optical communication technology, announced the launch of a mass-production-ready USB4 active-optical-cable IC solution. Compatible with Thunderbolt, DisplayPort, USB4/3 with data-transmission, audio-video display, and charging capabilities, the solution enables cheaper, longer data transfers.

Nanusens has announced that it has successfully created a fully digital circuit design to measure the capacitance of its nanosensors. This means that both the sensor structure and its detection circuitry can be made at the same time within a chip using standard CMOS processes on whatever process node is required. As a result, ASICs can now be made with several different sensors embedded within them, helping to expand MEMS applications in hearables.

Nanusens has had its first patent granted in the US, with filings in other countries underway, and has more patents in the process of being applied for. These all protect the company's innovative technology of building nanoscale structures within a standard CMOS metal layers to create novel NEMS (Nano Electro Mechanical Systems) sensors. Nanusens recently appointed Dr Graham Hine as Chairman with the goal of driving growth and fund raising for the nanosensors company.

In this article for Voice Coil focused on MEMS loudspeakers, Mike Klasco reviews a bit of the history of the technology and previews the evolution and impact on the audio industry in general. The article examines MEMS devices in general, provides a basic explanation of how the various types of MEMS speakers work, and what commercialization challenges are ahead. This article was originally published in Voice Coil, December 2019.

Nanusens, a research venture working on nano-sensors built inside CMOS devices, has announced that its proprietary technology can significantly increase the operational life of earbuds by up to 20%. This can be achieved by replacing the MEMS sensors in an earbud with a single multi-sensor chip solution that is up to ten times smaller, freeing up space for larger batteries. The company will be announcing this technology solution at MWC 2019 in Barcelona, Spain.

Silicon Labs introduced a complete portfolio of receivers/audio processors and multi-standard digital radio ICs designed to deliver best-in-class AM/FM and digital radio performance for the global car radio market. The expanded portfolio includes AM/FM radio receivers with integrated audio processing paired with digital radio coprocessors and data receivers.