ALMA International Symposium & Expo Expands with InfoComm 2019

January 22 2019, 01:25
The Association of Loudspeaker Manufacturing & Acoustics (ALMA) International will promote its ALMA International Symposium & Expo (AISE) June 9–10, 2019, just prior to and in affiliation with InfoComm in Orlando, FL. The event will be a unique opportunity to expand the scope of ALMA's activities, bringing loudspeaker industry members together. ALMA has been working hard for AISE 2019 and confirmed activities include the first Speaker Builders Workshop (SBW), a full-day, hands-on, interactive workshop. There are still opportunities for content and taking space available at the exhibition. Registration is now available.

ALMA International (Association of Loudspeaker Manufacturing and Acoustics), promoter of the ALMA International Symposium & Expo (AISE), has entered into a co-location agreement with AVIXA (the Audiovisual and Integrated Experience Association), owner of InfoComm. The two organizations offer content for the audio industry, but in complimentary ways that will benefit participants who take advantage of the education, exhibitions, and networking that make AISE and InfoComm outstanding events.

AISE 2019 takes place on June 9 & 10, 2019 at the DoubleTree by Hilton Universal in Orlando, Florida. InfoComm’s conference schedule runs June 8 to 14, with exhibits open June 12 to 14, 2019 at Orlando’s Orange County Convention Center. Attendees can expect ALMA’s acclaimed technical and business content with over 30 hours of education in two packed days along with exhibitors and attendees from around the world.

"ALMA International’s move to co-locate with InfoComm is the next step in the dynamic evolution of the Association in seeking to broaden our exposure and service to professionals in the Audio and Loudspeaker Technologies industry. The ability to attend two exciting and beneficial events in one productive trip makes the combination that much more compelling,” says Barry Vogel, Executive Director of ALMA International.

InfoComm is the premier audiovisual and integrated experience event, attracting 44,000 attendees from over 100 countries, and featuring more than 500,000 square feet of exhibit space, 1,000 exhibitors, and more than 150 conference sessions.

“We look forward to having ALMA’s AISE2019 co-locate with InfoComm 2019,” said David Labuskes, CTS, CAE, RCDD, Chief Executive Officer of AVIXA ( “AISE delivers content that complements well our focus on audio solutions that improve customer experiences.”

ALMA will present two conference sessions at InfoComm. To encourage participation in both events, attendees of AISE are eligible for a free exhibit pass to InfoComm and attendees at InfoComm are eligible for a free exhibit pass to AISE. Both require promo codes which are available at the InfoComm and ALMA websites. 

Call for Content
Meanwhile ALMA has issued a “Call for Content” for the AISE 2019. The goal of content presentations is to present new, cutting edge education focusing on technical, business, marketing, and general education related to the electroacoustic and audio industry and all technologies that impact our industry.

ALMA seeks to provide a vibrant and interactive forum to discuss the current and future innovation, as well as the opportunities throughout the audio world. All presentations will be broken down into one of three tracks:
• Technical and related Content
• Business and related Content
• Education related content (includes content for students, and content presented by students)

Papers, Advertorials, Seminars, Demonstrations and Exhibits may cover a wide range of products, services, and topics, as long as it relates to the electroacoustics and audio industry.
• Papers: Presentations of academic nature and not self, corporate, or product related. 20 minutes or less in length.
• Advertorials: Presentations geared toward a particular brand or product. 20 minutes or less in length.
Advertorials will be at no charge for exhibitors who will also receive priority placement in the schedule.
• Seminars: Presentations of purely educational value and generic in subject matter. May be from 1 to 4 hours.
• Exhibitor Focus: ALMA will come to each booth during AISE to video record a 1 to 2 minute spot about the exhibitor’s company, product, or service to be posted to Vimeo and the ALMA website after the show. No charge for exhibitors and automatic unless the exhibitor chooses to opt out.

Specific content for Papers and Seminars includes, but is not limited to: 
Current Transducer Design and Innovations.
DSP & Signal Processing
Microphones and Acoustics
Microspeakers, Wireless Phones, Headphone Technology
Testing and Production
System Design
End of Line Testing
New Technologies

Entries should be submitted by email no later than March 31, 2019.

AISE 2019 will feature the first Speaker Builders Workshop (SBW), a full-day, hands-on, interactive workshop presented in segments that will appeal to every part of the loudspeaker industry. Management, product developers, marketing, engineers, and supply chain managers will all benefit from this workshop. SBW will follow the path of the development of a specific driver from need to spec to modeling to actually building the driver, and then testing. Sponsors and presenters include COMSOL, Eminence, Hernon, Audio Precision, and Klippel. SBW will be groundbreaking in its scope and presentation. Be sure to sign up early as seating will be limited.

The floor layout is designed to promote a flow of visitors to the exhibits at all moments, directly accessing the three breakout session rooms. Sessions include discussion panels, seminars, papers and product/technology showcases. The Speaker Builders Workshop - how to design and specify a transducer for your product - will be a full day track with several presenters on June 10, 2019.

Here are some confirmed session highlights.

Experts from COMSOL will attend AISE 2019 to explain how Multiphysics software can be used in Loudspeaker Designs. HEAD acoustics' experts will share everything they know about evaluation of Active Noise Canceling (ANC) headphones, how to evaluate and compare Smart Speakers, and what is possible to measure smart Home devices and applications, involving microphones, loudspeakers, speech recognition, hands free communication, and audio quality. Listen, will explain how to test smart speakers, hearables, smart home devices, wireless headphones, and automotive entertainment systems. NTi Audio will explain the challenges and best practices for microphone end-of-line testing. LOUDSOFT will present on the topic of QC testing and many other measurement techniques. And MISCO and Warkwyn experts will talk about their experience on using modern analysis tools to recreate an iconic speaker.

Stephan Schonfeld (Klippel GmbH) will explain everything about SPLmax and how the new standard IEC 60268-21 defines acoustical measurements for assessing the sound pressure output of active and passive loudspeaker systems. Wolfgang Klippel will present a new seminar on Green Speaker Design and the optimal use of system resources, addressing the implications for enclosures, panels, passive resonators, amplifiers, cables and DSP. Ferrotec's Vanessa Rene will detail the thermal benefits of ferrofluids, as used by more than 300 speaker manufacturers around the world. Mark Valentino (PCB Piezotronics) will promote a technical session on acoustics to address the differences of test and measurement lab grade microphones when compared to audio grade microphones and the advantages of each. Michael Klasco (Menlo Scientific) will share his knowledge on materials and the latest technologies for headphones and how to design microphones and speakers. Doug Button will explain how to reduce distortion in loudspeakers with Digital Signal Processing (DSP).  For students and those less familiar with loudspeaker technical disciplines, Mark Beach will explain loudspeaker parameters such as Qts, EBP, Xmax, Fb, Vb, and others.

Stephen C Thompson (Penn State University) will explain everything about transducer modeling using SPICE, SimScape, or Modelica software tools. Tim Whitwell (Tectonic Audio Labs) will dissect the audio principles of Balanced Mode Radiator (BMR) transducers. LingChen Zhu will present a seminar on Speaker Design Simulation, comparing different tools with real measurements. Parker Anderson will address real-world performance from different cardioid array configurations. Brandon Carroll (Georgia Tech) will present a seminar on new audio signal processing and machine learning algorithms that characterize environmental audio. Md Mehedi (Carpenter Technology) will share his research on new alloy materials that can be used to build smaller, power efficient speakers with improved sound quality. Not to be missed as well, a paper presented by Alex Voishvillo, Balazs Kakonyi, and Brian McLaughlin, on quantification of loudspeaker maximum SPL parameter using different short-term signals. 

In other papers and sessions, industry consultants will address the importance of building strong brand identity, how to manage a supply chain and be prepared for Global Trade Wars, among many relevant business-focused subjects for industry professionals.

ALMA International (Association of Loudspeaker Manufacturing and Acoustics) is a not for profit association that serves Professionals in the audio koudspeaker industry. Founded in 1961, ALMA's focus is in providing education, networking, and a productive environment in which to do business. Global Membership includes engineering and product development professionals as well as management, sales, and marketing professionals. ALMA is the owner and producer of AISE (ALMA International Symposium & Expo). The two day event is held annually and focuses upon building knowledge, relationships and getting business done for our exhibitors and attendees. Follow this link to read about AISE 2018.

AISE 2019
June 9 & 10, 2019
DoubleTree by Hilton Universal, Orlando, Florida, USA

Information including content, exhibitors committed, as well as registration is available on the ALMA website. All registrations are open and available online. For more information and updates, visit ALMA International at and InfoComm at
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