DTS Headphone:X Surround Sound Technology Expands Into More Smartphones

March 10 2015, 03:00
During the Mobile World Congress 2015, in Barcelona, DTS announced that its Headphone:X technology will be available on select smartphone models from top Chinese brands Huawei, vivo, nubia and letv, later this year. These partnerships mark the expansion of DTS Headphone:X availability to consumers via integration in smartphones. The vivo, nubia and letv models will ship with the Qualcomm Snapdragon 810 chipset, which includes DTS Headphone:X.

DTS Headphone:X recreates a spatially accurate immersive home theater audio experience over any set of headphones. This technology supports 5.1, 7.1 and 11.1 multi-channel audio as well as a configurable stereo mode to deliver the sound listeners want. Headphone:X gives listeners the ability to select the exact sound profile for a growing database of headphones, representing more than 230 models and 60 brands. It also allows users to simply create a profile tailored to their own listening preferences, providing a completely optimized, personalized experience. Importantly, Headphone:X improves the overall quality of the audio, regardless of its level of fidelity.

“With the incorporation of DTS Headphone:X on smartphones from these prominent Chinese brands coming this year, more consumers than ever before will have the opportunity to enjoy a completely unique, dynamic audio experience on their mobile devices,” said Brian Towne, president, DTS Asia Pacific and executive vice president, DTS. “China is a critical market in the future growth of the mobile industry, and we are excited that Headphone:X is playing a role in furthering the development and implementation of the DTS content ecosystem globally.”

DTS Headphone:X technology provides mobile device OEMs the opportunity to offer a premium feature to high-value consumers as well as establish their own content platforms so customers can easily access and enjoy engaging, immersive experiences.

Cadence Optimizes Headphone:X
Meanwhile, Cadence Design Systems also announced that DTS Headphone:X immersive sound technology has been optimized for the Cadence Tensilica HiFi Audio/Voice digital signal processor (DSP) family.

The Tensilica HiFi Audio/Voice DSP, based on the Xtensa processor platform, is a widely used and licensable audio/voice DSP family, with support for over 140 proven audio/voice software packages and over 65 software partners. The Headphone:X library for HiFi DSPs is licensed by Cadence, available to direct licensees of DTS.

“Headphone:X redefines the mobile entertainment experience, delivering audio in a way that provides a surround sound experience on a standard stereo device,” says Joanna Skrdlant, vice president of solutions licensing at DTS. “With support on the HiFi architecture, Cadence will attract design teams that want to enhance the user experience with unparalleled capability to accurately reproduce multi-channel sound in an energy efficient DSP implementation.”

“One of the big hits in our booth at the Consumer Electronics Show this year was our demonstration of DTS Headphone:X. The audio experience was outstanding,” said Larry Przywara, group director of audio/voice IP marketing, Cadence. “We expect that many of our mobile semiconductor and OEM customers will incorporate Headphone:X using our proven HiFi DSP cores to provide the full surround sound stage in the lowest power.”

Cadence plays an essential role in the creation of today’s integrated circuits and electronics, provinding software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems.
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