Qualcomm Ultra Low-Power Bluetooth Audio SoCs Now Powering Compact, Feature-Rich Wireless Earbuds, Headsets and Speakers
Qualcomm Technologies International, a subsidiary of Qualcomm Incorporated, showcased at MWC 2019 in Barcelona the most recent wireless earbuds and hearables using the latest Qualcomm QCC5100 and QCC302x series, ultra-low power Bluetooth audio SoCs. Now available in more than 10 products, Qualcomm is finding increased traction from audio, mobile and consumer electronics manufacturers for these SoCs, allowing for a robust, low-latency and high-quality wireless audio experiences, in compact, feature-rich wireless earbuds, headsets and speakers.
Analog Devices Unveils New SHARC Audio Module Platform for Rapid Audio DSP Project Development
Analog Devices announced the availability of its new SHARC Audio Module (ADZS-SC589-MINI), a hardware/software platform that facilitates efficient product prototyping, development, and production of a variety of digital audio products. Delivering an innovative combination of high-performance audio signal processing components and a comprehensive software development environment, the SHARC Audio Module is ideal for effects processors, multi-channel audio systems, MIDI synthesizers, and many other DSP-based audio projects.
Mymanu CLIK S All-In-One Truly Wireless Earbuds Unveiled at MWC 2019
British start-up Mymanu is determined to embrace new challenges, again, with the launch of what the company calls “the most affordable, All-In-One truly wireless earbuds” with extended features. Unveiled at MWC 2019, in Barcelona and targeted to cost 79$ on pre-order, the new Mymanu CLIK S earbuds have been designed with fitness, music and travel lovers in mind. And as with previous initiatives from Mymanu, the focus continues to be the use of TWS earbuds for language translation, supported with a connected smartphone and app.
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Bragi Offers New Technology Suite and Reference Design for Consumer and Professional Hearables
Bragi, the company which can rightfully claim to be the creators of the world’s first Hearable, is unveiling the next-generation of its technology suite and is to introduce it at MWC 2019. As previously announced, Bragi is now developing ultra-efficient artificial intelligence and edge computing technologies for ultra-low power devices that intends to make available to other manufacturers. At MWC 2019, the German company will disclose details of the new platform as a reference design for professional Hearables.
DSP Group and Snips Announce Technology Partnership on Multi-Room Embedded Voice Recognition Architecture
DSP Group and Snips, the European pioneer in embedded voice recognition software, announced a technology partnership which combines Snips’ voice software with DSP Group’s Ultra Low Energy (ULE) system-on-chip (SoC) and modules. According to the announcement, this combination of software and hardware running over the ULE network extends the reach of natural voice-controlled edge devices and could become a natural choice for multi-room smart home and smart building applications.
Dirac Debuts Latest Version of Dirac 3D Audio at MWC19
At MWC19, Dirac Research announced the debut of its latest version of Dirac 3D Audio for mobile devices, headphones and VR/AR headsets. Using patent-pending Dynamic HRTFs (head-related transfer functions), Dirac 3D Audio enables positional audio reproduction with one degree of resolution in all three dimensions, and offers an unparalleled level of 360-degree audio immersion on mobile devices, ideal for on-the-go gaming and videos.
HEAD acoustics Launches Acoustic Environment for Realistic Noise and Reverberation Measurements
Users of mobile phones, voice-operated smart home devices or hands-free terminals have to deal with different background noises and room reverberation that impair their user experience. Therefore, realistic performance tests of communication devices do not only need to consider background noise but also reverberation. HEAD acoustics launches 3PASS reverb for this purpose, a software option for its background noise simulation systems 3PASS lab and 3PASS flex.
AcoustiTools AR Acoustical Analysis Now Available on iPhone and iPad
Introduced at NAMM 2019 by Acoustic Masterminds, the new AcoustiTools app for iOS is now available in the Apple Store and provides a collection of cutting-edge, 3D acoustic measurement tools. Using advanced scanning abilities, augmented reality, 3D visualizations, patented and patent-pending technology, Acoustic Masterminds' AcoustiTools makes it easier to solve acoustic issues and creating superior listening environments from massive arenas to small recording studios and home theaters.
Xperi Corporation to Showcase Latest DTS Audio Technologies at MWC 2019
Xperi Corporation will showcase its latest mobile imaging, audio and semiconductor solutions from its brands, FotoNation, DTS and Invensas at MWC 2019 (February 25-28), in Barcelona. Xperi will showcase DTS audio solutions specifically targeted at the gaming market, including DTS Headphone:X 2.0 (for Gaming Headphones); DTS:X Ultra (for Windows and Android); DTS:X Game Audio; and DTS:X Premium.
ISE 2019: Networks Expanded. Audio, Video, Control, and More.
During my time at the Integrated Systems Europe (ISE) 2019 show, I looked closely at how companies are dealing with the transition to IP networks, how prevalent some proprietary technologies still are in commercial installation and AV in particular (e.g., HDBaseT), and how manufacturers are introducing new products and concepts to integrate those networked systems, in particular those protocols that support AES67 audio and the latest SMPTE ST-2110 suite of standards in general.