All items tagged with wireless earbuds and MEMS speakers (34)

USound Improves Performance of MEMS Speaker-Based Audio Systems with New Active Linearization Algorithm (ALA)

May 16, 2023 by audioXpress Staff

USound Improves Performance of MEMS Speaker-Based Audio Systems with New Active Linearization Algorithm (ALA)

USound announced the availability of Active Linearization Algorithm (ALA), a new signal processing tool that helps reduce the total harmonic distortion (THD) of MEMS speakers. According to the Austrian company, the new software tool sets new standards in the development of over-the-counter (OTC) hearing aids and true wireless stereo (TWS) headphones and was developed to assist audio systems developers in their efforts to improve the THD performance of MEMS-based products.

xMEMS Announces General Availability of First Solid-State Fidelity, All-Silicon Microspeakers

April 18, 2023 by Joao Martins

xMEMS Announces General Availability of First Solid-State Fidelity, All-Silicon Microspeakers

Following the announcement of the world's first true MEMS microspeaker in July 2020, xMEMS Labs now announced general availability of three solutions for immediate integration into next-generation true wireless stereo (TWS) earphones, in-ear-monitors (IEMs), hearing aids, and other emerging personal audio designs. Offering the advantages of Solid-State Fidelity and DynamicVent technology, xMEMS is determined to change the market through vastly superior audio experiences and improved consumer listening comfort.

USound Launches Kore 4.0 Integrated MEMS Speaker Module for TWS and OTC Hearing Aids

March 17, 2023 by Joao Martins

USound Launches Kore 4.0 Integrated MEMS Speaker Module for TWS and OTC Hearing Aids

USound has launched Kore 4.0, a fully integrated audio module that incorporates Usound’s Tarvos, a brand new ultra-low power audio amplifier, and Conamara, its latest generation of MEMS drivers. According to the MEMS-based audio technology specialist, with its compact form factor, superior audio performance, and low power consumption, Kore 4.0 is an ideal match for hearables and Over-The-Counter (OTC) hearing aids.

SonicEdge MEMS Ultrasound Speaker-In-Chip: Next Gen MEMS for TWS Earbuds and Hearing Aids

February 24, 2023 by Mike Klasco

SonicEdge MEMS Ultrasound Speaker-In-Chip: Next Gen MEMS for TWS Earbuds and Hearing Aids

Mike Klasco writes all about the cutting-edge SonicEdge MEMS Ultrasound Speaker-In-Chip. A next-gen MEMS solution for TWS earbuds, hearing aids, and hearables. Entering production in 2023, this unique ultrasonic shutter MEMS-based speaker system represents a decade's work in a unique topology. The core of the design is one or more apertures driven by the ultrasonic carrier signal and one or more movable and over-sized obstruction elements that are configured to modulate the ultrasonic carrier signal (think of a shutter) thereby generating audio.

xMEMS and Bujeon Launch 2-Way Hybrid MEMS Driver Solution for Hi-Res TWS Earbuds

February 22, 2023 by Joao Martins

xMEMS and Bujeon Launch 2-Way Hybrid MEMS Driver Solution for Hi-Res TWS Earbuds

xMEMS Labs and Bujeon Electronics have partnered to create a family of 2-way speaker modules to accelerate design of next generation high-resolution and lossless audio-capable TWS earbuds. The solution integrates a high-performance 9mm dynamic driver custom-designed by Bujeon with an xMEMS' Cowell tweeter, the world’s smallest monolithic MEMS microspeaker at just 22mm. The reference design combines an xMEMS Aptos MEMS speaker amplifier to create a "drop-in" solution compatible with today’s leading TWS system-on-chips.

xMEMS Announces World's First Solid-State MEMS DynamicVent, Enabling Active Ambient Control for Next-Generation TWS and Hearing Aids

January 9, 2023 by Joao Martins

xMEMS Announces World's First Solid-State MEMS DynamicVent, Enabling Active Ambient Control for Next-Generation TWS and Hearing Aids

Part of xMEMS Labs announcements at CES 2023, the innovative MEMS speaker company introduced Skyline, the world’s first discrete solid-state MEMS DynamicVent, a specific design with a valve that opens or closes by sensor fusion input from the earbud DSP and enables the benefits of both an open-fit (spatially aware) and closed-fit (occluded) earbud design. This enables smart TWS earbuds and hearing aids that create best-of-both-worlds user experiences in the same product.

Luxshare-ICT Selects USound as Strategical MEMS Speaker Supplier For Next-Generation TWS

November 28, 2022 by audioXpress Staff

Luxshare-ICT Selects USound as Strategical MEMS Speaker Supplier For Next-Generation TWS

Austrian MEMS piezoelectric microspeaker specialist USound announced an agreement with Luxshare-ICT, one of the largest manufacturers and supplier for global consumer electronics brands. Luxshare-ICT chose USound as its strategical MEMS speaker supplier for its new ultra-compact hybrid audio module intended to power next-generation innovative dual-driver true wireless stereo (TWS) earbuds. The new Luxshare-ICT audio TWS solution will be in mass production in 2023.

USound Introduces Ultra-Compact MEMS Audio Module for Hearables

August 4, 2022 by Joao Martins

USound Introduces Ultra-Compact MEMS Audio Module for Hearables

USound, the Austrian pioneer of MEMS speakers, announced the release of an audio module designed to enhance the performance of true wireless earbuds and hearing aids, enabling new degrees of design freedom. As USound underscores, with this new integrated solution, manufacturers can create more ergonomic and comfortable designs, with extended battery life and audio quality, while the form factor of hearing aids and TWS earbuds can be considerably reduced.

Bosch Sensortec Acquires MEMS Microspeaker Innovator Arioso Systems

April 28, 2022 by Joao Martins

Bosch Sensortec Acquires MEMS Microspeaker Innovator Arioso Systems

Bosch Sensortec announced the acquisition of Arioso Systems, the Fraunhofer IPMS spin-off company that developed its own innovative sound transducer principle for miniaturized MEMS microspeakers based on the patented Nanoscopic Electrostatic Drive (NED) principle. With this acquisition Bosch expands from MEMS microphones to the attractive market segment of silicon microspeakers, soon to be at the core of new generation true wireless hearables.

USound Announces Fully Integrated MEMS Audio Modules for True Wireless Earbuds

March 2, 2022 by Joao Martins

USound Announces Fully Integrated MEMS Audio Modules for True Wireless Earbuds

USound, the developer and manufacturer of micro-electro-mechanical systems (MEMS) speakers for personal devices and wearables, announced an expanded partnership with AT&S Austria Technologie & Systemtechnik, a manufacturer of high-end printed circuit boards and integrated circuit substrates, to manufacture USound’s new fully integrated audio module for True Wireless Earbuds (TWS). The new audio modules can be 75% smaller and 85% lighter, with improved sound quality, compared to current TWS solutions.

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