APDA-ALTI Education Symposium 2023. Three Days of Audio Product Knowledge

The Audio Product Development Alliance (APDA) in association with the Audio & Loudspeaker Technologies International (ALTI) Association, promotes a three day education symposium during the ALTI Expo & Conference 2023, June 11 - 13, 2023 at the DoubleTree by Hilton at the entrance to Universal, Orlando. Three days to improve your knowledge and skills in the development of audio products, from concept to delivery.

The traditional Audio & Loudspeaker Technologies International (ALTI) Association annual gathering has long been the highest quality networking event for any audio industry professional, particularly for brands, manufacturers and its suppliers. The upcoming ALTI-Expo and Conference 2023, will be held June 11-12 at the DoubleTree by Hilton at Universal Studios, in Orlando, FL, and will combine a highly focused exhibition with the largest ever conference program for audio product developers.

This article looks at the practical test and measurement of bone conduction technology, as used in product development for headsets and in-ear devices. It showcases new possibilities for manufacturers to better evaluate device performance, since no appropriate test equipment and methods were commercially available until now. The approach, complements a Head-and-Torso Simulator (HATS) with an actuator capable of generating structure-borne sound in the artificial ear. This way, a realistic simulation of the human structure-borne voice signal for in-ear headsets is possible.. This article was originally published in audioXpress, January 2023.

DSP Concepts launched TalkTogether, a fully-integrated solution focused on human-to-human communication. The new module for Audio Weaver allows brands to instantly add voice comms to any device - from a conference room speaker, to a gaming soundbar to a connected exercise device and more. Given the numerous possibilities, DSP Concepts is also opening up TalkTogether so developers can customize it to fit their precise needs, offering unprecedented design flexibility.

Knowles Corporation announced the IA8201, the latest product in its Knowles AISonic family of audio edge processors. The IA8201 offers robust voice activation and multi-microphone audio processing optimized for power-sensitive applications, and is the first processor specifically designed for advanced audio and machine learning applications, enhancing power-efficient intelligence and privacy at the network’s edge. This processor has the compute power to perform advanced audio output, context awareness and gesture control for today’s most advanced consumer electronics.

Maxim Integrated Products announced new MAX98357 and MAX98358 compact and cos-effective audio amplifiers, ideal for a wide variety of applications, including a plug-and-play solution for portable and smart speakers. Despite their ultra-small form factors, the MAX98357 and MAX98358 digital-input 3.2W Class D audio power amplifiers require only a single power supply and auto configure for 35 different clocking configurations and 128 digital audio formats.

Cadence Design Systems, announced the Cadence Tensilica HiFi 3z DSP IP core for system-on-chip (SoC) designs targeted for the latest mobile and home entertainment applications, including smartphones, augmented reality (AR)/3D goggles, digital TVs and set-top boxes (STBs). The new HiFi 3z architecture offers more than 1.3X better voice and audio processing performance than its predecessor, the HiFi 3 DSP, which leads the industry in the number of audio DSP cores shipped.