All items tagged with product development and ultra-low power (17)

Synaptics Launches Ultra-Low-Power Triple Combo Wireless SoC Family with Auracast

March 11, 2025 by Joao Martins

Synaptics Launches Ultra-Low-Power Triple Combo Wireless SoC Family with Auracast

Synaptics has extended its Veros Triple Combo connectivity portfolio with the launch of the latest SYN461x family of ultra-low-power Wi-Fi 2.4/5/6 GHz, Bluetooth 6.0, Bluetooth LE Audio with Auracast, and IEEE 802.15.4 (Zigbee/Thread) systems on chip (SoCs). Designed for embedded applications in Edge AI connected devices, the Veros SYN461x family is optimized for system integration, size, and rapid time to market.

Enabling Lossless Spatial Audio in Wireless Headphones Using Integrated Wi-Fi

November 13, 2024 by Joao Martins

Enabling Lossless Spatial Audio in Wireless Headphones Using Integrated Wi-Fi

InnoPhase IoT, a semiconductor company specializing in ultra-low power Wi-Fi, and GreenWaves Technologies, the company pioneering ultra-low power AI and DSP processors for hearables and connected devices, announced the development of a lossless audio reference design for Wi-Fi headphones. In collaboration with Danish pioneer IDUN Audio, InnoPhase and GreenWaves have created a platform that enables Spatial Audio for hearables and headphones with extended range and long battery life.

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

July 23, 2024 by audioXpress Staff

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

Ceva announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers. The Balletto family is a complete Edge AI/ML microcontroller solution for wireless audio and smart home connected products with integrated Bluetooth Low Energy 5.3 and 802.15.4 (Matter) wireless subsystem and a dedicated network co-processor, enabling connectivity and class leading machine learning performance in a single chip.

Dolphin Design Launches 12nm Silicon for Next-Generation Audio Devices

February 5, 2024 by Joao Martins

Dolphin Design Launches 12nm Silicon for Next-Generation Audio Devices

Dolphin Design, a leading supplier of high-performance analog, mixed-signal, processing intellectual property (IP) as well as ASIC design, has reached a significant milestone with the successful tape-out of its first TSMC 12nm FinFet test-chip containing its state-of-the-art audio IPs. This test chip is the first of its kind to offer a complete solution for audio designs combining high-performance, low-power in a minimal footprint.

GreenWaves Showcases World's First AI-Based Audio Solutions for the GAP9 Application Processor at CES 2024

December 19, 2023 by Joao Martins

GreenWaves Showcases World's First AI-Based Audio Solutions for the GAP9 Application Processor at CES 2024

GreenWaves Technologies will be at CES 2024 with an interesting showcase of AI for audio applications. The company's GAP9 advanced AI processor is in volume production, and GreenWaves will be able to show several solutions that are enabling market leading hearable products. Demonstrations include audio advanced source separation models, and active noise cancellation with neural network based acoustic scene detection, as well as immersive 3D sound.

Dolphin Design Unveils Innovative IP for Sound Classification Reducing Power Requirements by 99%

June 27, 2023 by audioXpress Staff

Dolphin Design Unveils Innovative IP for Sound Classification Reducing Power Requirements by 99%

Dolphin Design, a semiconductor designer of power management, audio, and processing devices with in-house ASIC design services, announced the launch of WhisperExtractor, a mixed-signal technology for voice and audio-enabled SoCs, enabling voice and sound classification at a record µW level power budget. The new technology paves the way to breakthrough always-on voice user interface, real time speech-to-text, and always-on sound detection.

SPARK Microsystems Receives CDN $48 Million Investment To Drive UWB Wireless Development

March 13, 2023 by Joao Martins

SPARK Microsystems Receives CDN $48 Million Investment To Drive UWB Wireless Development

SPARK Microsystems announced the closing of CDN $34 million Series B financing, with an additional CDN $14 million available subject to meeting operational milestones. Led by Idealist Capital, a prominent investment firm focused on the energy transition and decarbonization, the round includes existing investors Cycle Capital, Economic Development Canada (EDC), Real Ventures, and ND Capital. The new funding will drive mass market commercialization for ultra-energy efficient, UWB-based wireless electronic devices and sensors.

CEVA Introduces Voice User Interface Solution for TI SimpleLink Wi-Fi Wireless MCUs

November 15, 2022 by audioXpress Staff

CEVA Introduces Voice User Interface Solution for TI SimpleLink Wi-Fi Wireless MCUs

CEVA announced the availability of its WhisPro speech recognition and control software to support designs using the Texas Instruments (TI) SimpleLink Wi-Fi CC3235x wireless MCU family, bringing ultra-low power, robust voice user interface to connected devices. The WhisPro Software Development Kit (SDK) allows full project customization, including choice of wake words and voice commands, and runs entirely on-device, without the need for a network connection.

Bose to Launch New Wireless Earbuds Powered by Qualcomm S5 Audio SoC

September 2, 2022 by Joao Martins

Bose to Launch New Wireless Earbuds Powered by Qualcomm S5 Audio SoC

At IFA 2022 in Berlin, Qualcomm Technologies and Bose highlighted their continued collaboration during Cristiano Amon’s opening keynote. Bose is integrating Qualcomm wireless voice and music platforms across their portfolio of premium earbuds, headphones, speakers and soundbars. Qualcomm also confirmed that the new Bose QuietComfort Earbuds II, which are scheduled to be unveiled September 7, will be Powered by the new Qualcomm S5 Sound Platform.

Nordic Semiconductor Announces Its First Wi-Fi Chip

August 19, 2022 by Cristina Costa

Nordic Semiconductor Announces Its First Wi-Fi Chip

Following the acquisition of the Wi-Fi development team, core Wi-Fi expertise, and Wi-Fi IP tech assets of Imagination Technologies Group in 2020, Nordic Semiconductor announced its entry into the Wi-Fi wireless market with the introduction of the nRF7002, an ultra-low power, dual-band Wi-Fi 6 companion IC. The launch enables Nordic Semiconductor to offer all three of the world’s most popular wireless connectivity technologies: Bluetooth, Wi-Fi, and cellular, paving the way for new market opportunities.

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