All items tagged with product development and Tensilica HiFi DSP (9)

Analog Devices Presents New-Generation ADAU1797 Low Power Audio Processor at CES 2024

January 9, 2024 by Joao Martins

Analog Devices Presents New-Generation ADAU1797 Low Power Audio Processor at CES 2024

Analog Devices is now sampling its latest audio processor and low power ANC codec, the ADAU1797. This high-performance device with integrated HiFi 3z and FastDSP cores is able to efficiently support front-end audio processing with beamforming and noise reduction, as well as neural network-assisted speech recognition (ASR) processing. An ideal, low latency, low power, three times more powerful processor for true wireless stereo (TWS) ANC earbuds and headphones.

Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products

January 23, 2023 by audioXpress Staff

Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products

Fluent.ai announced an embedded voice recognition solution for True Wireless Stereo (TWS) and other hearable products running on the Cadence Tensilica HiFi 5 DSP in partnership with Airoha, a MediaTek subsidiary. The solution is part of an integration available on DSP Concepts’ Audio Weaver platform, which provides OEMs a rapid way to design and prototype audio features and capabilities.

DSP Concepts Launches TWS Toolkit Powered by Audio Weaver

March 4, 2022 by Joao Martins

DSP Concepts Launches TWS Toolkit Powered by Audio Weaver

DSP Concepts announced the availability of a new toolkit for True Wireless Stereo (TWS) earbuds powered by its Audio Weaver development platform. The toolkit features a reference design optimized to run on the Cadence Tensilica HiFi 5 DSP in partnership with Airoha, a MediaTek subsidiary and manufacturer of low-power TWS Systems on Chip (SoCs). The development kit also includes a reference design with a fully operational earbud prototype designed by Knowles.

Cadence Announces New Tensilica HiFi 1 DSP Optimized for Bluetooth LE Audio True Wireless Devices

October 29, 2021 by audioXpress Staff

Cadence Announces New Tensilica HiFi 1 DSP Optimized for Bluetooth LE Audio True Wireless Devices

Cadence Design Systems announced the new Cadence Tensilica HiFi 1 DSP, delivering increased voice- and music-processing performance with optimal neural network capability in a compact footprint with ultra-low energy, improving the user experience and extending battery life. The Tensilica HiFi 1 DSP is now the smallest and lowest power member of the HiFi DSP family, developed for battery-constrained applications, such as mobile, hearables, wearables, automotive, and connected devices.

Klippel and Nuvoton Unveil Smart Amplifier Solution with Integrated KCS Speaker Control Algorithm

August 21, 2020 by audioXpress Staff

Klippel and Nuvoton Unveil Smart Amplifier Solution with Integrated KCS Speaker Control Algorithm

Klippel announced an exciting cooperation with Nuvoton Technology, a leading provider of consumer-electronics and computer ICs from Taiwan, to release a new type of smart amplifier with integrated Klippel Controlled Sound (KCS) technology that compensates for nonlinear speaker responses. As a result of the project, Nuvoton developed the highly efficient mono Class D audio amplifier devices, NAU83G10 and NAU83G20. Both devices are now available.

NXP Announces Far-Field Offline Voice Control Solution In Collaboration with Sonos

February 26, 2020 by audioXpress Staff

NXP Announces Far-Field Offline Voice Control Solution In Collaboration with Sonos

NXP Semiconductors announced availability of its voice solution, SLN-LOCAL-IOT, a fully integrated development platform for offline voice control. The solution consists of a full hardware module design and associated software required to implement far-field voice control with a customizable wake word and local commands. NXP also announced market availability of the i.MX RT600 crossover microcontroller (MCU) family, ideal for ultra-low power audio and voice applications.

Alango Far-Field Voice Enhancement Package Now Available on NXP RT600 Processor

November 13, 2019 by audioXpress Staff

Alango Far-Field Voice Enhancement Package Now Available on NXP RT600 Processor

DSP processing software specialist firm, Alango has been working to port the company's Voice Enhancement Package (VEP) to the NXP i.MX RT600 cross-over processor family, which is optimized for 32-bit immersive audio applications combining a high-performance Cadence Tensilica Hi-Fi 4 audio DSP core with a next-generation Cortex-M33 core. VEP is a set of Alango proprietary far-field voice enhancement technologies developed to improve human to machine interaction in a variety of applications.

Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5 Dual-Mode Audio/Voice SoC

January 17, 2019 by audioXpress Staff

Optek Selects Cadence Tensilica HiFi 3 DSP for Bluetooth 5 Dual-Mode Audio/Voice SoC

Cadence Design Systems announced that Optek has selected the Cadence Tensilica HiFi 3 DSP for its latest OTK528X Bluetooth 5 dual-mode audio/voice system on chip (SoC). Optek’s customers can now take advantage of the HiFi DSP ecosystem for optimized audio, voice and artificial intelligence (AI) speech-based recognition processing software utilized in applications including hearables, wireless speakers, soundbars, on/in ear headphones, multi-channel AVRs, musical instruments, and voice user interface (VUI) devices.

Dialog Semiconductor’s SmartBeat SoC Enhances Jabra Engage Headset Series

May 3, 2018 by audioXpress Staff

Dialog Semiconductor’s SmartBeat SoC Enhances Jabra Engage Headset Series

Jabra turned to Dialog Semiconductor’s SmartBeat audio system-on-chip (SoC) for its newest range of Jabra Engage professional wireless headsets. As the first company to deploy Dialog’s SmartBeat DA14495 SoC, Jabra was able to make use of the SoC’s support for the DECT 1.9GHz standard, as well as a flexible audio API, to connect three times as many users as before with industry-leading call performance at a range of up to 490 feet.