All items tagged with product development and spatial audio (19)

xMEMS Labs and Merry Electronics Showcase Two-Way Headphone Reference Design at CES 2025

December 3, 2024 by Joao Martins

xMEMS Labs and Merry Electronics Showcase Two-Way Headphone Reference Design at CES 2025

Underscoring the potential of solid-state MEMS microspeakers over-the-ear headphones, xMEMS Labs and Merry Electronics announced they will demonstrate a new production-ready reference design at CES 2025. Targeting both premium wireless over-the-ear headphones and gaming applications, Merry highlights xMEMS’ patented 2-way module architecture as a way to improve spatial audio accuracy and reduce weight for gamers, among other benefits.

Enabling Lossless Spatial Audio in Wireless Headphones Using Integrated Wi-Fi

November 13, 2024 by Joao Martins

Enabling Lossless Spatial Audio in Wireless Headphones Using Integrated Wi-Fi

InnoPhase IoT, a semiconductor company specializing in ultra-low power Wi-Fi, and GreenWaves Technologies, the company pioneering ultra-low power AI and DSP processors for hearables and connected devices, announced the development of a lossless audio reference design for Wi-Fi headphones. In collaboration with Danish pioneer IDUN Audio, InnoPhase and GreenWaves have created a platform that enables Spatial Audio for hearables and headphones with extended range and long battery life.

Newauro Brings Smart Speakers Into the Immersive Audio Domain at CES 2024

January 4, 2024 by Joao Martins

Newauro Brings Smart Speakers Into the Immersive Audio Domain at CES 2024

In July 2022, the Saffelberg Investment group acquired all assets, teams and rights of AURO-3D and founded a new company, Newauro, with the intention to further support the growth of the format and technology suite across all markets. Based in Belgium like the original Auro Technologies company, Newauro announced that it's collaborating with Eastech to demonstrate its latest AURO-Scene virtual immersive audio technology at CES 2024.

Tymphany and Fraunhofer IIS Present Spatial Audio Reference Designs for Headphones and Speakers at CES 2024

January 2, 2024 by audioXpress Staff

Tymphany and Fraunhofer IIS Present Spatial Audio Reference Designs for Headphones and Speakers at CES 2024

Following the announcement that Tymphany partnered with the Fraunhofer Institute for Integrated Circuits (IIS) in Germany to provide new state-of-the-art spatial audio solutions to audio manufacturers, Tymphany now confirms that at the CES 2024 show in Las Vegas, the two companies will demonstrate new reference designs for both headphones and speakers. These demonstrations will take place at Suite #26336 of the Venetian.

Fraunhofer Cingo and upHear Now Integrated with Tymphany's Peerless Flow DSP

December 15, 2023 by Joao Martins

Fraunhofer Cingo and upHear Now Integrated with Tymphany's Peerless Flow DSP

The Fraunhofer Institute for Integrated Circuits (IIS), headquartered in Erlangen, Germany, and Tymphany have partnered to provide state-of-the-art spatial audio solutions to audio manufacturers. The two companies have worked together to integrate Fraunhofer's audio processing suites and audio technologies into Flow DSP, Tymphany's own DSP platform and design framework which allows creating immersive audio features in new audio products.

Sonical Partners with IDUN audio for Embedded Dynamic Spatial Audio

September 13, 2023 by Joao Martins

Sonical Partners with IDUN audio for Embedded Dynamic Spatial Audio

Sonical, the Headphone 3.0 pioneer based in San Mateo, CA, and IDUN audio, the leading-edge startup from Copenhagen, Denmark, specializing in dynamic spatial audio for headphones, have formalized a strategic partnership. The two companies have been cooperating since 2022, and IDUN audio was part of the Sonical CES 2023 demos, with its dynamic spatial audio software running on Sonical's headphone operating system CosmOS - enabling unsurpassed spatialization with fast head tracking.

TDK Redefines True Wireless Stereo Applications with VibeSense360 Solution Suite

May 4, 2023 by Joao Martins

TDK Redefines True Wireless Stereo Applications with VibeSense360 Solution Suite

TDK Corporation announced the availability of its InvenSense VibeSense360 TWS solution suite, previewed at CES 2023. VibeSense360 is a comprehensive portfolio of TDK hardware and software solutions designed to help solve some of the most complicated problems OEMs face when designing true wireless stereo (TWS) products with state-of-the-art features. On the hardware VibeSense360 includes the TWS-M601 6-axis IMU, and the TWS-M602 device, combining IMU, accelerometer and machine learning on-chip.

TDK Introduces New SmartSound MEMS Microphones and Development Platform Plus VibeSense360 Solution Suite for TWS Designs

January 13, 2023 by Joao Martins

TDK Introduces New SmartSound MEMS Microphones and Development Platform Plus VibeSense360 Solution Suite for TWS Designs

At CES 2023, TDK InvenSense introduced the T5838 and T5837 PDM MEMS microphones that offer 68 dBA SNR consuming only 130 µA in always-on mode and 330 µA in high-performance mode. The company also announced the new SmartSound One development platform that provides a plug-and-play evaluation interface for its MEMS microphones, and the new VibeSense360 hardware and software solution suite for advanced true wireless stereo features.

Qualcomm Announces Snapdragon Sound S5 and S3 Gen 2 Chipsets for Bluetooth LE Audio Products

November 17, 2022 by Joao Martins

Qualcomm Announces Snapdragon Sound S5 and S3 Gen 2 Chipsets for Bluetooth LE Audio Products

During its Snapdragon Summit 2022, Qualcomm unveiled the latest generation of Snapdragon processors and chips that will power mobile devices, wearables and countless consumer electronics and audio devices to be introduced in 2023. The Snapdragon S5 Gen 2, and the Snapdragon S3 Gen 2 Bluetooth audio chipsets are the evolution from the devices announced in 2022, designed to support Bluetooth LE Audio.

Fraunhofer Cingo Immersive Listening Now Available in Audio Weaver

July 11, 2022 by Joao Martins

Fraunhofer Cingo Immersive Listening Now Available in Audio Weaver

DSP Concepts announced that its Audio Weaver development platform for audio products now also offers access to the Fraunhofer Cingo family of immersive processing tools. The agreement with Fraunhofer IIS allows audio product developers to enhance headphones, earbuds and speakers with binaural audio processing for immersive 3D sound with head tracking, as well as enhance existing stereo content, including loudness optimization and equalization. Cingo supports all channel-based formats and direct rendering of audio objects with associated position metadata, which can be transmitted as MPEG-H Audio.

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