All items tagged with product development and security (10)

Virscient Collaborates With Infineon to Accelerate AIROC-based Wireless Design Development

August 3, 2023 by audioXpress Staff

Virscient Collaborates With Infineon to Accelerate AIROC-based Wireless Design Development

Virscient, announced a new strategic collaboration with Infineon to support customers' design-in of Infineon’s connectivity products. Under this agreement, Virscient will provide expert design and engineering services, and licensable software solutions to help innovative OEMs and platform vendors rapidly deliver products integrating Infineon's AIROC Wi-Fi + Bluetooth combo ICs – whether chip-down, or in modular form.

Infineon Introduces New AIROC Wi-Fi 6/6E and Bluetooth 5.2 Combo Devices for High-Quality Video and Audio Streaming

April 9, 2021 by Cristina Costa

Infineon Introduces New AIROC Wi-Fi 6/6E and Bluetooth 5.2 Combo Devices for High-Quality Video and Audio Streaming

Infineon Technologies expanded its wireless portfolio with new high-performance, reliable and secure devices. The newly developed AIROC brand now includes the industry’s first 1x1 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for enterprise and industrial applications, and its first 2x2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for multimedia, consumer and automotive applications. The new wireless connectivity combo devices deliver robust performance and minimal latency, making them ideal for high-quality video and audio streaming applications.

Nordic Semiconductor nRF5340 for Bluetooth 5.2 and LE Audio Applications Now Available

December 4, 2020 by audioXpress Staff

Nordic Semiconductor nRF5340 for Bluetooth 5.2 and LE Audio Applications Now Available

Nordic Semiconductor has announced that its nRF5340 high-end multiprotocol Bluetooth 5.2 System-on-Chip (SoC) has entered volume production. The world’s first dual Arm Cortex-M33 wireless SoC is now available and offers all the advanced features and security required for the next-generation of connected audio applications including LE Audio and advanced wearables. The new SoC is now widely commercially available through Nordic’s distribution network.

Universal Electronics and Microsoft Collaborate on a Turnkey Digital Assistant Platform for Smart Home Hub

January 4, 2019 by audioXpress Staff

Universal Electronics and Microsoft Collaborate on a Turnkey Digital Assistant Platform for Smart Home Hub

Universal Electronics (UEI), a company specializing in universal control and sensing technologies for the smart home, announced a collaboration with Microsoft to launch a new digital assistant platform for the home built on the Microsoft Azure cloud platform using AI and IoT services. The UEI’s Nevo Butler turnkey smart home hub with nevo.ai built-in digital assistant will be launched at CES 2019 and will be available as a white-label solution for other manufacturers.

Microchip Announces First 32-bit Low-Power MCU to Feature Robust, Chip-Level Security and Arm TrustZone Technology

June 26, 2018 by audioXpress Staff

Microchip Announces First 32-bit Low-Power MCU to Feature Robust, Chip-Level Security and Arm TrustZone Technology

Microchip announced the 32-bit SAM L10/L11 MCU families for low power and high security, based on the Arm Cortex-M23 core, with the SAM L11 featuring Arm TrustZone for Armv8-M, a programmable environment that provides hardware isolation between certified libraries, IP and application code. The SAM L11 features robust security with chip-level tamper resistance, secure boot and secure key storage. When combined with TrustZone technology, this is designed to protect applications from both remote and physical attacks.

Embedded World 2018 Confirms Record Attendance and Exhibitors Growth

March 2, 2018 by audioXpress Staff

Embedded World 2018 Confirms Record Attendance and Exhibitors Growth

In its closing report, NürnbergMesse confirmed that the 2018 edition of Embedded World - 26 - 28 February 2019, Nuremberg, Germany, has established a new record for the trade-show. Confirming more trade visitors, exhibitors and space, as well as a record 2.000 participants and speakers attending the annual conference sessions, Embedded World 2018 provided a clear sign of a positive momentum in all market segments for embedded electronics applications, with particular emphasis on IoT, industrial connected solutions and automotive.

Sierra Wireless Announces the Most Secure Wi-Fi and Bluetooth Combo Module with Integrated Cloud Services

October 13, 2017 by audioXpress Staff

Sierra Wireless Announces the Most Secure Wi-Fi and Bluetooth Combo Module with Integrated Cloud Services

Sierra Wireless announced the BX Series Wi-Fi and Bluetooth combo modules with built-in cloud services and security features. With Wi-Fi and Bluetooth support on a single common flexible form factor (CF3) module, the BX Series provides manufacturers the flexibility to migrate between short-range and cellular technologies, as well as future-proof their product designs, optimized for connected applications.

Sensory’s Fusion of Face and Voice Biometric Recognition Gets IQ Boost and Broader Mobile OS Support

May 22, 2017 by audioXpress Staff

Sensory’s Fusion of Face and Voice Biometric Recognition Gets IQ Boost and Broader Mobile OS Support

Speech and vision technologies specialist Sensory announced the second major update to TrulySecure, its FIDO Certified multimodal biometric authentication technology. TrulySecure quickly, conveniently and securely recognizes enrolled users through a fusion of face and voice biometric recognition technologies in less than a second, and differentiates individuals at a 99.999% accuracy rate – all without requiring any costly and space consuming biometric scanners.

Cypress Unveils Low Power MCU Architecture for Secure Devices

March 14, 2017 by Cristina Costa

Cypress Unveils Low Power MCU Architecture for Secure Devices

Cypress Semiconductor announced its newest microcontroller (MCU) PSoC 6 architecture that is purpose-built for the Internet of Things (IoT). The architecture is built on ultra-low-power 40-nm process technology, with integrated security features required for next-generation IoT devices. Featuring dual-core processing, the architecture fills a gap in the IoT solution space between power-hungry and higher-cost application processors and performance-challenged, single-core MCUs.

embedded world Exhibition and Conference 2016 Closes with New Records

March 1, 2016 by audioXpress Staff

embedded world Exhibition and Conference 2016 Closes with New Records

The biggest embedded world exhibition and conference ever, closed with new records. With 939 exhibitors and more than 30,000 trade visitors, the 2016 edition of the event, in Nuremberg, Germany, was again the place to be for the international embedded community - effectively influencing all current industry segments, including the audio industry.