All items tagged with product development and mobile devices (20)

Qualcomm Redefines True Wireless with Two New Snapdragon Sound Platforms

February 28, 2022 by Joao Martins

Qualcomm Redefines True Wireless with Two New Snapdragon Sound Platforms

At Mobile World Congress 2022 in Barcelona, Qualcomm announced new options for brands and developers to offer the latest technologies in wireless audio. Qualcomm announced the latest S5 and S3 Sound Platforms with support for new Snapdragon Sound experiences, featuring lossless CD-quality streaming over Bluetooth, stereo recording, ultra-low latency sound with in-game chat, and adaptive active noise cancellation. Both new platforms already offer support for Bluetooth LE Audio.

Microchip Announces Qi 1.3 Wireless Charging Reference Design

July 14, 2021 by audioXpress Staff

Microchip Announces Qi 1.3 Wireless Charging Reference Design

The Wireless Power Consortium (WPC) has recently released the Qi 1.3 specification that requires authentication for improved safety when transmitting up to 15W of power between a transmitter and a receiver. To meet the specification, Microchip Technology announced a new Qi 1.3 wireless charging reference design providing developers of wireless charging systems for automotive and consumer applications with the necessary tools and support for the seamless integration and certification of new-generation product designs.

TDK Announces T3902 Lowest-Power PDM MEMS Microphone

June 29, 2020 by audioXpress Staff

TDK Announces T3902 Lowest-Power PDM MEMS Microphone

TDK Corporation introduced the InvenSense T3902, which the company touts as the world’s lowest power Pulse Density Modulation (PDM) microphone for consumer devices. The new T3902 offers a high SNR of 64.5 dB, and high Acoustic Overload Point (AOP) of 120 dB in a very small package, optimized for mobile devices, wearables, headsets, TV remotes and more, supporting far-field communications, enabling clear audio capture in loud conditions, and ideal for voice recognition.

Qualcomm Introduces Mobile Wireless Connectivity Chips with 6 GHz Wi-Fi 6E and Bluetooth 5.2

May 29, 2020 by audioXpress Staff

Qualcomm Introduces Mobile Wireless Connectivity Chips with 6 GHz Wi-Fi 6E and Bluetooth 5.2

Qualcomm Technologies, launched a flagship portfolio of mobile connectivity systems that represent the most advanced Wi-Fi 6E offerings of their kind. Building upon the company's existing Wi-Fi 6 and Bluetooth audio solutions, the new Qualcomm FastConnect 6900 and Qualcomm FastConnect 6700 systems feature the fastest available Wi-Fi speeds in the industry (up to 3.6 Gbps) on a mobile Wi-Fi offering, low latency and the latest Bluetooth 5.2 advancements delivering improved audio experiences for classic and emerging LE Audio use cases.

Loudspeaker Failures and Protections (Part 1)

February 19, 2020 by Mike Klasco and Steve Tatarunis

Loudspeaker Failures and Protections (Part 1)

A new generation of effective and powerful speaker protection technology, using literally all the capabilities and power of pro sound rackmount loudspeaker management processors, is now being designed into mobile audio products that use very small loudspeakers. The implications are that mobile consumer electronics are going to play louder and sound better than ever. But to optimize speakers this way, we need to understand what causes loudspeakers to fail. This article was published originally in audioXpress, August 2013.

TDK Announces First MIPI Standard SoundWire MEMS Microphone

January 21, 2020 by audioXpress Staff

TDK Announces First MIPI Standard SoundWire MEMS Microphone

Among the many interesting demonstrations of new audio solutions for developers presented by TDK at CES 2020, the T5808 MIPI standard SoundWire microphone stands out as a "world's first," using the MIPI Alliance SoundWire compliant digital interface which allows bi-directional data flow. The T5808 is a multi-mode, low noise digital MEMS microphone in a small package, consisting of a MEMS microphone element and an impedance converter amplifier followed by a fourth-order Σ-Δ modulator.

MIPI I3C v1.1 Update for I2C Implementers Simplifies Development for Wearables and Connected Devices

January 20, 2020 by audioXpress Staff

MIPI I3C v1.1 Update for I2C Implementers Simplifies Development for Wearables and Connected Devices

The MIPI Alliance, the international organization that develops interface specifications for mobile and mobile-influenced industries, announced MIPI I3C v1.1, the first update to the interface that eliminates the historical pain points of I2C development. MIPI I3C v1.1 is a scalable, medium-speed, utility and control bus that connects peripherals to an application processor, streamlining integration and improving cost efficiencies in development.

ESS Technology Introduces Third-Generation ES9219 Headphone SoC for Mobile Devices

November 29, 2019 by audioXpress Staff

ESS Technology Introduces Third-Generation ES9219 Headphone SoC for Mobile Devices

Just a few short days after launching its new Sabre Smart Power-Amplifier (SPA), a new-generation device designed to boost the audio quality and efficiency of portable and wearable devices, ESS Technology announced the ES9219, the 3rd generation of Sabre DAC headphone System-on-Chip (SoC) solutions for mobile devices. The ES9219 Headphone SoC with 32-bit, QUAD DAC Technology and 2Vrms output adds crosstalk reduction and THD compensation while reducing BOM size and cost.

TDK Expands PiezoListen Lineup of Ultra-Thin Piezo Speakers with a Wider Dynamic Range

October 29, 2019 by audioXpress Staff

TDK Expands PiezoListen Lineup of Ultra-Thin Piezo Speakers with a Wider Dynamic Range

TDK Corporation has expanded its lineup of ultra-thin PiezoListen speakers with new types featuring a wider dynamic range and higher sound pressure level (SPL) in the low frequency range, even at voltages up to 24 VP-P. The PiezoListen series of piezo speakers now includes the PHUA6630 wide dynamic range speaker with an operating frequency range of 400 Hz to 20 kHz. Also new in the series are two new sound positioning speakers with an operating frequency range of 1000 Hz to 20 kHz.

Cirrus Logic Introduces Industry’s Smallest, Low-Power Boosted Smart Audio Amplifier to Support Global Shift to Mobile Stereo

February 19, 2019 by audioXpress Staff

Cirrus Logic Introduces Industry’s Smallest, Low-Power Boosted Smart Audio Amplifier to Support Global Shift to Mobile Stereo

To support the growing trend toward stereo audio in smartphones and portable devices, Cirrus Logic announced the new Cirrus Logic CS35L41 boosted smart power amplifier, based on 55nm process design. The new Class D amp delivers on the “big three” OEM requirements for mobile applications: enriched audio sound, efficient low-power management and a space-saving package. Featuring predictive algorithms, the power amp increases the audio volume when in speakerphone mode, while reducing noise and power consumption.

«
1
2
»