All items tagged with product development and home entertainment (7)

July 25, 2023 by Joao Martins

WiSA Launches New Tools for Implementing, Managing and Testing WiSA-Enabled Products

WiSA Technologies announced two new tools designed to streamline the development and manufacturing of WiSA E (Embedded) and WiSA DS (Discrete System) implementations. The new WiSA Server, in combination with the new Product Support Engineering Tool (PEST), enable faster time-to-market as well as comprehensive management of testing and other aspects of the manufacturing process.

DSP Concepts Adds THX Spatial Audio to Audio Weaver Development Platform

June 3, 2021 by Joao Martins

DSP Concepts Adds THX Spatial Audio to Audio Weaver Development Platform

With the audio industry apparently determined to push forward the evolution towards spatial audio reproduction, manufacturers need tools to add the experience to their new product designs. Starting now, brands building on Audio Weaver can easily deploy THX Spatial Audio to bring immersive sound home entertainment devices to market. The partnership adds valuable new IP to DSP Concepts's library of 500 market-proven Audio Weaver modules.

ESS Technology Announces First High-Performance 8-Channel DAC with Built-In 2Vrms Line Drivers

December 11, 2020 by audioXpress Staff

ESS Technology Announces First High-Performance 8-Channel DAC with Built-In 2Vrms Line Drivers

ESS Technology announced their newest addition to the SABRE audio series of DACs, the ES9080 8-channel DAC with built-in 2Vrms, ground centered line drivers. The new ESS SABRE ES9080Q DAC simplifies multichannel line level setups with best-in-class performance integrated into one small package. According to the audio semiconductor manufacturer, the 32-bit 8-channel DAC is an ideal platform for the consumer home entertainment market, delivering improved audio specifications with streaming media applications.

STMicroelectronics and DSP Concepts Deliver All-In-One Amazon-Qualified Far-Field Voice Reference Design

November 18, 2020 by audioXpress Staff

STMicroelectronics and DSP Concepts Deliver All-In-One Amazon-Qualified Far-Field Voice Reference Design

STMicroelectronics has released an Amazon-qualified reference design package for smart connected devices leveraging Amazon AVS voice integration, which can be used to create Alexa Built-in products using simple microcontrollers (MCUs). The new reference design eases development of natural-language understanding and voice-based user interaction for smart-home devices and smart appliances, featuring an improved audio front end created with DSP Concepts for far-field audio detection.

Universal Electronics and Microsoft Collaborate on a Turnkey Digital Assistant Platform for Smart Home Hub

January 4, 2019 by audioXpress Staff

Universal Electronics and Microsoft Collaborate on a Turnkey Digital Assistant Platform for Smart Home Hub

Universal Electronics (UEI), a company specializing in universal control and sensing technologies for the smart home, announced a collaboration with Microsoft to launch a new digital assistant platform for the home built on the Microsoft Azure cloud platform using AI and IoT services. The UEI’s Nevo Butler turnkey smart home hub with nevo.ai built-in digital assistant will be launched at CES 2019 and will be available as a white-label solution for other manufacturers.

Foxconn, Innovo Audio Designs, and System Audio Join Wireless Speaker and Audio Association

November 8, 2018 by audioXpress Staff

Foxconn, Innovo Audio Designs, and System Audio Join Wireless Speaker and Audio Association

The Wireless Speaker and Audio Association (WiSA), an industry group comprised of over 40 leading brands including founding member Summit Wireless Technologies, announced Foxconn Technology Group, Innovo Audio Designs and System Audio as its newest members. The strong and growing list of WiSA members is largely driven by the Association’s WiSA Ready platform and its recently revitalized leadership.

Cadence Announces Tensilica HiFi 3z DSP Architecture with Enhanced Voice and Audio Processing Performance

July 27, 2017 by audioXpress Staff

Cadence Announces Tensilica HiFi 3z DSP Architecture with Enhanced Voice and Audio Processing Performance

Cadence Design Systems, announced the Cadence Tensilica HiFi 3z DSP IP core for system-on-chip (SoC) designs targeted for the latest mobile and home entertainment applications, including smartphones, augmented reality (AR)/3D goggles, digital TVs and set-top boxes (STBs). The new HiFi 3z architecture offers more than 1.3X better voice and audio processing performance than its predecessor, the HiFi 3 DSP, which leads the industry in the number of audio DSP cores shipped.