Cypress Streamlines Connected Designs with New Turnkey Development Platform

Cypress Semiconductor announced a new version of its development platform for the Internet of Things (IoT) and consumer electronics that enables wireless connectivity in minutes. The Wireless Internet Connectivity for Embedded Devices (WICED) Studio 4 platform provides a single development environment for multiple wireless technologies, including Cypress's Wi-Fi, Bluetooth and combo solutions, with an easy-to-use application programming interface.

Microchip Technology released a new generation of 8-bit tinyAVR MCUs. The four new devices range from 14 to 24 pins and 4 KB to 8 KB of Flash and are the first tinyAVR microcontrollers to feature Core Independent Peripherals (CIPs). The new devices will be supported by Atmel START, an innovative online tool for intuitive, graphical configuration of embedded software projects.

Connect One introduced the first Wi-Fi module in its next-generation family of 802.11b/g/n Wi-Fi modules for the Internet of Things (IoT) market at the electronica 2016 show in Munich, Germany. The new Pico WiReach IoT Wi-Fi module is a small size, sub $10 price, highly secure and cloud ready development solution which is ready to power new-generation connected devices.

Silicon Labs has introduced the industry’s smallest Bluetooth low energy system-in-package (SiP) module with a built-in chip antenna, offering a complete, cost-effective connectivity solution with no compromises in performance. Available in a tiny 6.5 mm x 6.5 mm package, the BGM12x Blue Gecko SiP module enables developers to miniaturize IoT designs by minimizing the PCB footprint including the antenna clearance area to 51 mm2.

Anyone involved in product development, design, and production needs to attend the electronica 2016 trade-show, November 8-11. The 27th International Trade Fair for Electronic Components, Systems and Applications, will be the largest ever, featuring an additional hall to occupy a total of 13 halls at the Messe München trade-fair center, and offering even more presentations on current industry trends, such as embedded systems, connectivity, automotive electronics, home automation, smart grids, and IoT.