All items tagged with product development and Bluetooth LE (16)

Silicon Labs Unveils BG29 Bluetooth LE Wireless SoC for Miniature Devices

March 12, 2025 by audioXpress Staff

Silicon Labs Unveils BG29 Bluetooth LE Wireless SoC for Miniature Devices

Silicon Labs announced its new Series 2 BG29 family of wireless SoCs, designed to bring high compute and connectivity to the smallest form factor Bluetooth Low Energy (LE) devices without compromising performance. A highly efficient, high memory, low-power, and ultra compact SoC designed for secure and high performance wireless networking applications, this new BG29 SoC is ideal for today's most intensive Bluetooth LE applications in wearables, health and medical devices, asset trackers, and battery-powered sensors.

Silicon Labs Introduces BG22L and BG24L "Lite" Bluetooth LE SoCs

January 31, 2025 by audioXpress Staff

Silicon Labs Introduces BG22L and BG24L "Lite" Bluetooth LE SoCs

Silicon Labs introduced the BG22L and BG24L SoCs for Bluetooth LE connectivity, with "L" representing the new application-optimized Lite devices. These new ultra-low power Bluetooth devices are optimized for applications like asset tracking tags, remote control, and small appliances. The BG22L delivers robust security and processing for common Bluetooth devices, while BG24L supports advanced AI/ML acceleration and Channel Sounding.

Nordic Semiconductor Launches Next-Generation nRF54L Series Wireless SoCs

November 12, 2024 by Joao Martins

Nordic Semiconductor Launches Next-Generation nRF54L Series Wireless SoCs

The nRF54L wireless SoCs are one of the biggest product launches of the electronica 2024 show in Munich, and they redefine once again Nordic Semiconductor’s lead in ultra-low power wireless for connected devices. The new nRF54L Series includes the previously announced nRF54L15, and the new nRF54L10 and nRF54L05 wireless SoCs. This advanced product series offers significantly enhanced efficiency, exceptional processing power, and versatile design options to meet a growing range of Bluetooth LE applications, including LE Audio and Auracast products.

Ellisys Bluetooth Vanguard Advanced Protocol Analysis System Supports Next-Gen Bluetooth Features

May 29, 2024 by audioXpress Staff

Ellisys Bluetooth Vanguard Advanced Protocol Analysis System Supports Next-Gen Bluetooth Features

Ellisys, a leading provider of protocol test, analysis, and qualification solutions for Bluetooth technology, Universal Serial Bus (USB), and other wired and wireless technologies, announced pre-standard support for several upcoming, unreleased major Bluetooth technological advancements. The company's Vanguard all-in-one Bluetooth protocol analysis system now supports High Data Throughput, Higher Bands, and Channel Sounding capabilities.

Nordic Semiconductor Offers Wireless Audio Solution for Battery-Powered High Quality Designs

November 20, 2023 by audioXpress Staff

Nordic Semiconductor Offers Wireless Audio Solution for Battery-Powered High Quality Designs

Nordic Semiconductor has revealed that Yinzida Technology, a consumer electronics manufacturer, has designed a 2.4GHz wireless audio transmission module that enables high fidelity wireless audio in applications such as microphones, musical instruments or audio headsets. This out-of-the-box, lossless and stable wireless audio solution is ideal for battery-powered designs with zero-delay DSP pipeline, using Nordic's nRF52832 SoC in both transmitter and receiver.

STMicroelectronics Simplifies Wireless Product Development With Certified STM32WB1MMC Bluetooth LE Module

March 16, 2023 by audioXpress Staff

STMicroelectronics Simplifies Wireless Product Development With Certified STM32WB1MMC Bluetooth LE Module

The new STM32 Bluetooth wireless module from STMicroelectronics lets designers access the advantages of ST’s dual core STM32WB microcontrollers (MCUs), especially in projects intended for low-to-medium production volumes. The module simplifies development and accelerates time to market, combining Bluetooth Low Energy 5.3 certification and worldwide radio-equipment approvals with the STM32Cube ecosystem support.

Silicon Labs Extends Portfolio for Matter and Wi-Fi at Developer Conference

September 16, 2022 by Joao Martins

Silicon Labs Extends Portfolio for Matter and Wi-Fi at Developer Conference

Silicon Labs announced a slate of new multiprotocol connectivity products that are driven by interoperability, advancing innovations in the Internet of Things and Smart Home, including Matter and Wi-Fi 6. Standing out among the announcements is the new low power SiWx917 Wi-Fi 6 and Bluetooth LE combination SoC that Silicon Labs says is Matter-ready. The SoC includes an integrated applications processor, and is ideal for battery-powered or energy-efficient connected devices with always-on cloud connectivity.

Texas Instruments Announces Affordable CC2340 Bluetooth LE Wireless MCUs

June 22, 2022 by audioXpress Staff

Texas Instruments Announces Affordable CC2340 Bluetooth LE Wireless MCUs

Texas Instruments expanded its connectivity portfolio with a new family of wireless microcontrollers (MCU) that enable high-quality Bluetooth Low Energy (LE) at half the price of typical competing devices. Featuring best-in-class standby current and radio-frequency (RF) performance, the SimpleLink Bluetooth LE CC2340 family is priced to start as low as $0.79, making it affordable for engineers to add Bluetooth LE connectivity to more products.

Renesas Develops World's Smaller and Lower Power Bluetooth Low Energy RF Transceiver

February 25, 2022 by audioXpress Staff

Renesas Develops World's Smaller and Lower Power Bluetooth Low Energy RF Transceiver

Renesas Electronics announced the development of two 2.4 GHz RF transceiver technologies that support the Bluetooth Low Energy (LE) low-power, near-field communication standard. The new technologies also achieve a smaller mounting area and better power efficiency. Renesas presented these technologies at International Solid-State Circuits Conference 2022 (ISSCC 2022), held between February 20 and 24 in San Francisco.

Infineon Expands Support to Matter Smart Home Designs With New AIROC Bluetooth LE and 802.15.4 Low-Power SoC Solution

December 17, 2021 by audioXpress Staff

Infineon Expands Support to Matter Smart Home Designs With New AIROC Bluetooth LE and 802.15.4 Low-Power SoC Solution

Infineon announced the launch of the new AIROC Bluetooth LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market. Infineon’s new AIROC CYW30739 Bluetooth LE and 802.15.4 system on chip (SoC) is offered as a reliable, secure and scalable solution to connect low-power devices in the smart home. To further demonstrate the company’s commitment to Matter, Infineon expanded its role with the Connectivity Standards Alliance (CSA) by joining the Alliance’s Board of Directors as a Promoter Member.

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