Infineon Expands Support to Matter Smart Home Designs With New AIROC Bluetooth LE and 802.15.4 Low-Power SoC Solution

December 17 2021, 00:50
Infineon Technologies announced the launch of the new AIROC Bluetooth LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market. Infineon’s new AIROC CYW30739 Bluetooth LE and 802.15.4 system on chip (SoC) is offered as a reliable, secure and scalable solution to connect low-power devices in the smart home. To further demonstrate the company’s commitment to Matter, Infineon expanded its role with the Connectivity Standards Alliance (CSA) by joining the Alliance’s Board of Directors as a Promoter Member.
 

The IEEE 802.15.4 technical standard is the foundation for Matter, the industry's largest and more widely supported open source for smart interoperability, simplify development for manufacturers, and increase compatibility for consumers. This collaborative breakthrough is built on proven technologies and guided by the Connectivity Standards Alliance (formerly Zigbee Alliance). IEEE 802.15.4 defines the operation of low-rate wireless personal area networks (LR-WPANs) and was the basis for the Zigbee, ISA100.11a, WirelessHART, MiWi, 6LoWPAN, Thread and SNAP specifications.

The combination of complementary Bluetooth LE and 802.15.4 protocols enhances the performance of smart home products with seamless interoperability, while enabling end-to-end encrypted communication between individual devices in a Matter network. Infineon decided to expand its wireless portfolio to support Matter with multiprotocol solutions and the new AIROC CYW30739 SoC features a low-power radio, which is a key component in low-power multiprotocol systems with rock solid connectivity. 

More importantly, it offers superior RF performance for robust connections and best user-experience without connection drops. The low-power consumption supports applications that require extended battery life including smart home, smart building, smart lighting and more. These design techniques and process technology are extremely efficient to help reduce active and idle power.

The new Infineon AIROC CYW30739 offers -95.5dBm LE Rx and -103.5dBm 802.15.4 sensitivity for reliable, long-range Bluetooth and multi-protocol connectivity. This smart coexistence creates a seamless interaction between a plethora of connected devices, ultimately providing a better user experience with the smart home. The integrated 96-MHz Arm Cortex-M4 microcontroller unit with floating point unit delivers high-performance computing as well as a highly optimized memory system across flash, RAM, and ROM.
 

"With the launch of the AIROC CYW30739 Bluetooth LE & 802.15.4 SoC, Infineon is entering the 802.15.4 market to deliver high-performing, low-power solutions with seamless, secure connectivity to enable more convenient, energy efficient smart homes," says Sonal Chandrasekharan, Vice President of the Bluetooth product line at Infineon. "Infineon is excited to enter this market with Matter-ready products across our wireless portfolio."

Infineon already offers a comprehensive wireless portfolio of devices to support Matter including the company’s AIROC Wi-Fi, AIROC Bluetooth and 802.15.4, and PSoC 6 MCU products. Developers can accelerate the deployment of Matter products by accessing Infineon’s software support for Matter in the open-source Matter repository, and additional Matter-specific capabilities in Infineon’s ModusToolbox Software and Tools. The latest version of ModusToolbox is available now for download. More information about Infineon’s support for Matter is available here.
www.buildwithmatter.com
www.infineon.com
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