All items tagged with Matter (39)

Synaptics Launches Ultra-Low-Power Triple Combo Wireless SoC Family with Auracast

March 11, 2025 by Joao Martins

Synaptics Launches Ultra-Low-Power Triple Combo Wireless SoC Family with Auracast

Synaptics has extended its Veros Triple Combo connectivity portfolio with the launch of the latest SYN461x family of ultra-low-power Wi-Fi 2.4/5/6 GHz, Bluetooth 6.0, Bluetooth LE Audio with Auracast, and IEEE 802.15.4 (Zigbee/Thread) systems on chip (SoCs). Designed for embedded applications in Edge AI connected devices, the Veros SYN461x family is optimized for system integration, size, and rapid time to market.

STMicroelectronics Reveals New STM32 Ultra-Low Power MCUs and Wireless Microcontrollers

March 5, 2025 by Joao Martins

STMicroelectronics Reveals New STM32 Ultra-Low Power MCUs and Wireless Microcontrollers

STMicroelectronics has introduced new STM32U3 microcontrollers (MCUs) with power-saving innovations that ease deployment of smart connected devices, especially in remote locations. The company has also unveiled the next generation of its STM32 power-efficient short-range wireless microcontrollers that simplify connecting consumer and industrial devices. The two new MCUs leverage near-threshold chip design to set a record performance-per-watt efficiency benchmark.

Silicon Labs Introduces New Concurrent Multiprotocol SoCs for Matter

March 3, 2025 by Joao Martins

Silicon Labs Introduces New Concurrent Multiprotocol SoCs for Matter

Silicon Labs announced that its MG26 family of wireless SoCs is now generally available and ready to provide developers with the highest performance for smart home applications, while leveraging AI/ML processing capabilities. The company calls it the industry’s most advanced, high-performance Matter and concurrent multiprotocol SoCs to date, with double the Flash and RAM of other Silicon Labs multiprotocol devices and best-in-class security.

Synaptics Announces New Dual-Core Bluetooth 5.4 and Matter Veros SoC

December 16, 2024 by Joao Martins

Synaptics Announces New Dual-Core Bluetooth 5.4 and Matter Veros SoC

Synaptics expanded its Veros family of connectivity devices with the SYN20708 dual-core system on chip (SoC) for Bluetooth 5.4 and IEEE 802.15.4. The Matter-compliant SoC supports Bluetooth (BT) Classic, Bluetooth Low Energy (BLE), Zigbee, and Thread protocols concurrently on both cores, allowing simultaneous connections to multiple endpoints in heterogeneous network environments, with overall lower system cost.

STMicroelectronics Introduces First STM32 Wireless Module Leveraging Collaboration with Qualcomm

December 10, 2024 by Cristina Costa

STMicroelectronics Introduces First STM32 Wireless Module Leveraging Collaboration with Qualcomm

STMicroelectronics introduced the first result of its strategic collaboration with Qualcomm Technologies to simplify development of next-generation STM32-based wireless solutions. The new ST67W611M1 modules combine Wi-Fi6, Bluetooth 5.3 and Thread connectivity to accelerate development of advanced consumer wireless solutions. Applications in home audio and smart home, powered by edge AI are a natural use case.

Alif Semiconductor Now Sampling BLE and Matter Wireless Microcontroller with Neural Co-Processor for AI/ML Workloads

November 7, 2024 by Cristina Costa

Alif Semiconductor Now Sampling BLE and Matter Wireless Microcontroller with Neural Co-Processor for AI/ML Workloads

The Balletto Bluetooth MCU family was announced by Alif Semiconductor in April 2024, and the company is now sampling its development kit, the DK-B1, to enable rapid prototyping of products that require ultra-low power Bluetooth Low Energy or 802.15.4 wireless connectivity. The MCU is also the world's first BLE/Matter solution to feature a DSP engine and an NPU for efficient hardware acceleration of AI/ML workloads.

Synaptics Launches Veros High-Performance Wireless Combo SoCs

October 17, 2024 by audioXpress Staff

Synaptics Launches Veros High-Performance Wireless Combo SoCs

Synaptics launched the Veros Seamless Intelligent Connectivity brand with two high-performance systems on chip (SoCs) for Wi-Fi 6E, Bluetooth, and 802.15.4. The two new wireless combo chips from Synaptics, the SYN4383 triple combo (Wi-Fi/Bluetooth/802.15.4) and tri-band (2.4GHz, 5GHz, 6GHz ), and the SYN43756E, also a multi-protocol, tri-band solution that offers a cost-effective version aimed at products not requiring 802.15.4 support, enable product developers to integrate essential wireless protocols including Bluetooth LE Audio.

STMicroelectronics and Qualcomm Enter Strategic Collaboration for Edge AI Wireless Connected Devices

October 1, 2024 by Cristina Costa

STMicroelectronics and Qualcomm Enter Strategic Collaboration for Edge AI Wireless Connected Devices

STMicroelectronics and Qualcomm Technologies International, announces a new strategic collaboration for the next generation of industrial and consumer connected solutions augmented by edge AI. The collaboration will pair STMicroelectronics' STM32 microcontroller ecosystem and Qualcomm's wireless connectivity solutions to allow simple, fast, and cost-effective designs of next-generation connected applications.

Nordic Semiconductor Introduces Smaller nRF7002 Wi-Fi 6 Companion IC for Compact Designs

August 14, 2024 by Cristina Costa

Nordic Semiconductor Introduces Smaller nRF7002 Wi-Fi 6 Companion IC for Compact Designs

Nordic Semiconductor announced the launch of a Wafer-Level Chip Scale Package (WLCSP) version of its nRF7002 Wi-Fi 6 Companion IC. The new package option offers the same functionality as the nRF7002 QFN variant but with a footprint reduction of over 60 percent - making the WLCSP the ideal choice for efficient, size-constrained designs for next-generation wireless devices.

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

July 23, 2024 by audioXpress Staff

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

Ceva announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers. The Balletto family is a complete Edge AI/ML microcontroller solution for wireless audio and smart home connected products with integrated Bluetooth Low Energy 5.3 and 802.15.4 (Matter) wireless subsystem and a dedicated network co-processor, enabling connectivity and class leading machine learning performance in a single chip.

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