All items tagged with Matter (33)

Synaptics Launches Veros High-Performance Wireless Combo SoCs

October 17, 2024 by audioXpress Staff

Synaptics Launches Veros High-Performance Wireless Combo SoCs

Synaptics launched the Veros Seamless Intelligent Connectivity brand with two high-performance systems on chip (SoCs) for Wi-Fi 6E, Bluetooth, and 802.15.4. The two new wireless combo chips from Synaptics, the SYN4383 triple combo (Wi-Fi/Bluetooth/802.15.4) and tri-band (2.4GHz, 5GHz, 6GHz ), and the SYN43756E, also a multi-protocol, tri-band solution that offers a cost-effective version aimed at products not requiring 802.15.4 support, enable product developers to integrate essential wireless protocols including Bluetooth LE Audio.

STMicroelectronics and Qualcomm Enter Strategic Collaboration for Edge AI Wireless Connected Devices

October 1, 2024 by Cristina Costa

STMicroelectronics and Qualcomm Enter Strategic Collaboration for Edge AI Wireless Connected Devices

STMicroelectronics and Qualcomm Technologies International, announces a new strategic collaboration for the next generation of industrial and consumer connected solutions augmented by edge AI. The collaboration will pair STMicroelectronics' STM32 microcontroller ecosystem and Qualcomm's wireless connectivity solutions to allow simple, fast, and cost-effective designs of next-generation connected applications.

Nordic Semiconductor Introduces Smaller nRF7002 Wi-Fi 6 Companion IC for Compact Designs

August 14, 2024 by Cristina Costa

Nordic Semiconductor Introduces Smaller nRF7002 Wi-Fi 6 Companion IC for Compact Designs

Nordic Semiconductor announced the launch of a Wafer-Level Chip Scale Package (WLCSP) version of its nRF7002 Wi-Fi 6 Companion IC. The new package option offers the same functionality as the nRF7002 QFN variant but with a footprint reduction of over 60 percent - making the WLCSP the ideal choice for efficient, size-constrained designs for next-generation wireless devices.

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

July 23, 2024 by audioXpress Staff

Ceva Bluetooth LE and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor’s Balletto Family of MCUs

Ceva announced that Alif Semiconductor has licensed and deployed the Ceva-Waves Bluetooth Low Energy and 802.15.4 IPs in its Balletto family of wireless microcontrollers. The Balletto family is a complete Edge AI/ML microcontroller solution for wireless audio and smart home connected products with integrated Bluetooth Low Energy 5.3 and 802.15.4 (Matter) wireless subsystem and a dedicated network co-processor, enabling connectivity and class leading machine learning performance in a single chip.

LG Acquires Dutch Startup Athom to Accelerate its AI-Enabled Smart-Home Ecosystem

July 9, 2024 by Joao Martins

LG Acquires Dutch Startup Athom to Accelerate its AI-Enabled Smart-Home Ecosystem

The story was out for a few days, but now it's officially confirmed that LG Electronics recently acquired an 80 percent stake in Athom, the Dutch smart home company based in Enschede, Netherlands. Known for its Homey smart home platform, the startup was struggling and lacked the scale that LG will provide. The agreement includes plans for LG to acquire the remaining 20 percent within the next three years. LG will maintain Athom as a separate operation, while expanding its own open smart home ecosystems globally.

Teledyne LeCroy's Frontline X500e Wireless Sniffer Captures Wi-Fi 7, Bluetooth, and 802.15.4 Traffic Simultaneously

April 12, 2024 by Joao Martins

Teledyne LeCroy's Frontline X500e Wireless Sniffer Captures Wi-Fi 7, Bluetooth, and 802.15.4 Traffic Simultaneously

Teledyne LeCroy is enabling the development of the latest wireless devices and connected applications with the launch of the Frontline X500e wireless protocol analyzer with Wi-Fi 7. For any application involving Bluetooth, Wi-Fi, 802.15.4-based technologies (including Matter, Thread, and Zigbee), or wired interfaces such as HCI-UART, USB, SPI, and Audio I2S, the X500e delivers precise insights for network professionals.

Ceva Accelerates Enhanced Connectivity with Multiprotocol Wireless Platform IP Family

April 8, 2024 by audioXpress Staff

Ceva Accelerates Enhanced Connectivity with Multiprotocol Wireless Platform IP Family

Ceva announced Ceva-Waves Links, a new family of multiprotocol wireless platform IPs that delivers fully integrated connectivity solutions with Wi-Fi, Bluetooth, UWB, Thread, Zigbee, and Matter, simplifying development and accelerating time to market for next generation, connectivity-rich, MCUs and SoCs. Ceva-Waves Links100, a connectivity platform IP with RF implemented on TSMC 22nm is currently being deployed by a leading OEM in connected devices.

Realtek Showcases Switchable Wi-Fi/Bluetooth Audio Solution at 2024 AWE China Expo

March 13, 2024 by Joao Martins

Realtek Showcases Switchable Wi-Fi/Bluetooth Audio Solution at 2024 AWE China Expo

Under the theme of "Realtek AI Changing the Future," the Taiwan semiconductor company will exhibit at the AWE China Expo (March 14-17, 2024), at the Shanghai New International Expo Centre (SNIEC). Showcasing the possibilities of AI in connected applications, Realtek will present a hybrid AIoT Audio SoC that supports both dual‑band Wi‑Fi 6 (2.4GHz/5GHz) and dual-mode Bluetooth 5.2 to enable low-latency, high resolution audio playback applications.

STMicroelectronics Introduces Secure Wireless Microcontrollers Supporting Matter and Bluetooth LE Audio

March 6, 2024 by Cristina Costa

STMicroelectronics Introduces Secure Wireless Microcontrollers Supporting Matter and Bluetooth LE Audio

STMicroelectronics has revealed the next generation of its short-range wireless microcontrollers. These innovative, all-in-one components enable advanced smart home and audio applications, with more miniaturized, efficient, secure and affordable designs. The new STM32WBA ecosystem offers full support and integration of Bluetooth Low Energy 5.4, Zigbee, and Thread stacks, and enables new LE Audio and Auracast applications.

Matter 1.2 Arrives with Nine New Device Types & Improvements

October 23, 2023 by Joao Martins

Matter 1.2 Arrives with Nine New Device Types & Improvements

The Connectivity Standards Alliance (CSA) just announced the second update to Matter, version 1.2, now available for device makers and platforms to build into their products. The update is packed with nine new device types, revisions, and additions to existing categories, core improvements to the specification and SDK, and certification and testing tools. The Matter 1.2 certification program is now open and members expect to bring these enhancements and new device types to market later this year and into 2024 and beyond.

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