All items tagged with product development and audio processing (35)

Alango Unveils Sound Processing Module for Qualcomm S7 SoC

November 4, 2024 by Joao Martins

Alango Unveils Sound Processing Module for Qualcomm S7 SoC

Alango Technologies announced a new digital sound processing module for Qualcomm's Bluetooth SoCs, including the latest S7 Gen1 Sound platform that features five times the compute power, three times the DSP processing power, and almost 100 times on-device AI processing power compared to previous solutions. According to Alango, this first to market platform offers a pre-integrated, ready-to-use modular solution for the latest generation of hearables and advanced audio designs.

Ceva and Edge Impulse Join Forces to Enable Faster Development of Edge AI Applications

September 24, 2024 by audioXpress Staff

Ceva and Edge Impulse Join Forces to Enable Faster Development of Edge AI Applications

Ceva and Edge Impulse announced a collaboration to rapidly develop, train and deploy advanced embedded machine learning (ML) applications on Ceva's neural processing units with cycle-accurate performance, even before physical hardware is available. This first-of-its-kind collaboration based around Ceva's NPU IP ensures that developers can accurately benchmark and refine the performance of their edge AI models using Edge Impulse's platform, significantly accelerating the time-to-market.

Tymphany and Fraunhofer IIS Present Spatial Audio Reference Designs for Headphones and Speakers at CES 2024

January 2, 2024 by audioXpress Staff

Tymphany and Fraunhofer IIS Present Spatial Audio Reference Designs for Headphones and Speakers at CES 2024

Following the announcement that Tymphany partnered with the Fraunhofer Institute for Integrated Circuits (IIS) in Germany to provide new state-of-the-art spatial audio solutions to audio manufacturers, Tymphany now confirms that at the CES 2024 show in Las Vegas, the two companies will demonstrate new reference designs for both headphones and speakers. These demonstrations will take place at Suite #26336 of the Venetian.

Fraunhofer Cingo and upHear Now Integrated with Tymphany's Peerless Flow DSP

December 15, 2023 by Joao Martins

Fraunhofer Cingo and upHear Now Integrated with Tymphany's Peerless Flow DSP

The Fraunhofer Institute for Integrated Circuits (IIS), headquartered in Erlangen, Germany, and Tymphany have partnered to provide state-of-the-art spatial audio solutions to audio manufacturers. The two companies have worked together to integrate Fraunhofer's audio processing suites and audio technologies into Flow DSP, Tymphany's own DSP platform and design framework which allows creating immersive audio features in new audio products.

BdSound and Vivoka Join Forces to Boost the World of Voice Assistants

October 24, 2023 by Joao Martins

BdSound and Vivoka Join Forces to Boost the World of Voice Assistants

BdSound and Vivoka, two European pioneers in voice technology, announced a strategic partnership to reshape the landscape of voice assistants. Through this collaboration, BdSound will leverage Vivoka's development framework allowing users to high-level construct tailored voice assistants. And BdSound's audio and speech processing technology will become an integral part of the acoustic front-end tools offered by Vivoka, promising to make voice assistants more accessible and customizable than ever before.

Ambiq Removes Noise in Real-Time with Speech Enhancement AI for Connected Applications

August 29, 2023 by Joao Martins

Ambiq Removes Noise in Real-Time with Speech Enhancement AI for Connected Applications

Ambiq introduced the Neural Network Speech Enhancer (NNSE), the latest addition to its neuralSPOT's Model Zoo - a highly optimized AI model that effectively removes background noise from speech on the device in real-time, allowing clean speech capture in noisy environments. As with all Ambiq Model Zoo components, NNSE includes scripts and tools to help developers add speech de-noising capabilities to their applications.

Dolphin Design Unveils Innovative IP for Sound Classification Reducing Power Requirements by 99%

June 27, 2023 by audioXpress Staff

Dolphin Design Unveils Innovative IP for Sound Classification Reducing Power Requirements by 99%

Dolphin Design, a semiconductor designer of power management, audio, and processing devices with in-house ASIC design services, announced the launch of WhisperExtractor, a mixed-signal technology for voice and audio-enabled SoCs, enabling voice and sound classification at a record µW level power budget. The new technology paves the way to breakthrough always-on voice user interface, real time speech-to-text, and always-on sound detection.

Fraunhofer Cingo Immersive Listening Now Available in Audio Weaver

July 11, 2022 by Joao Martins

Fraunhofer Cingo Immersive Listening Now Available in Audio Weaver

DSP Concepts announced that its Audio Weaver development platform for audio products now also offers access to the Fraunhofer Cingo family of immersive processing tools. The agreement with Fraunhofer IIS allows audio product developers to enhance headphones, earbuds and speakers with binaural audio processing for immersive 3D sound with head tracking, as well as enhance existing stereo content, including loudness optimization and equalization. Cingo supports all channel-based formats and direct rendering of audio objects with associated position metadata, which can be transmitted as MPEG-H Audio.

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

June 22, 2022 by Cristina Costa

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

Renesas Electronics announced the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions, which the Japanese corporation describes as "the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity." The new Renesas SmartBond DA1470x family features a small form factor with integrated applications and 2D graphics processors, voice activity detector and power management, enabling the development of very compact connected product designs.

DSP Concepts Launches TWS Toolkit Powered by Audio Weaver

March 4, 2022 by Joao Martins

DSP Concepts Launches TWS Toolkit Powered by Audio Weaver

DSP Concepts announced the availability of a new toolkit for True Wireless Stereo (TWS) earbuds powered by its Audio Weaver development platform. The toolkit features a reference design optimized to run on the Cadence Tensilica HiFi 5 DSP in partnership with Airoha, a MediaTek subsidiary and manufacturer of low-power TWS Systems on Chip (SoCs). The development kit also includes a reference design with a fully operational earbud prototype designed by Knowles.

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