Alango Unveils Sound Processing Module for Qualcomm S7 SoC

Alango Technologies announced a new digital sound processing module for Qualcomm's Bluetooth SoCs, including the latest S7 Gen1 Sound platform that features five times the compute power, three times the DSP processing power, and almost 100 times on-device AI processing power compared to previous solutions. According to Alango, this first to market platform offers a pre-integrated, ready-to-use modular solution for the latest generation of hearables and advanced audio designs.

The Fraunhofer Institute for Integrated Circuits (IIS), headquartered in Erlangen, Germany, and Tymphany have partnered to provide state-of-the-art spatial audio solutions to audio manufacturers. The two companies have worked together to integrate Fraunhofer's audio processing suites and audio technologies into Flow DSP, Tymphany's own DSP platform and design framework which allows creating immersive audio features in new audio products.

It’s not unusual to see friends gathered around a sideways-turned phone to share the viewing and listening experience while watching videos on the phone’s external speakers. This trend toward stereo audio in smartphones, and other audio-playing devices, shows that audio amplifiers are playing a more important role in smartphone design. As a result, audio amplifiers are seeing a big jump in both unit volume and technology. This article was originally published in audioXpress, July 2019.