All items tagged with product development and Renesas (20)

Renesas to Acquire PCB Design Software Leader Altium

February 15, 2024 by Joao Martins

Renesas to Acquire PCB Design Software Leader Altium

Renesas Electronics announced an agreement to acquire all outstanding shares of the global leader in electronics design systems, Altium. The announcement, with important repercussions for product developers globally, enables Renesas to create a system-level integrated and open electronics system design and lifecycle management platform, leveraging Altium’s popular design software and cloud platform capabilities to increase innovation and overall productivity.

New Renesas RISC-V Voice-Control ASSP Allows Differentiated Applications with Voice Recognition

March 31, 2023 by Cristina Costa

New Renesas RISC-V Voice-Control ASSP Allows Differentiated Applications with Voice Recognition

Renesas extended its RISC-V embedded processing portfolio with the first RISC-V MCU designed for voice-controlled HMI (human-machine interface) systems. The new R9A06G150 32-bit ASSP (Application Specific Signal Processor), developed in collaboration with RISC-V ecosystem partners, provides a complete, cost-effective, production-ready voice-control system solution that eliminates the need for RISC-V tools and upfront software investment.

Renesas Lays Out Roadmap for Wi-Fi 6/6E and 7 Chipsets

November 18, 2022 by Joao Martins

Renesas Lays Out Roadmap for Wi-Fi 6/6E and 7 Chipsets

During the electronica 2022 show in Munich, Germany, Renesas Electronics unveiled plans to deliver a comprehensive set of advanced Wi-Fi offerings to complement its broad portfolio of industrial and connected products. In 2021, Renesas completed its acquisition of Celeno, a company from Israel specializing in wireless communication solutions, including advanced Wi-Fi chipsets for high-performance home networks, and is leveraging that technology to address a wide range WLAN access point applications for Wi-Fi 6/6E and Wi-Fi 7.

Highly Anticipated Return for electronica 2022, November 15 to 18

November 8, 2022 by audioXpress Staff

Highly Anticipated Return for electronica 2022, November 15 to 18

electronica, the world’s leading trade fair and conference for electronics, will take place in 14 halls on the Munich exhibition grounds from November 15 to 18, 2022. This is a highly-anticipated return for a show that promises to reengage multiple critical sectors in development and manufacturing, after four years of absence. This year’s highlights in the electronica Conference will deal with Automotive, Embedded Platforms, Sensors, and Wireless Systems and Applications.

Renesas and Cyberon Partner to Deliver Integrated Voice User Interface Solutions Supporting Over 40 Global Languages

June 30, 2022 by Joao Martins

Renesas and Cyberon Partner to Deliver Integrated Voice User Interface Solutions Supporting Over 40 Global Languages

Renesas Electronics, the advanced semiconductor solutions supplier, and Cyberon, a leading embedded speech solution provider, have partnered to deliver voice user interface (VUI) solutions using Renesas’ entire RA MCU line. Renesas RA customers will now have complimentary access to Cyberon’s industry-leading continuous command-based VUI toolchain, enabling them to add voice-recognition to a variety of endpoint applications, including home appliances and wearables.

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

June 22, 2022 by Cristina Costa

Renesas Launches Highly Integrated Advanced Bluetooth Low Energy SoC

Renesas Electronics announced the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions, which the Japanese corporation describes as "the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity." The new Renesas SmartBond DA1470x family features a small form factor with integrated applications and 2D graphics processors, voice activity detector and power management, enabling the development of very compact connected product designs.

Renesas Develops World's Smaller and Lower Power Bluetooth Low Energy RF Transceiver

February 25, 2022 by audioXpress Staff

Renesas Develops World's Smaller and Lower Power Bluetooth Low Energy RF Transceiver

Renesas Electronics announced the development of two 2.4 GHz RF transceiver technologies that support the Bluetooth Low Energy (LE) low-power, near-field communication standard. The new technologies also achieve a smaller mounting area and better power efficiency. Renesas presented these technologies at International Solid-State Circuits Conference 2022 (ISSCC 2022), held between February 20 and 24 in San Francisco.

EPC Introduces 12V – 48V 500W GaN Boost Converter in Collaboration With Renesas

January 6, 2022 by Cristina Costa

EPC Introduces 12V – 48V 500W GaN Boost Converter in Collaboration With Renesas

EPC announced the availability of the EPC9166, a 500W DC-DC demo board that converts a 12V input to 48V output. The EPC9166 demo board demonstrates the Renesas ISL81807 80V two-phase synchronous boost controller with the latest generation EPC2218 eGaN FETs from EPC to achieve greater than 96.5% efficiency in a 12V input to 48V regulated output conversion with 500kHz switching frequency. The output voltage can be configured to 36V, 48V, and 60V. The board can deliver 480W power without a heatsink.

Renesas Announces Development of Next-Generation Wireless MCUs Supporting New Bluetooth 5.3 Low Energy Specification

October 22, 2021 by audioXpress Staff

Renesas Announces Development of Next-Generation Wireless MCUs Supporting New Bluetooth 5.3 Low Energy Specification

Renesas Electronics announced that it is developing new microcontrollers (MCUs) that will support the recently released Bluetooth 5.3 Low Energy (LE) Specification. The new devices will be part of the Renesas Advanced (RA) Family of 32-bit Arm Cortex-M microcontrollers, joining the RA4W1 Bluetooth 5.0 LE device introduced in 2020. Renesas expects to have first samples of the new MCUs in the first quarter of 2022.

Renesas and Syntiant Develop Voice-Controlled Multimodal AI Solution Combining Advanced Vision and Voice Technologies

July 29, 2021 by audioXpress Staff

Renesas and Syntiant Develop Voice-Controlled Multimodal AI Solution Combining Advanced Vision and Voice Technologies

Advanced semiconductor solutions manufacturer Renesas Electronics, and Syntiant, the chip technology company advancing low-power intelligent voice and sensor processing in edge devices, announced the joint development of a voice-controlled multimodal AI solution that enables low-power voice-controlled operation for embedded AI-based vision processing, such as self-checkout machines, security cameras, video conference systems, and smart appliances such as robotic cleaning devices.

«
1
2
»