All items tagged with product development and OEM (12)

Virscient Collaborates With Infineon to Accelerate AIROC-based Wireless Design Development

August 3, 2023 by audioXpress Staff

Virscient Collaborates With Infineon to Accelerate AIROC-based Wireless Design Development

Virscient, announced a new strategic collaboration with Infineon to support customers' design-in of Infineon’s connectivity products. Under this agreement, Virscient will provide expert design and engineering services, and licensable software solutions to help innovative OEMs and platform vendors rapidly deliver products integrating Infineon's AIROC Wi-Fi + Bluetooth combo ICs – whether chip-down, or in modular form.

Pascal Acquires WorxAudio from Fender and Appoints Hugh Sarvis to Lead New Blaze Audio Loudspeaker Development Team

February 3, 2023 by Joao Martins

Pascal Acquires WorxAudio from Fender and Appoints Hugh Sarvis to Lead New Blaze Audio Loudspeaker Development Team

In what is certainly great news for all other OEM amplifier companies, Pascal A/S of Copenhagen, Denmark, which recently had decided to compete directly with its former amplifier clients with the launch of Blaze Audio, is now also going to sell speakers, competing directly with what last clients it still had. To push forward with this strategy, Pascal acquired the former WorxAudio IP from Presonus/Fender and hired its veteran team, led by Hugh Sarvis.

Audinate Now Shipping Dante Brooklyn 3 Audio Networking Module

October 24, 2022 by Joao Martins

Audinate Now Shipping Dante Brooklyn 3 Audio Networking Module

Audinate, the developer of the Dante audio-over-IP networking solution that now also carries video, announced that its Dante Brooklyn 3 audio networking module is now shipping. Announced in June at InfoComm 22, the new module is a pin-compatible replacement for one of Audinate’s most popular products, the Dante Brooklyn 2, which has been redesigned to ensure continuous availability while delivering support for current and future Dante features.

Audinate Announces New OEM Modules to Offset Supply Chain Headwinds

June 13, 2022 by Joao Martins

Audinate Announces New OEM Modules to Offset Supply Chain Headwinds

Addressing one of the most important, complex, and dynamic commercial issues impacting the global audio and video industry, during InfoComm 2022 Audinate announced the actions the company has been taking to minimize and mitigate the impact of global supply issues. In addition, as part of its strategy to ensure availability of product, the company announced next generation, drop-in replacements for its popular Brooklyn and Fremont modules.

Merging Technologies Creates Scalable, High Performance AES67 Solution Based on Analog Devices SHARC SoCs

May 9, 2022 by audioXpress Staff

Merging Technologies Creates Scalable, High Performance AES67 Solution Based on Analog Devices SHARC SoCs

Merging Technologies announced the availability of its AES67 embedded solution for the ADSP-SC5xx SHARC series of System on Chips (SoCs) from Analog Devices. Merging Technologies’ experience in the audio over IP (AoIP) field (Ravenna/AES67) and Analog Device's experience in unified communications and pro-audio applications, has led to a collaboration that broadens the range of AoIP solutions for manufacturers of electronics and ultimately integrators.

Nixer Pro Audio Uses ZMAN OEM Solution from Merging Technologies for Ravenna AoIP Monitoring

August 17, 2021 by audioXpress Staff

Nixer Pro Audio Uses ZMAN OEM Solution from Merging Technologies for Ravenna AoIP Monitoring

The rapid adoption of Audio-over-IP (AoIP) unveiled the need for innovative monitoring tools to make sure that streams are arriving safely. UK company, Nixer Pro Audio, has been providing solutions since 2017, and already offers an impressive range of Dante monitoring tools. However, rather quickly the company received requests for high channel count solutions supporting Ravenna too. Nixer met the challenge by implementing Merging's ZMAN, which is pin compatible with the Audinate Brooklyn 2 board.

MIPI I3C v1.1 Update for I2C Implementers Simplifies Development for Wearables and Connected Devices

January 20, 2020 by audioXpress Staff

MIPI I3C v1.1 Update for I2C Implementers Simplifies Development for Wearables and Connected Devices

The MIPI Alliance, the international organization that develops interface specifications for mobile and mobile-influenced industries, announced MIPI I3C v1.1, the first update to the interface that eliminates the historical pain points of I2C development. MIPI I3C v1.1 is a scalable, medium-speed, utility and control bus that connects peripherals to an application processor, streamlining integration and improving cost efficiencies in development.

Cypress Introduces Fully Integrated USB-C Charger Solution for Power Adapter OEMs

May 28, 2019 by audioXpress Staff

Cypress Introduces Fully Integrated USB-C Charger Solution for Power Adapter OEMs

Cypress Semiconductor announced the newest member of its USB-C Power Delivery family, the EZ-PD Power Adapter Generation 1 (PAG1) solution. The PAG1 is a complete AC-DC power solution with an integrated USB Power Delivery (PD) controller that enables OEMs to build reliable, efficient, and cost-effective power adapters for the growing USB-C charger market. The programmable EZ-PD PAG1 family delivers increased efficiency and reliability for USB-C charging applications.

Barix Announces Programmable IP Audio Module for OEMs and Systems Integrators with New SIP-Enhanced SDK

May 8, 2018 by audioXpress Staff

Barix Announces Programmable IP Audio Module for OEMs and Systems Integrators with New SIP-Enhanced SDK

Offering OEM manufacturers and systems integrators a flexible platform for quickly implementing advanced audio and IP functionality in audio installations, Swiss company Barix announced the availability of its IPAM 400 IP Audio Module, a new openly-programmable, high-performance hardware now available to OEM developers together with comprehensive programming tools including Session Initiation Protocol (SIP) integration support.

Your Audio Systems Launches Software Development Solution for AES67 and AES70 Embedded Devices at ISE 2018

January 31, 2018 by audioXpress Staff

Your Audio Systems Launches Software Development Solution for AES67 and AES70 Embedded Devices at ISE 2018

In preparation for its Integrated Systems Europe debut, Swiss-based Your Audio Systems announces the first major demonstration of Orchestra, an embedded Linux software solution for AES67/AES70 professional embedded devices, now available for OEM implementations. The company will exhibit Orchestra in the OCA Alliance stand (7-R240) in the Amsterdam RAI, Amsterdam, from February 6-9.

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