World’s Smallest UWB and BLE Low-Power Module for Connected Devices

Murata has launched the world’s smallest ultra-wideband (UWB) module – measuring just 10.5 mm × 8.3 mm × 1.44 mm – that combines elevated levels of accuracy and reliability with low-power to ensure compact and battery-driven connected devices operate as efficiently and cost-effectively as possible. Using short-range radio frequency (RF) technology, the Type 2AB UWB + Bluetooth low-energy (BLE) connectivity module can be used in a wide variety of applications where precise detection is essential.

NXP Semiconductors has announced that it now offers beta Ultra-Wideband (UWB) development tools from its NXP Trimension portfolio that interoperate with the U1 chip in supported Apple products. The beta development tools will allow developers to kick-start the design of innovative applications that interact with UWB enabled Apple products including iPhone and Apple Watch, unleashing the ability to create more precise, directionally aware app experiences.

Infineon Technologies expanded its wireless portfolio with new high-performance, reliable and secure devices. The newly developed AIROC brand now includes the industry’s first 1x1 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for enterprise and industrial applications, and its first 2x2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for multimedia, consumer and automotive applications. The new wireless connectivity combo devices deliver robust performance and minimal latency, making them ideal for high-quality video and audio streaming applications.

Murata Manufacturing Co., Ltd. has developed the GRM011R60J104M multi-layer ceramic capacitor, which the company claims is the world’s first to feature a maximum capacitance of 0.1µF in 008004 inch size (0.25×0.125mm). Mass production of this new product is scheduled to begin in 2020. Applications can be valuable in wearables devices and compact audio players, among many other products that require large numbers of more compact capacitors.

Murata has collaborated with Cypress Semiconductor to develop the Type 1LV (CYW43012) solution that the company states is the lowest power, small form factor Wi-Fi and Bluetooth module currently available. This product improves battery life in wearables, smart home products, and portable audio applications. When comparing Type 1LV (CYW43012) to the previous Type 1DX (CYW4343W) solution, power usage is approximately 54 percent lower in DTIM 1, 60 percent in DTIM 3, up to 50 percent for 2.4 GHz RX, and 28 percent for 2.4 GHz TX.