Dolphin Design Launches 12nm Silicon for Next-Generation Audio Devices

Dolphin Design, a leading supplier of high-performance analog, mixed-signal, processing intellectual property (IP) as well as ASIC design, has reached a significant milestone with the successful tape-out of its first TSMC 12nm FinFet test-chip containing its state-of-the-art audio IPs. This test chip is the first of its kind to offer a complete solution for audio designs combining high-performance, low-power in a minimal footprint.

Sondrel has created a powerful, quad core IP platform that is ideal for ASIC solutions for remote gathering and processing of video and data at the Edge with secure onwards transmission of the results. The SFA 200 reference design is targeted at battery powered applications in Smart Home, Sensor Fusion, voice-control, and other devices where a compact chip can add processing ‘smarts’ by providing local end-point data processing for data collection and analysis along with inference processing.

CEVA announced the general release of its RivieraWaves Bluetooth 5.3 IP. Supporting a multitude of features to further enhance security, robustness and low power operation, the RivieraWaves Bluetooth 5.3 IP is now available as a complete hardware and software solution for new designs, and as a software-only upgrade for compatible existing designs. All the latest features of Bluetooth are supported, including Isochronous Channels for LE Audio.