All items tagged with product development and Cadence (13)

Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products

January 23, 2023 by audioXpress Staff

Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products

Fluent.ai announced an embedded voice recognition solution for True Wireless Stereo (TWS) and other hearable products running on the Cadence Tensilica HiFi 5 DSP in partnership with Airoha, a MediaTek subsidiary. The solution is part of an integration available on DSP Concepts’ Audio Weaver platform, which provides OEMs a rapid way to design and prototype audio features and capabilities.

DSP Concepts Launches TWS Toolkit Powered by Audio Weaver

March 4, 2022 by Joao Martins

DSP Concepts Launches TWS Toolkit Powered by Audio Weaver

DSP Concepts announced the availability of a new toolkit for True Wireless Stereo (TWS) earbuds powered by its Audio Weaver development platform. The toolkit features a reference design optimized to run on the Cadence Tensilica HiFi 5 DSP in partnership with Airoha, a MediaTek subsidiary and manufacturer of low-power TWS Systems on Chip (SoCs). The development kit also includes a reference design with a fully operational earbud prototype designed by Knowles.

Cadence Extends Popular Tensilica Vision and AI DSP IP Product Line with New DSPs for Automotive, Mobile and Consumer Markets

April 26, 2021 by audioXpress Staff

Cadence Extends Popular Tensilica Vision and AI DSP IP Product Line with New DSPs for Automotive, Mobile and Consumer Markets

Cadence Design Systems expanded its popular Tensilica Vision DSP product family with the debut of two new DSP IP cores for demanding and always-on AI applications. The Tensilica Vision P1 DSP is optimized for always-on and smart sensor applications in the consumer market, providing an energy-efficient solution. Packing an industry-leading 3.8 tera operations per second (TOPS), the flagship Cadence Tensilica Vision Q8 DSP delivers 2X performance and memory bandwidth compared to the Tensilica Vision Q7 DSP.

NXP Announces Far-Field Offline Voice Control Solution In Collaboration with Sonos

February 26, 2020 by audioXpress Staff

NXP Announces Far-Field Offline Voice Control Solution In Collaboration with Sonos

NXP Semiconductors announced availability of its voice solution, SLN-LOCAL-IOT, a fully integrated development platform for offline voice control. The solution consists of a full hardware module design and associated software required to implement far-field voice control with a customizable wake word and local commands. NXP also announced market availability of the i.MX RT600 crossover microcontroller (MCU) family, ideal for ultra-low power audio and voice applications.

Alango Far-Field Voice Enhancement Package Now Available on NXP RT600 Processor

November 13, 2019 by audioXpress Staff

Alango Far-Field Voice Enhancement Package Now Available on NXP RT600 Processor

DSP processing software specialist firm, Alango has been working to port the company's Voice Enhancement Package (VEP) to the NXP i.MX RT600 cross-over processor family, which is optimized for 32-bit immersive audio applications combining a high-performance Cadence Tensilica Hi-Fi 4 audio DSP core with a next-generation Cortex-M33 core. VEP is a set of Alango proprietary far-field voice enhancement technologies developed to improve human to machine interaction in a variety of applications.

VESA Publishes Displayport 2.0 Video Standard Leveraging Thunderbolt 3 Physical Interface Layer

June 26, 2019 by audioXpress Staff

VESA Publishes Displayport 2.0 Video Standard Leveraging Thunderbolt 3 Physical Interface Layer

The Video Electronics Standards Association (VESA) announced the DisplayPort 2.0 video standard, the first major update to the DisplayPort standard since March 2016, increasing data bandwidth performance up to three times more than the previous version of DisplayPort 1.4a. Utilizing the Thunderbolt 3 physical interface layer and USB Type-C connector, DisplayPort 2.0 boosts the data and video bandwidth to a maximum payload of 77.37 Gbps, while new built-in features enable improved user experience, provide greater flexibility and improve power efficiency.

Cadence Introduces Tensilica HiFi 5 DSP Optimized for AI Speech and Audio Processing

November 1, 2018 by audioXpress Staff

Cadence Introduces Tensilica HiFi 5 DSP Optimized for AI Speech and Audio Processing

Cadence Design Systems announced the Cadence Tensilica HiFi 5 DSP for audio and voice, the company's first IP core optimized for high-performance far-field processing and artificial intelligence (AI)-based speech recognition processing. This fifth-generation HiFi DSP offers 2X audio processing and 4X neural network (NN) processing improvements versus the HiFi 4 DSP, making it ideal for voice-controlled user interfaces in digital home assistants and automotive infotainment.

Cadence Launches New Tensilica DNA 100 Processor IP for On-Device Artificial Intelligence Applications

September 20, 2018 by audioXpress Staff

Cadence Launches New Tensilica DNA 100 Processor IP for On-Device Artificial Intelligence Applications

Cadence Design Systems announced the Cadence Tensilica DNA 100 Processor IP, the first deep neural-network accelerator (DNA) AI processor IP to deliver both high performance and power efficiency across a full range of compute from 0.5 TeraMAC (TMAC) to 100s of TMACs. As a result, the DNA 100 processor is well suited for on-device neural network inference applications spanning autonomous vehicles (AVs), ADAS, surveillance, robotics, drones, augmented reality (AR) /virtual reality (VR), smartphones, smart home and connected devices.

The Linux Foundation Adopts Sound Open Firmware Project Enabling Developers to Adapt Operating Systems for Audio Devices

March 15, 2018 by audioXpress Staff

The Linux Foundation Adopts Sound Open Firmware Project Enabling Developers to Adapt Operating Systems for Audio Devices

During the Embedded Linux Conference in Portland, OR, The Linux Foundation announced that Sound Open Firmware (SOF) has become a Linux Foundation project. With significant engineering and code contributions from Intel Corporation, SOF includes a digital signal processing (DSP) firmware and an SDK that together provide infrastructure and development tools for developers working on audio or signal processing. Intel and Google support SOF and invite others to join them in advancing the project.

Cadence Announces Tensilica HiFi 3z DSP Architecture with Enhanced Voice and Audio Processing Performance

July 27, 2017 by audioXpress Staff

Cadence Announces Tensilica HiFi 3z DSP Architecture with Enhanced Voice and Audio Processing Performance

Cadence Design Systems, announced the Cadence Tensilica HiFi 3z DSP IP core for system-on-chip (SoC) designs targeted for the latest mobile and home entertainment applications, including smartphones, augmented reality (AR)/3D goggles, digital TVs and set-top boxes (STBs). The new HiFi 3z architecture offers more than 1.3X better voice and audio processing performance than its predecessor, the HiFi 3 DSP, which leads the industry in the number of audio DSP cores shipped.

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