Simulation Techniques: Lumped Element Modeling of Transducers

An exploration of the possibilities for product development focusing on modeling of transducers. As many engineering tasks require a common ground from which discussions among those involved in a project can take place in a structured manner, this often involves a so-called model of the concept or product. This article discusses one such model: the lumped element model. This article was originally published in audioXpress, March 2023.

Interested in accurately simulating the noise of op-amp circuits? Audio electronics expert Burkhard Vogel wrote a book that addresses this relevant topic for any audio circuit designer that doesn't want to rely just on manufacturers own models. In this review, Marcel van de Gevel explored the full book after he read Vogel's introduction, explaining that some manufacturer-supplied simulation models are way off.

Good intentions for sustainability, circularity, or simply reducing your carbon foot-print in the development or manufacturing stages not always produces the intended results. Mike Klasco reminds us how things are not always as simple as we would like, and that having good intentions and throwing empty claims might work on paper, but not actually work in the real world.

Headquartered in Santa Barbara, CA, Echo Test + Measurement is a little company with a big impact on audio test and measurement. As many large consumer electronics companies started using its AudioFire studio sound cards for production line testing, Echo designed a highly cost-effective, modular range of USB-based audio test interface solutions, which Stuart Yaniger had the opportunity to evaluate. He completed a series of tests and shares his experiences with the new Echo AIO modular audio test system.

The first article from audio expert Ethan Winer about Modern PCB Design Practices, gave a general overview of board design using surface-mounted devices (SMDs). The article examines current practices and methods for designing four-layer printed circuit boards using surface mounted components (SMDs), and this second part explains specific strategies and related issues to deal with the design and production of great quality PCBs. This article was originally published in audioXpress, March 2023.

In this issue of Voice Coil, Mike Klasco shares his experience dealing with sustainability and other noble goals, an article that was greatly inspired by the effort to compile another updated Speaker Enclosure Vendor Directory for 2023. In Acoustic Patents, James Croft explains how Yamaha recently invented a clever way to use a Class-D amplifier to bend the infamous "Hofmann’s Iron Law." And Vance Dickason takes the new 10HX230 10" coaxial professional driver from Faital Pro to his Test Bench.

audioXpress March 2023 offers an overview of the latest solutions and trends in audio measurement. Stuart Yaniger reviews the new Echo AIO modular audio test system, Philipp P. Klose writes about measurements in automotive audio environments, and Steve Temme shares his knowledge on audio testing in the production line. René Christensen explores Lumped Element Modeling of Transducers, Chuck Hansen expands the topic of power transformer losses, and Ethan Winer concludes his two-part article about Modern PCB Design Practices.