All items tagged with high resolution audio and Bluetooth LE Audio (21)

Sennheiser BTD 700 Adds Bluetooth LE Audio and Auracast Support to Any Source

June 3, 2025 by Joao Martins

Sennheiser BTD 700 Adds Bluetooth LE Audio and Auracast Support to Any Source

Sennheiser unveiled a high-performance Bluetooth dongle designed to improve the wireless audio experience and unleash the full potential of its current wireless headphones and earbuds supporting Bluetooth LE Audio and Auracast. The new Sennheiser BTD 700 dongle also adds support for aptX Lossless and aptX Adaptive codecs while opening up low-latency gaming possibilities. An effective single plug-and-play solution that accelerates the benefits of the latest Bluetooth updates.

Bluetooth Roadmap: The Promise of Wireless Audio Realized?

May 29, 2025 by Joao Martins

Bluetooth Roadmap: The Promise of Wireless Audio Realized?

Hope is on the way for High-Quality Wireless Audio. The Bluetooth SIG is accelerating its technology updates and anticipating an ambitious roadmap of technology updates. With more than 50 active enhancement projects in process for upcoming specifications, including High Data Throughput, Bluetooth will evolve to support lossless codecs, high-resolution audio, and even multichannel formats. What should we expect next from Bluetooth?

The Future of Seamless Audio According to Qualcomm

March 20, 2025 by Joao Martins

The Future of Seamless Audio According to Qualcomm

An exclusive interview with Dino Bekis, Qualcomm's Vice President and General Manager, Wearables & Mixed Signal Solutions Business Unit, where he shares fascinating insights into the company's roadmap and future developments, leveraging the best of Bluetooth and Wi-Fi in wireless earbuds and headphones into a seamless, high-quality audio experience. We also learn about Qualcomm's unique vision for its latest generation Snapdragon Sound platforms, and XPAN technology, allowing wireless hi-res audio without bandwidth constraints or compromising battery life.

Ceva Unveils First Multi-Protocol Wireless Connectivity Platform IP Featuring Next Generation Bluetooth High Data Throughput

January 2, 2025 by Joao Martins

Ceva Unveils First Multi-Protocol Wireless Connectivity Platform IP Featuring Next Generation Bluetooth High Data Throughput

Ceva announced the first complete multi-protocol wireless connectivity platform that supports Bluetooth High Data Throughput (HDT). This next generation technology meets the pressing need for Bluetooth devices looking to support streaming of even larger media at higher data rates. The new Ceva-Waves Links200 IP platform is designed to dramatically enhance wireless audio capabilities and support advanced applications like 7.1 audio systems.

Airoha Technology Launches Flagship Wireless AI Audio SoC

December 30, 2024 by Joao Martins

Airoha Technology Launches Flagship Wireless AI Audio SoC

Airoha Technology announced the launch of a new flagship wireless audio chip with integrated AI processing. The AB1595 chip integrates essential functions that currently require multiple chips into one single system-on-chip (SoC). The announcement follows a recent press conference where the MediaTek subsidiary confirmed its intention to lead the market as a Bluetooth audio supplier and to outgrow the industry with AI-powered solutions in 2025.

JBL Tour PRO 3 with Advanced Smart Charging Case Lead the Next Generation of TWS Earbuds

August 21, 2024 by Joao Martins

JBL Tour PRO 3 with Advanced Smart Charging Case Lead the Next Generation of TWS Earbuds

Harman unveiled its new flagship true wireless earbuds, JBL Tour PRO 3. The most advanced design from the brand, the JBL Tour PRO 3 combine dual drivers per earbud with JBL Spatial 360 with Head Tracking, True Adaptive Noise Cancellation 2.0, AI-based voice call processing, and a Smart Charging Case packing truly unique features and already supporting Auracast. A product that is set to redefine the user experience in this extremely competitive category.

EarFun Introduces Air Pro 4 Adaptive ANC Wireless Earbuds with LE Audio and Auracast

August 5, 2024 by Joao Martins

EarFun Introduces Air Pro 4 Adaptive ANC Wireless Earbuds with LE Audio and Auracast

Factories in China are starting to bring out the new generation of Bluetooth LE Audio and Auracast-enabled true wireless earbuds, now that the chips are becoming available. Some more aggressive brands are using this opportunity to jump ahead of the crowd. EarFun managed a number of firsts in the new Air Pro 4 earbuds, the first Qualcomm Snapdragon Sound Bluetooth 5.4 model with support for both LDAC and aptX Adaptive codecs, ready for LE Audio and Auracast.

Realtek Showcases Switchable Wi-Fi/Bluetooth Audio Solution at 2024 AWE China Expo

March 13, 2024 by Joao Martins

Realtek Showcases Switchable Wi-Fi/Bluetooth Audio Solution at 2024 AWE China Expo

Under the theme of "Realtek AI Changing the Future," the Taiwan semiconductor company will exhibit at the AWE China Expo (March 14-17, 2024), at the Shanghai New International Expo Centre (SNIEC). Showcasing the possibilities of AI in connected applications, Realtek will present a hybrid AIoT Audio SoC that supports both dual‑band Wi‑Fi 6 (2.4GHz/5GHz) and dual-mode Bluetooth 5.2 to enable low-latency, high resolution audio playback applications.

Frontier Unveils Partnership with Realtek for New AURIA Connected Audio Module

January 12, 2024 by audioXpress Staff

Frontier Unveils Partnership with Realtek for New AURIA Connected Audio Module

Frontier Smart Technologies unveiled a collaboration with Realtek for its AURIA Bluetooth LE Audio and Wi-Fi module, which features Auracast support. The audio module has been designed and engineered for simple integration into various audio products, and comes with a customizable SDK, rich I/O, comprehensive documentation and technical support. The latest Realtek Ameba chips ensure support for the latest technologies.

Sonical and XMOS Develop New UWB/Bluetooth Wireless Audio USB Dongle

December 11, 2023 by Joao Martins

Sonical and XMOS Develop New UWB/Bluetooth Wireless Audio USB Dongle

Sonical, the company pioneering a fully integrated approach for the product development of headphones and hearables, with a real-time operating system that allows consumers to load their own apps, will partner with XMOS for its Headphone 3.0 demonstrations at CES 2024. The two companies will showcase a first joint development that will greatly enhance wireless audio quality with huge benefits to the feature set in Sonical's roadmap.

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