All items tagged with hearables (179)

Capture Adaptive Audio Intelligence in audioXpress February 2024

January 9, 2024 by audioXpress Staff

Capture Adaptive Audio Intelligence in audioXpress February 2024

In the February 2024 issue of audioXpress read the latest on AI, Adaptive Audio Enhancement, and Noise Cancellation, Microphones, and Voice Capture. René Christensen writes about Acoustical Shape Optimization, and Richard Honeycutt writes about Sustainable Acoustical Products. David Ralph writes about Duelund vs. Linkwitz-Riley crossovers, and Paul Kittinger explains how to build the Duetta Transmission-Line speakers. Chris Paul writes about A Better Beta Follower amplifier, while Richard Honeycutt puts together an Imaginary Silvertec Guitar Amplifier.

Analog Devices Presents New-Generation ADAU1797 Low Power Audio Processor at CES 2024

January 9, 2024 by Joao Martins

Analog Devices Presents New-Generation ADAU1797 Low Power Audio Processor at CES 2024

Analog Devices is now sampling its latest audio processor and low power ANC codec, the ADAU1797. This high-performance device with integrated HiFi 3z and FastDSP cores is able to efficiently support front-end audio processing with beamforming and noise reduction, as well as neural network-assisted speech recognition (ASR) processing. An ideal, low latency, low power, three times more powerful processor for true wireless stereo (TWS) ANC earbuds and headphones.

Orosound Labs Innovation Division Accelerates AI-Enabled Hearables

January 5, 2024 by Joao Martins

Orosound Labs Innovation Division Accelerates AI-Enabled Hearables

Orosound, a company with patented signal processing and noise-canceling technologies, has unveiled Orosound Labs, its advanced innovation division that has operated sub rosa for the last couple of years. As the company stands at the forefront of AI-enabled active noise cancellation and reduction technologies that are ready to be embedded in consumer brand products, Orosound Labs is committed to empowering partners with a faster and more reliable way to introduce hearables with unique AI features to the market.

HEAR360 and Sonical Join Forces to Bring Spatial Audio to Sonical's CosmOS Headphone Operating System

January 5, 2024 by Joao Martins

HEAR360 and Sonical Join Forces to Bring Spatial Audio to Sonical's CosmOS Headphone Operating System

HEAR360 and Sonical announced a strategic partnership that delivers value to headphone manufacturers and their end users. At launch, HEAR360's industry recognized real-time spatial audio engine will be available in CosmOS's growing ecosystem of plugins and apps, enabling manufacturers to offer customizable experiences that can be enjoyed on any wired or wireless headphones/earbuds, supporting Bluetooth, Ultra-wideband and Wi-Fi.

Sonical Headphone 3.0 Platform Supports Cingo Dynamic Spatial Audio Technology From Fraunhofer

December 28, 2023 by Joao Martins

Sonical Headphone 3.0 Platform Supports Cingo Dynamic Spatial Audio Technology From Fraunhofer

In anticipation of an exciting showcase planned for CES 2024 - mostly restricted to manufacturers and technology providers interested in exploring the Headphone 3.0 approach - Sonical has confirmed a new strategic partnership. The company headquartered in Silicon Valley is working with Fraunhofer IIS to offer its Cingo binaural rendering and Spatial Audio technology running on Sonical CosmOS, specifically designed for hearables with downloadable plugins.

Breggz Introduces Luxury Hearables Customized to Individual Ears

December 27, 2023 by Joao Martins

Breggz Introduces Luxury Hearables Customized to Individual Ears

Breggz Hearables will unveil the world's first truly wireless, custom-made "in-ear" computer — a made-to-measure luxury hearable with an A+ audio experience — at CES 2024. Each pair of Breggz is tailor-made to the user, to provide the best possible sound for a truly wireless in-ear experience — "a dramatic change in sound and luxury", according to the new Dutch technology company. The Breggz design uses four Knowles balanced armature drivers per side.

GreenWaves Showcases World's First AI-Based Audio Solutions for the GAP9 Application Processor at CES 2024

December 19, 2023 by Joao Martins

GreenWaves Showcases World's First AI-Based Audio Solutions for the GAP9 Application Processor at CES 2024

GreenWaves Technologies will be at CES 2024 with an interesting showcase of AI for audio applications. The company's GAP9 advanced AI processor is in volume production, and GreenWaves will be able to show several solutions that are enabling market leading hearable products. Demonstrations include audio advanced source separation models, and active noise cancellation with neural network based acoustic scene detection, as well as immersive 3D sound.

Fraunhofer Cingo and upHear Now Integrated with Tymphany's Peerless Flow DSP

December 15, 2023 by Joao Martins

Fraunhofer Cingo and upHear Now Integrated with Tymphany's Peerless Flow DSP

The Fraunhofer Institute for Integrated Circuits (IIS), headquartered in Erlangen, Germany, and Tymphany have partnered to provide state-of-the-art spatial audio solutions to audio manufacturers. The two companies have worked together to integrate Fraunhofer's audio processing suites and audio technologies into Flow DSP, Tymphany's own DSP platform and design framework which allows creating immersive audio features in new audio products.

Sonical and XMOS Develop New UWB/Bluetooth Wireless Audio USB Dongle

December 11, 2023 by Joao Martins

Sonical and XMOS Develop New UWB/Bluetooth Wireless Audio USB Dongle

Sonical, the company pioneering a fully integrated approach for the product development of headphones and hearables, with a real-time operating system that allows consumers to load their own apps, will partner with XMOS for its Headphone 3.0 demonstrations at CES 2024. The two companies will showcase a first joint development that will greatly enhance wireless audio quality with huge benefits to the feature set in Sonical's roadmap.

Sonical Partners with IDUN audio for Embedded Dynamic Spatial Audio

September 13, 2023 by Joao Martins

Sonical Partners with IDUN audio for Embedded Dynamic Spatial Audio

Sonical, the Headphone 3.0 pioneer based in San Mateo, CA, and IDUN audio, the leading-edge startup from Copenhagen, Denmark, specializing in dynamic spatial audio for headphones, have formalized a strategic partnership. The two companies have been cooperating since 2022, and IDUN audio was part of the Sonical CES 2023 demos, with its dynamic spatial audio software running on Sonical's headphone operating system CosmOS - enabling unsurpassed spatialization with fast head tracking.

«
1
2
3
4
5
6
7
8
9
10
...
17
18
»