All items tagged with hearables (155)

MEMS and Other Leading-Edge Devices for Wearables - 2021 Update

March 23, 2021 by Mike Klasco

MEMS and Other Leading-Edge Devices for Wearables - 2021 Update

In this article for Voice Coil, Mike Klasco (Menlo Scientific) recaps MEMS Drivers and related hot technologies for 2021, providing an update about products and companies that stood out in 2020. The article, which summarizes the more extensive reports published by audioXpress in January 2020 and 2021, looks at the impact of microelectromechanical systems (MEMS) for audio and discusses the implications for other game-changing technologies that reduce size, increase performance, extend battery life, and enhance features and functionality in headphones, wearables and compact speakers.

Feeling The Audio Industry's Pulse

March 11, 2021 by Joao Martins

Feeling The Audio Industry's Pulse

It's been precisely a year since the global COVID-19 pandemic was declared and we all had to refrain from our normal routines and shelter in place, being restricted to working from home until now. At least for the audioXpress team. A year past, and we are glad to be able to signal that during that year we've kept our publications and even grown our online audiences and achieved extremely positive results. Mainly, because we continued to offer the best content for anyone interested in following the audio industry, audio product development, audio innovations, and DIY audio.

audioXpress April 2021 Looks Ahead at the Evolution in Voice, Communication and True Wireless

March 11, 2021 by audioXpress Staff

audioXpress April 2021 Looks Ahead at the Evolution in Voice, Communication and True Wireless

The April 2021 issue of audioXpress is now available in print and online and it addresses a convergence of technologies in two of the most exciting product segments at the moment: True Wireless Earbuds and Voice & Communication. George Ntanavaras explores vibration measurements using piezoelectric sensors, Jens Tybo Jensen describes a highly efficient hybrid bass amplification design, and Richard Honeycutt discusses how horns have evolved to address sound directionality. And much more top-level audio electronics from top experts in the field. Get Your Copy Now!

QuickLogic Releases Amazon-Qualified Alexa Reference Design for Hearables

March 4, 2021 by audioXpress Staff

QuickLogic Releases Amazon-Qualified Alexa Reference Design for Hearables

QuickLogic released an Amazon-qualified QuickFeather AVS Reference Design that enables OEMs and ODMs to evaluate and develop their own smart hearable products quickly and easily. This kit integrates the Alexa voice-initiated Close-Talk experience, enabling a broad set of battery-powered applications to communicate directly with Alexa for a multitude of use cases. In addition, OEMs and ODMs can optionally integrate multiple AI-based motion, sound and other AI use cases based on SensiML’s AI Software Platform, which already has native support for the development kit.

USound Establishes Partnership With Colsan Audio to Offer MEMS Speakers for the Hearing Aid Industry

March 3, 2021 by Joao Martins

USound Establishes Partnership With Colsan Audio to Offer MEMS Speakers for the Hearing Aid Industry

Austrian MEMS Speakers pioneers USound are tapping into the hearing aid industry. As an European distributor that already offers a wide range of solutions to the hearing aid and pro audio market, Colsan Audio will now expand its portfolio with USound's 2nd generation MEMS drivers, available in a round form factor. These are thinner and lighter than comparable electrodynamic drivers, provider an attractive, high-quality audio option that is also IPx8 rated.

DSP Concepts and CloudNav Partnership Brings Best-in-Class Sensor Fusion Technology to Audio Weaver

February 24, 2021 by audioXpress Staff

DSP Concepts and CloudNav Partnership Brings Best-in-Class Sensor Fusion Technology to Audio Weaver

DSP Concepts, the audio platform powering more than 50M devices for many of the world’s best consumer and automotive brands, announced a partnership with CloudNav to bring its sensor fusion technology to Audio Weaver. This means that developers can seamlessly deploy CloudNav’s Performance Fusion technology through Audio Weaver’s drag-and-drop graphical interface to integrate and automatically calibrate inertial sensors for optimal product performance.

Electrostatic Pure Silicon Microspeakers for Wireless Earbuds

January 14, 2021 by Hermann Schenk

Electrostatic Pure Silicon Microspeakers for Wireless Earbuds

This contributed article by Hermann Schenk, and Lutz Ehrig describes a new transducer technology that promises to be a power efficient solution for wireless earbuds. Arioso Systems is a successful Fraunhofer IPMS spin-off company that is now launching an innovative sound transducer principle for miniaturized headphones, in-ears and hearables. The article describes how this new technology, and specifically the company's new MEMS topology can contribute to the next-generation of true wireless earbuds.

TDK Introduces Lowest Pulse Density Modulation Multi-Mode MEMS Microphone With Acoustic Activity Detect

January 13, 2021 by audioXpress Staff

TDK Introduces Lowest Pulse Density Modulation Multi-Mode MEMS Microphone With Acoustic Activity Detect

InvenSense, a TDK Group company, announced a comprehensive portfolio of new technology solutions during the 2021 Consumer Electronics Showcase. Among the expanded MEMS portfolio, the new T5838 SmartSound MEMS microphone offers a low power mode of just 130uAmps and a high-quality mode of 330uAmps, while supporting a dynamic range of 68dN SNR and 133dB AOP at 20kHz bandwidth. Optimized for smartphones, microphone arrays, smart speakers, and headsets, the T5838 supports configurable wake-on-sound at power levels as low as 20 µA.

DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor

January 7, 2021 by audioXpress Staff

DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor

DSP Group announced the DBM10, a new low-power, cost-effective artificial intelligence (AI) and machine learning (ML) system-on-chip (SoC). This new open platform, with a cost- and power-optimized architecture, enables rapid development of AI and ML applications for mobile, wearables, hearables, and connected devices in general. It provides a complete platform in terms of voice and audio processing, without compromising the battery life of new designs, and allowing developers to implement their own differentiating algorithms.

Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Applications

January 7, 2021 by audioXpress Staff

Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Applications

Syntiant Corp., the AI for edge devices chip technology company from Irvine, California, announced the availability of its latest Syntiant NDP120 Neural Decision Processor (NDP), a new generation of special purpose chips for audio and sensor processing for always-on applications in battery-powered devices. The low-power Syntiant Core 2 technology in the NDP120 processor delivers 25x the tensor throughput of the core technology found in earlier Syntiant NDP devices that are currently shipping in high volumes.

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