All items tagged with edge AI (114)

Particle Unveils Tachyon, a Qualcomm Snapdragon-Powered, 5G, AI-Enabled Single-Board Computer

July 31, 2024 by Joao Martins

Particle Unveils Tachyon, a Qualcomm Snapdragon-Powered, 5G, AI-Enabled Single-Board Computer

Particle, a company from San Francisco focused on edge-to-cloud connectivity and platforms, has launched Tachyon, its first Qualcomm Snapdragon-powered single-board computer (SBC), comprising a powerful NPU for AI/ML workloads, built-in high-bandwidth cellular 5G and Wi-Fi 6E connectivity, and a Linux-powered Ubuntu operating system. The board is now available for pre-order on Kickstarter starting at $149.

Sparse Artificial Intelligence MCU from Femtosense and ABOV Semiconductor Delivers AI-Based Voice Processing On-Device

July 17, 2024 by Joao Martins

Sparse Artificial Intelligence MCU from Femtosense and ABOV Semiconductor Delivers AI-Based Voice Processing On-Device

Femtosense, in partnership with ABOV Semiconductor in South Korea, has launched the AI-ADAM-100, an artificial intelligence microcontroller unit (AI MCU) built on sparse AI technology to enable on-device AI features such as voice-based control in home appliances and other products. According to the Silicon Valley startup, the new AI-ADAM-100 AI MCU is a low-power, low-cost option for on-device language processing and voice-cleanup capabilities.

Microchip Technology Launches RISC-V Multi-Core 64-Bit Microprocessors

July 10, 2024 by Cristina Costa

Microchip Technology Launches RISC-V Multi-Core 64-Bit Microprocessors

Real-time, compute intensive applications such as fully adaptive noise cancellation, voice separation and Machine Learning (ML) are pushing the boundaries of embedded processing requirements, demanding more power-efficiency, hardware-level security and high reliability at the edge. With the launch of its PIC64 portfolio, Microchip Technology expanded its computing range to meet this rising demands.

TDK Makes InvenSense SmartSound T5848 I²S MEMS Microphone Available in Distribution Channels

June 28, 2024 by Joao Martins

TDK Makes InvenSense SmartSound T5848 I²S MEMS Microphone Available in Distribution Channels

Following a very successful presence at Sensors Converge 2024 in Santa Clara, CA (June 25-26), where TDK promoted its range of MEMS microphones and sensors, the company announced worldwide distribution of its InvenSense SmartSound T5848 bottom port I²S MEMS microphone. This device is ideal to enable intelligent keyword, voice command and sound detection applications in ultra-low power designs, such has hearables and wearables. Originally announced at CES 2022, this MEMS microphone only now is available for general distribution.

Ceva Adds New TinyML Optimized NPUs to Enable Edge AI Everywhere

June 24, 2024 by audioXpress Staff

Ceva Adds New TinyML Optimized NPUs to Enable Edge AI Everywhere

Ceva, a leading licensor of silicon and software IP that enables edge devices to connect, sense and infer data more reliably and efficiently, announced that it has extended its Ceva-NeuPro family of NPUs. These meet growing demand for efficient and specialized AI applications at the Edge, where power and processing power is often limited, particularly in consumer products such as TWS earbuds, wearables, smart speakers, smart appliances, home automation devices, cameras, and more.

Microchip Technology Acquires Neuronix AI Labs

April 16, 2024 by audioXpress Staff

Microchip Technology Acquires Neuronix AI Labs

Microchip Technology has acquired Neuronix AI Labs to expand its capabilities for power-efficient, AI-enabled edge solutions deployed on field programmable gate arrays (FPGAs). Microchip’s mid-range PolarFire FPGAs and SoCs already lead the industry in terms of low power consumption, reliability and security capabilities. The acquisition of this technology will enable Microchip to develop cost-effective, large-scale edge deployments for use in applications on systems that have cost, size and power constraints and enable a multifold increase in AI/ML processing horsepower on low and mid-range FPGAs.

New Qualcomm S3 Gen 3 and Qualcomm S5 Gen 3 Sound Platforms Dramatically Expand Options for Mid-Tier Designs

March 26, 2024 by Joao Martins

New Qualcomm S3 Gen 3 and Qualcomm S5 Gen 3 Sound Platforms Dramatically Expand Options for Mid-Tier Designs

Qualcomm Technologies International announced the new Qualcomm S3 Gen 3 and Qualcomm S5 Gen 3 Sound Platforms, designed to allow OEMs deliver sound experiences never before possible at the S5 and S3 tiers. All Gen 3 devices support Bluetooth LE Audio and Auracast. The mid-tier S3 Gen 3 Sound Platform now allows customizations via 3rd party solutions from the Qualcomm Voice & Music Extension Program. And now there is a new quality option with aptX Lossless at 24-bit/48kHz.

XMOS and DSP Concepts Partner to Accelerate Audio and Voice DSP Applications

March 25, 2024 by Joao Martins

XMOS and DSP Concepts Partner to Accelerate Audio and Voice DSP Applications

XMOS has announced a partnership with DSP Concepts, the company behind Audio Weaver. The UK AI and semiconductor experts have partnered with the Californian embedded audio software specialists to combine XMOS' highly-deterministic, low latency xcore.ai platform with DSP Concepts' Audio Weaver software. The combined solution enables developers to graphically design and debug audio and voice solutions utilizing multicores easily from one single canvas.

SoundHound On-Chip Voice AI Enabled by NVIDIA DRIVE

March 19, 2024 by Joao Martins

SoundHound On-Chip Voice AI Enabled by NVIDIA DRIVE

SoundHound AI is evolving its approach with voice artificial intelligence (Voice AI) and announced a completely new implementation of an in-vehicle voice assistant that uses a large language model (LLM) completely on the edge, running on the NVIDIA DRIVE platform. The solution combines SoundHound Chat AI running completely on-device and delivers Generative AI with no connectivity required for speech-to-meaning voice interactions.

Capture Adaptive Audio Intelligence in audioXpress February 2024

January 9, 2024 by audioXpress Staff

Capture Adaptive Audio Intelligence in audioXpress February 2024

In the February 2024 issue of audioXpress read the latest on AI, Adaptive Audio Enhancement, and Noise Cancellation, Microphones, and Voice Capture. René Christensen writes about Acoustical Shape Optimization, and Richard Honeycutt writes about Sustainable Acoustical Products. David Ralph writes about Duelund vs. Linkwitz-Riley crossovers, and Paul Kittinger explains how to build the Duetta Transmission-Line speakers. Chris Paul writes about A Better Beta Follower amplifier, while Richard Honeycutt puts together an Imaginary Silvertec Guitar Amplifier.

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