All items tagged with edge AI (114)

Cadence Extends Popular Tensilica Vision and AI DSP IP Product Line with New DSPs for Automotive, Mobile and Consumer Markets

April 26, 2021 by audioXpress Staff

Cadence Extends Popular Tensilica Vision and AI DSP IP Product Line with New DSPs for Automotive, Mobile and Consumer Markets

Cadence Design Systems expanded its popular Tensilica Vision DSP product family with the debut of two new DSP IP cores for demanding and always-on AI applications. The Tensilica Vision P1 DSP is optimized for always-on and smart sensor applications in the consumer market, providing an energy-efficient solution. Packing an industry-leading 3.8 tera operations per second (TOPS), the flagship Cadence Tensilica Vision Q8 DSP delivers 2X performance and memory bandwidth compared to the Tensilica Vision Q7 DSP.

Libre Wireless Forms Strategic Alliance with Knowles Corporation on MAVID Voice AI Platform

March 17, 2021 by audioXpress Staff

Libre Wireless Forms Strategic Alliance with Knowles Corporation on MAVID Voice AI Platform

Leading embedded wireless voice/AI solutions provider Libre Wireless Technologies announced a strategic alliance with Knowles Corporation to jointly promote and market new solutions based on the MAVID (Multiprotocol-Audio-Voice-IoT-Devices) platform. These miniature-sized and low power mic-to-cloud edge voice/AI computing solutions now feature Knowles' micro-acoustic microphones and speaker technology, optimized for smart product development.

QuickLogic Releases Amazon-Qualified Alexa Reference Design for Hearables

March 4, 2021 by audioXpress Staff

QuickLogic Releases Amazon-Qualified Alexa Reference Design for Hearables

QuickLogic released an Amazon-qualified QuickFeather AVS Reference Design that enables OEMs and ODMs to evaluate and develop their own smart hearable products quickly and easily. This kit integrates the Alexa voice-initiated Close-Talk experience, enabling a broad set of battery-powered applications to communicate directly with Alexa for a multitude of use cases. In addition, OEMs and ODMs can optionally integrate multiple AI-based motion, sound and other AI use cases based on SensiML’s AI Software Platform, which already has native support for the development kit.

Knowles Releases Bluetooth Standard Solution Development Kit to Speed up Voice Integration

February 24, 2021 by audioXpress Staff

Knowles Releases Bluetooth Standard Solution Development Kit to Speed up Voice Integration

Knowles Corporation, a leading provider of advanced micro-acoustic microphones and speakers, audio processing, and precision device solutions, announced the AISonic Bluetooth Standard Solution, a complete development kit that enables fast voice integration to Bluetooth devices. The kit is built upon the Knowles AISonic Audio Edge Processor IA8201, a high-performance, ultra-low power audio-centric OpenDSP, and includes SDK, pre-integrated mics, and integration support for Bluetooth chips.

Picovoice Announces Voice Interfaces on the Edge With German Language Support and Plans to Go Multilingual

February 11, 2021 by Joao Martins

Picovoice Announces Voice Interfaces on the Edge With German Language Support and Plans to Go Multilingual

Picovoice, a young company developing voice AI on the edge with on-device speech recognition and natural language understanding software, announced a new SDK for German language. The company allows developers to create and fully test voice experiences directly on its recently launched Picovoice Console platform, before exporting models that can run on-device with minimal latency. Picovoice also announced plans to release SDKs for French, Spanish, and Japanese.

Teradyne Supports Syntiant's Successful Edge AI Strategy

January 13, 2021 by audioXpress Staff

Teradyne Supports Syntiant's Successful Edge AI Strategy

Teradyne, a leading supplier of automated test solutions, announced that the company’s UltraFLEX test platform has enabled Syntiant to successfully ship more than 10 millions of its microwatt-power, deep learning Neural Decision Processors (NPDs) to customers worldwide. The Teradyne UltraFLEX test solution is also currently supporting the qualification and production ramp of the latest Syntiant NDP120 and Syntiant NDP121 Neural Decision Processors.

Renesas Combines Cyberon Algorithm in New Voice Recognition and Smart Control Reference Design

December 30, 2020 by audioXpress Staff

Renesas Combines Cyberon Algorithm in New Voice Recognition and Smart Control Reference Design

Renesas has announced a new reference design and combined solution for the development of voice recognition applications. The company offers an offline voice recognition algorithm that performs real time control, the Cyberon CSpotter, in a reference design that incorporates a low cost, ultra-low power RA6M1 MCU, a ISL32743E isolated high-speed RS-485 transceiver, an ISL80505 high-performance 0.5A LDO and a PS2561F-1 optically coupled UL approved isolator.

Qualcomm Unveils Snapdragon 888 Mobile Processing Platform

December 3, 2020 by Joao Martins

Qualcomm Unveils Snapdragon 888 Mobile Processing Platform

During the annual Snapdragon Tech Summit Digital 2020, Qualcomm introduced its latest flagship Qualcomm Snapdragon 888 5G Mobile Platform, which will set the benchmark for flagship Android smartphones in 2021. This new platform packs industry-leading mobile innovations in 5G, artificial intelligence (AI), gaming, and camera technologies, while offering all the processing and connectivity power to enable next-generation immersive audio experiences, including support for Bluetooth 5.2 with LE Audio features.

DSP Group Announces Support of TensorFlow Lite for Microcontrollers on its DBMD7 AI/ML SoC

October 22, 2020 by audioXpress Staff

DSP Group Announces Support of TensorFlow Lite for Microcontrollers on its DBMD7 AI/ML SoC

DSP Group announced TensorFlow Lite for Microcontrollers SDK support for its DBMD7 family of low-cost, high-performance, multicore AI and DSP processors. The SDK for the DBMD7 allows developers of AI and high-performance machine learning applications on edge devices to avoid latencies and ensure end-user privacy devices to cost-effectively deploy high-performance machine learning (ML) inference at the edge to avoid network latencies, minimize power consumption, ensure end-user privacy, and free up scarce network bandwidth.

Imagimob Edge Makes TensorFlow AI Models Edge Device-Ready at the Click of a Button

October 19, 2020 by audioXpress Staff

Imagimob Edge Makes TensorFlow AI Models Edge Device-Ready at the Click of a Button

Imagimob, a company based in Stockholm, Sweden, developing artificial intelligence products for edge devices, announced a new SaaS solution that accelerates time to market for edge devices by converting h5 formatted AI models into ultra-efficient C-code in a matter of seconds — a process that once took weeks to complete. The new Imagimob Edge solution requires no programming skills and targets processing and interpreting sensor data in real time using trained models, a critical application in wearables and all sorts of connected devices.

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