All items tagged with digital signal processing (146)
Voice Coil August 2024 Is Ready for You!
July 26, 2024 by audioXpress Staff

Voice Coil August 2024 Is Ready for You!

In this issue, Vance Dickason kicks off a series of outboard DSP processor reviews, starting with the Danville dspNexus. Next, Claus Futtrup writes about the Critically Damped Fourth-Order (CD4) bass reflex alignment. As scheduled, Mike Klasco writes about New Materials and Technologies for Voice Coils, and there's an updated directory of 2024 Voice Coil winders, converters, lead out wire, and more. On Test Bench, Vance Dickason assesses the new B&C Speakers DH450-8 1" compression driver and the Stereo Integrity M3 3.5" carbon midrange driver.
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Realtek Semiconductor and Alango Technologies Partner to Offer Advanced Solution for In-Car Communication
July 12, 2024 by Joao Martins

Realtek Semiconductor and Alango Technologies Partner to Offer Advanced Solution for In-Car Communication

Realtek Semiconductor and Alango Technologies, have announced a collaboration to deliver a joint solution aimed at facilitating In-Car Communication (ICC) between the driver and passengers to improve safety, convenience, and overall satisfaction during travel. According to Alango, the solution uses its ICC software package ported and optimized for the Realtek ALC5575 audio processor. The Alango ICC technology suite running on ALC5575 was successfully demonstrated by Realtek to Computex visitors in June 2024.
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Audison Boosts In Car DSP with New Auto-Tuning Software
July 9, 2024 by audioXpress Staff

Audison Boosts In Car DSP with New Auto-Tuning Software

Audison, the renowned Italian car audio brand owned by Elettromedia Group, announced the release of its highly anticipated bit Drive 2.0 update for DSP products, featuring ACCORDO, an auto-tuning software tool. According to Audison, this cutting-edge technology auto-tunes car audio systems with time and phase alignment to a target curve with a simple step-by-step process. The solution only requires one microphone and no additional expensive external hardware.
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Fulcrum Acoustic Showcases New Products and Technologies at InfoComm 2024
June 10, 2024 by Alfred Moody

Fulcrum Acoustic Showcases New Products and Technologies at InfoComm 2024

InfoComm 2024 will be a decisive moment for Fulcrum Acoustic, following the creation of its Fulcrum Immersive division, and the acquisition of Venueflex digital signal processing systems, allowing the company to enter the growing immersive audio and active acoustics market. For InfoComm, Fulcrum brings new RX series installation speakers, upgraded Fulcrum One software, and advanced digital signal processors supporting object-based mixing and active acoustics technologies.
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Tymphany Peerless Flow DSP Audio Development Platform
May 17, 2024 by Joao Martins

Tymphany Peerless Flow DSP Audio Development Platform

To support the growing number of projects that Tymphany is involved with, encompassing transducers, amplification, DSP, and fully integrated systems for pro audio, consumer or automotive, the company created its own software platform for prototyping, tuning and deployment. Tymphany Peerless Flow DSP is a new software development platform with a library of algorithms and a user-friendly interface that eliminates the need for coding, thus reducing time to market.
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5th International AES Conference on Automotive Audio, June 26-28, 2024
March 8, 2024 by Joao Martins

5th International AES Conference on Automotive Audio, June 26-28, 2024

The next Audio Engineering Society’s biennial conference on Automotive Audio will be held in Gothenburg, Sweden, from 26-28 June. The location is the Uni3 Geely Center, right at the heart of Volvo headquarters. With the 2024 event of this popular international conference approaching, the organizing committee is reporting strong industry support and anticipation for a very strong program, and great car demos.
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KEF Announces New Additions to Subwoofer Lineup: KC92 and KUBE MIE
February 20, 2024 by Alfred Moody

KEF Announces New Additions to Subwoofer Lineup: KC92 and KUBE MIE

Leveraging its recent innovations in transducer engineering since the launch of the extremely successful KC62 powered subwoofer with force-canceling and Uni-Core technologies, KEF is now taking its bass to a whole new level with the new KC92 Force-Cancelling Subwoofer and four new models in the Kube MIE Subwoofer Series - the Kube 8 MIE, Kube 10 MIE, Kube 12 MIE, and Kube 15 MIE. A wide range of subwoofer options to ensure the most visceral experiences in modern home audio.
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Meridian Audio Debuts Next-Generation DSP Audio Technologies at CES 2024
January 8, 2024 by Joao Martins

Meridian Audio Debuts Next-Generation DSP Audio Technologies at CES 2024

During CES 2024, British audio pioneer Meridian Audio will demonstrate the ability of next-generation digital signal processing technologies to substantially upgrade the immersive listening experiences achieved by existing premium hardware. Meridian will present solutions to address the acoustic challenges in Electric Vehicles, second-generation vibrohaptics, next-generation DSP modules, at par with new consumer concepts for soundbars and home audio solutions.
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BdSound Joins Forces with DSP Concepts to Streamline Automotive Deployment with Audio Weaver
December 28, 2023 by Joao Martins

BdSound Joins Forces with DSP Concepts to Streamline Automotive Deployment with Audio Weaver

BdSound, a leading provider of audio and voice processing technology for noise reduction, speech enhancement, and automotive applications, has unveiled a strategic partnership with DSP Concepts, combining their expertise to address the growing complexities in automotive audio development. The collaboration delivers BdSound's speech processing technology, offering OEMs and integrators a streamlined deployment using DSP Concepts' Audio Weaver audio development platform.
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Ceva Launches New Brand Identity Reflecting its Focus on Smart Edge IP Innovation
December 6, 2023 by audioXpress Staff

Ceva Launches New Brand Identity Reflecting its Focus on Smart Edge IP Innovation

Ceva, Inc., introduced a fresh new brand visual identity, logo design and web domain ”ceva-ip.com,” reflecting the company’s commitment to "being the partner of choice for transformative IP solutions that power the smart edge." Ceva is a leading provider of silicon and software IP that makes it possible for low power Edge AI devices to connect, sense and infer data, reliably and efficiently, across multiple high-growth end markets.
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