All items tagged with chipsets (12)

Feasycom and Nordic Semiconductor Unveil Dual-Mode Module Supporting Bluetooth Classic and LE Audio

December 14, 2023 by Joao Martins

Feasycom and Nordic Semiconductor Unveil Dual-Mode Module Supporting Bluetooth Classic and LE Audio

Nordic Semiconductor says it is shipping more than 1 million Bluetooth LE System-On-Chips (SoCs) every day, claiming market leadership in the emerging category. Expanding on the range of complete solutions for building LE Audio products, Nordic's nRF5340 dual-core SoC was designed to meet all requirements of LE Audio development. Using this SoC, Shenzhen Feasycom launched its FSC-BT631D advanced wireless audio module for dual-mode Bluetooth Classic audio and LE Audio product designs.

MediaTek Expands Wi-Fi and Bluetooth 5.4 Portfolio with New Chipsets for Mainstream Devices

November 21, 2023 by audioXpress Staff

MediaTek Expands Wi-Fi and Bluetooth 5.4 Portfolio with New Chipsets for Mainstream Devices

MediaTek, one of the first adopters of the upcoming Wi-Fi 7 technology, now has the industry's most comprehensive Wi-Fi 7 portfolio with the introduction of the latest Filogic 860 and Filogic 360 solutions. Together, these second-generation additions aim to further expand MediaTek's platform of cutting-edge products that utilize the latest technology advancements in connectivity while achieving peak performance and always-on reliability.

FiRa Consortium Publishes 2.0 Technical Specifications for UWB Technology

November 1, 2023 by audioXpress Staff

FiRa Consortium Publishes 2.0 Technical Specifications for UWB Technology

FiRa Consortium, the organization that defines the specifications and ensures ecosystem interoperability of products and services utilizing UWB technology, has announced a major advancement of its technical specifications. With the publication of FiRa 2.0 Technical Specifications, the consortium is furthering the scope and interoperability of the ultra-wideband ecosystem, introducing new use cases that include Point and Trigger features that lets users control UWB-enabled connected systems, such as TVs or smart speakers.

Dirac Appoints Emelie Gessner Gozzi as Chief Marketing Officer

February 17, 2023 by audioXpress Staff

Dirac Appoints Emelie Gessner Gozzi as Chief Marketing Officer

Swedish digital audio pioneer Dirac announced the expansion of its senior leadership team with the appointment of Emelie Gessner Gozzi as Chief Marketing Officer (CMO). Reporting directly to CEO Peter Friedrichsen, Gessner Gozzi will lead a growing internal and external marketing team in the development and implementation of a brand strategy to align the marketing and communications programs across the company’s core markets – automotive, home theater, headphones, mobile and streaming.

Dirac-Enabled BES Chipsets Now Available To Global Headphone Manufacturers

January 19, 2023 by audioXpress Staff

Dirac-Enabled BES Chipsets Now Available To Global Headphone Manufacturers

Swedish digital audio processing pioneer Dirac and leading multinational chipset maker BES announced a partnership to pre-integrate the Dirac Virtuo and Dirac Opteo software onto BES chipsets to be used by leading headphone manufacturers to deliver optimized performance in any headphone type. The announcement was made at CES 2023, where it was confirmed that boAt, Monoprice, and Sudio are the first headphone brands to leverage these Dirac-enabled BES chipsets in their devices.

Renesas Lays Out Roadmap for Wi-Fi 6/6E and 7 Chipsets

November 18, 2022 by Joao Martins

Renesas Lays Out Roadmap for Wi-Fi 6/6E and 7 Chipsets

During the electronica 2022 show in Munich, Germany, Renesas Electronics unveiled plans to deliver a comprehensive set of advanced Wi-Fi offerings to complement its broad portfolio of industrial and connected products. In 2021, Renesas completed its acquisition of Celeno, a company from Israel specializing in wireless communication solutions, including advanced Wi-Fi chipsets for high-performance home networks, and is leveraging that technology to address a wide range WLAN access point applications for Wi-Fi 6/6E and Wi-Fi 7.

Qualcomm Announces Snapdragon Sound S5 and S3 Gen 2 Chipsets for Bluetooth LE Audio Products

November 17, 2022 by Joao Martins

Qualcomm Announces Snapdragon Sound S5 and S3 Gen 2 Chipsets for Bluetooth LE Audio Products

During its Snapdragon Summit 2022, Qualcomm unveiled the latest generation of Snapdragon processors and chips that will power mobile devices, wearables and countless consumer electronics and audio devices to be introduced in 2023. The Snapdragon S5 Gen 2, and the Snapdragon S3 Gen 2 Bluetooth audio chipsets are the evolution from the devices announced in 2022, designed to support Bluetooth LE Audio.

MediaTek Launches Flagship Dimensity 9200 Smartphone Chipset with Support for Bluetooth LE Audio

November 9, 2022 by audioXpress Staff

MediaTek Launches Flagship Dimensity 9200 Smartphone Chipset with Support for Bluetooth LE Audio

MediaTek launched the Dimensity 9200, its latest 5G chipset powering the next era of flagship smartphones. Boasting extreme performance and intelligent power efficiency, the new SoC brings immersive all-day gaming experiences, ultra-sharp image capturing and support for both mmWave 5G and sub-6GHz connectivity to consumers around the globe. Most importantly for the audio industry, this new solution will bring Bluetooth LE Audio support to many smartphones in 2023.

MediaTek Announces New Filogic 830 and Filogic 630 Wi-Fi 6/6E Chips

October 1, 2021 by audioXpress Staff

MediaTek Announces New Filogic 830 and Filogic 630 Wi-Fi 6/6E Chips

MediaTek unveiled its new Filogic connectivity family with the introduction of the Filogic 830 Wi-Fi 6/6E system-on-chip (SoC) and Filogic 630 Wi-Fi 6E network interface card (NIC) solutions. The highly integrated chipsets offer fast, reliable connectivity with enhanced performance for broadband routers, mesh systems, enterprise access points and retail routers. Two high-performance, power-efficient Wi-Fi 6/6E chipsets with high computation capabilities and a rich set of features.

Knowles Releases Bluetooth Standard Solution Development Kit to Speed up Voice Integration

February 24, 2021 by audioXpress Staff

Knowles Releases Bluetooth Standard Solution Development Kit to Speed up Voice Integration

Knowles Corporation, a leading provider of advanced micro-acoustic microphones and speakers, audio processing, and precision device solutions, announced the AISonic Bluetooth Standard Solution, a complete development kit that enables fast voice integration to Bluetooth devices. The kit is built upon the Knowles AISonic Audio Edge Processor IA8201, a high-performance, ultra-low power audio-centric OpenDSP, and includes SDK, pre-integrated mics, and integration support for Bluetooth chips.

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