Knowles Releases Bluetooth Standard Solution Development Kit to Speed up Voice Integration

Knowles Corporation, a leading provider of advanced micro-acoustic microphones and speakers, audio processing, and precision device solutions, announced the AISonic Bluetooth Standard Solution, a complete development kit that enables fast voice integration to Bluetooth devices. The kit is built upon the Knowles AISonic Audio Edge Processor IA8201, a high-performance, ultra-low power audio-centric OpenDSP, and includes SDK, pre-integrated mics, and integration support for Bluetooth chips.

Tempow, the Bluetooth-specialist, Paris-based startup, announced a new partnership with Zhuhai Jieli Technology, a leading chipset manufacturer in the TWS Bluetooth SoC segment. Jieli Technology is joining Tempow's chipset partner program to deploy TempowOS, an operating system for True Wireless Earbuds, on its flagship AC897N and AD697N extreme low power Bluetooth TWS solutions.

Swedish digital audio pioneer Dirac and OSM Group, a global designer, developer and manufacturer have entered into an agreement to include Dirac’s industry-leading spatial audio solution in headphones created by OSM for its global portfolio of electronics customers. Under the terms of the agreement, OSM Group will license the Dirac spatial audio solution for integration into headphones that the company develops for leading brands around the world.