All items tagged with CEVA (94)

December 6, 2023 by audioXpress Staff

Ceva Launches New Brand Identity Reflecting its Focus on Smart Edge IP Innovation

Ceva, Inc., introduced a fresh new brand visual identity, logo design and web domain ”ceva-ip.com,” reflecting the company’s commitment to "being the partner of choice for transformative IP solutions that power the smart edge." Ceva is a leading provider of silicon and software IP that makes it possible for low power Edge AI devices to connect, sense and infer data, reliably and efficiently, across multiple high-growth end markets.

CEVA Doubles Down on Generative AI with Enhanced NeuPro-M NPU IP Family

August 18, 2023 by audioXpress Staff

CEVA Doubles Down on Generative AI with Enhanced NeuPro-M NPU IP Family

CEVA announced its enhanced NeuPro-M NPU family, directly addressing the processing needs of the next era of Generative AI with industry-leading performance and power efficiency for any AI inferencing workload, from cloud to the edge. The new NeuPro-M processor family delivers an industry leading 350 TOPS/Watt to bring the power of generative AI to any application, including for consumer and mobile markets, with exceptional cost and power efficiency.

CEVA Introduces Channel Sounding over Bluetooth to Enable High-Accuracy Secure Positioning

June 30, 2023 by audioXpress Staff

CEVA Introduces Channel Sounding over Bluetooth to Enable High-Accuracy Secure Positioning

CEVA has announced support for Channel Sounding to its RivieraWaves Bluetooth IP portfolio, meeting the surging demand for high-accuracy secure positioning in the automotive, industrial and broader connected devices markets. This low power positioning technology is ideal for secure distance bounding applications such as secure vehicle entry, access control, asset tracking, and more.

Low-Latency Gaming and Hearing-Aids - Next Drivers for Bluetooth Low Energy and LE Audio

June 1, 2023 by Morag Agmon

Low-Latency Gaming and Hearing-Aids - Next Drivers for Bluetooth Low Energy and LE Audio

Bluetooth LE Audio is creating exciting new product development opportunities! Typical audio latency with LC3, and additional capabilities for robustness, extremely low delay, and high-resolution audio with LC3plus are important drivers to encourage manufacturers in the transition. In this article for The Audio Voice, Morag Agmon (CEVA) why your next Bluetooth products need to support LE Audio and why latency is a core driver in gaming and hearing aids applications.

CEVA Acquires Spatial Audio Business from VisiSonics

May 10, 2023 by Joao Martins

CEVA Acquires Spatial Audio Business from VisiSonics

CEVA announced the acquisition of the RealSpace 3D Spatial Audio business, technology and patents from VisiSonics Corporation. The acquisition of RealSpace enables CEVA to offer a complete spatial audio solution to OEMs, targeting high volume markets including true wireless stereo, OTC hearables, gaming headphones, AR/VR, audio conferencing, automotive and media entertainment.

Hearables, Headphones Testing, Audio Electronics, and More in audioXpress April 2023

March 10, 2023 by audioXpress Staff

Hearables, Headphones Testing, Audio Electronics, and More in audioXpress April 2023

Want to understand what's ahead in the most revolutionary audio product category of the 21st century? Read the State of the Hearables Industry Market Update. And for product developers and manufacturers, there's also a Headphones Test and Measurement report. Burkhard Vogel discusses op-amp noise in simulated models, Bruce E. Gillingham offers a complete monoblock power amplifier project, and René Christensen writes about acoustic topology optimization. And so much more....

OPPO Unveils 12Mbps Data Rate Bluetooth Wireless Audio SoC at MWC 2023

March 2, 2023 by Joao Martins

OPPO Unveils 12Mbps Data Rate Bluetooth Wireless Audio SoC at MWC 2023

On the opening day of Mobile World Congress (MWC) 2023 in Barcelona, OPPO announced a selection of flagship devices, new core connectivity products and technologies, as well as its latest R&D breakthroughs in chip technology. On the audio domain, OPPO promised to revolutionize the industry and leave Bluetooth limitations behind with its MariSilicon Y flagship audio SoC. A world first for Bluetooth wireless audio, the new SoC promises a 12Mbps data rate.

Bluetooth SIG Promotes First Ever Auracast Experience at MWC 2023 in Barcelona

March 2, 2023 by Joao Martins

Bluetooth SIG Promotes First Ever Auracast Experience at MWC 2023 in Barcelona

In 2022, the Bluetooth Special Interest Group (SIG) announced the Auracast extension of the Bluetooth LE Audio specifications, combining audio sharing and broadcast audio into a new term that would make it easier to promote. The audio innovation promises to propel audio streaming forward by letting users share their audio or select from publicly available Auracast wireless audio streams. At Mobile World Congress (MWC) 2023 in Barcelona the technology was demonstrated in a practical manner for the very first time.

Wireless Audio and Bluetooth LE Audio - Assistance, Hearables, and Headphones 3.0

February 16, 2023 by Joao Martins

Wireless Audio and Bluetooth LE Audio - Assistance, Hearables, and Headphones 3.0

What happened at CES 2023 related to wireless audio and Bluetooth LE Audio. And what might happen at MWC 2023. And why there's lots more happening in assistance, hearables, and Headphones 3.0. This article discusses Bluetooth LE Audio and Android 13. Bluetooth 5.4 updates. Sennheiser's MobileConnect Assistive Listening app that actually works over Wi-Fi. Sonical, Antennaware, et all, Headphone 3.0. UWB, and high-quality wireless audio. Originally published in The Audio Voice 410, February 16 2023.

CEVA Audio DSPs and Audio Front-End Software Available Through Intel Pathfinder for RISC-V Program

December 12, 2022 by audioXpress Staff

CEVA Audio DSPs and Audio Front-End Software Available Through Intel Pathfinder for RISC-V Program

CEVA announced that it will make its CEVA-BX1 and CEVA-BX2 Audio DSPs and audio front-end software stack available for commercial developers through the Intel Pathfinder for RISC-V ecosystem. A Strategic Member of RISC-V International, CEVA is making its audio DSPs and software stack accessible for prototyping and production design through the Intel FPGA based pre-silicon development platform.

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