All items tagged with automotive (294)
MIPI I3C v1.1 Update for I2C Implementers Simplifies Development for Wearables and Connected Devices
January 20, 2020 by audioXpress Staff

MIPI I3C v1.1 Update for I2C Implementers Simplifies Development for Wearables and Connected Devices

The MIPI Alliance, the international organization that develops interface specifications for mobile and mobile-influenced industries, announced MIPI I3C v1.1, the first update to the interface that eliminates the historical pain points of I2C development. MIPI I3C v1.1 is a scalable, medium-speed, utility and control bus that connects peripherals to an application processor, streamlining integration and improving cost efficiencies in development.
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Noveto Systems to Unveil New Smart Audio Chip-Based Focused Sound Solutions at CES 2020
January 3, 2020 by audioXpress Staff

Noveto Systems to Unveil New Smart Audio Chip-Based Focused Sound Solutions at CES 2020

Noveto Systems took CES 2018 by storm when it demonstrated its technology allowing completely focused audio beams for conferencing, automotive and entertainment zoning applications. Now, the company returns in 2020 to release the first part of its Chipset driving Noveto Smart Audio, the world's first dynamic focused sound solution, enabling to precisely generate sound to the users' ears. With the chip introduction, Noveto will debut some product concepts for Gaming and Entertainment, including a Home System for 3D sound.
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Redefining the Shape of Sound: Resonado Introduces Flat Core Speaker Technology at CES 2020
December 19, 2019 by audioXpress Staff

Redefining the Shape of Sound: Resonado Introduces Flat Core Speaker Technology at CES 2020

Resonado, a South Bend, Indiana company founded at the University of Notre Dame, has a new take on electrodynamic speaker topology. The company developed a reconfigured speaker with a planar voice coil mounted perpendicularly to its flat “race track” diaphragm, to which Resonado calls Flat Core Speaker (FCS) technology. The ingenious architecture enables slightly thinner, lighter, and more efficient speakers than conventional equivalents. Applications are wide-ranging from soundbars, home theater, column speakers, automotive to headphone drivers.
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Valens In-Vehicle Ultra-High-Speed Connectivity Chipsets Receive CES Innovation Awards Recognition
November 13, 2019 by audioXpress Staff

Valens In-Vehicle Ultra-High-Speed Connectivity Chipsets Receive CES Innovation Awards Recognition

Valens, the company behind HDBase-T connectivity, the "de facto" standard adopted in the AV industry, is now pushing the technology for automotive applications since launching its latest VA6000 HDBaseT integrated circuit, combining 1Gbps Ethernet transmission, Audio, Serial Control, and USB over unshielded single twisted pair lower cost cables. The technology was now confirmed a CES 2020 Innovation Awards Honoree.
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Hi Auto Demonstrates Audio-Visual Speaker Separation Solution Following a $4.5 Million Seed Round
November 7, 2019 by audioXpress Staff

Hi Auto Demonstrates Audio-Visual Speaker Separation Solution Following a $4.5 Million Seed Round

Speech recognition platforms suffer from poor recognition rates in a noisy environment such as kids in the back seat of cars, radio, ambulance passing by, or heavy rain. Video conferencing becomes ineffective when one of the participants is in a noisy environment like a coffee shop. Israel’s Hi Auto developed a software-only speech enhancement and speaker separation system that eliminates the most challenging noises and focus only on the speaker.
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Audio Collaborative 2019 More Content, Speakers and Sponsors!
October 23, 2019 by audioXpress Staff

Audio Collaborative 2019 More Content, Speakers and Sponsors!

Wow! What a lineup for this year's Audio Collaborative conference! Promoted every year by market research firm Futuresource Consulting, Audio Collaborative is a premier must attend event for consumer audio, pro audio and entertainment industry professionals. This year dedicated to Content & Technology Evolution Spurring Innovation, Futuresource's Audio Collaborative 2019 event has an amazing lineup of speakers and activities confirmed. Plan to attend the sixth edition, taking place in London, November 7, 2019.
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Microchip Simplifies Power Delivery (PD) in Growing USB Type-C Charging Market
September 2, 2019 by audioXpress Staff

Microchip Simplifies Power Delivery (PD) in Growing USB Type-C Charging Market

USB Type-C has become increasingly popular, and with the introduction of Power Delivery (PD), it is now possible to charge more types of devices – and charge faster – than ever before. To remove the traditional complexity and high costs associated with implementing USB Type-C, Microchip Technology announced two new USB 3.1 solutions that simplify USB Type-C PD for a range of applications.
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AES International Automotive Audio Conference Announces Details for 2019 Events
August 19, 2019 by Audio Engineering_Society

AES International Automotive Audio Conference Announces Details for 2019 Events

Taking place September 11 – 13 at the Audi Driving Experience Center in Neuburg an der Donau (Bavaria), Germany, this year’s AES Automotive Audio Conference builds on the overwhelming success of its predecessors by gathering the leading global authorities in Automotive Audio for three days of in-depth examination of the latest trends, challenges and solutions in the field, plus exhibitions and demos showcasing the latest automotive audio technologies.
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Sennheiser Enters Automotive Sector Showing First In-Car AMBEO Sound System at Monterey Car Week
August 7, 2019 by audioXpress Staff

Sennheiser Enters Automotive Sector Showing First In-Car AMBEO Sound System at Monterey Car Week

Sennheiser developed an AMBEO immersive audio solution for in-car entertainment and communication in collaboration with Southern California-based luxury automaker, Karma Automotive. Engineered using highest-grade microphone and loudspeaker technology and 3D audio expertise, the AMBEO sound system provides impressively enveloping sound and clear audio for phone calls. The system can first be experienced as a technology showcase on a new 2020 Karma Revero GT during Monterey Car Week (August 15-18).
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HEAD acoustics Introduces coreA2B High-Performance Solution for Automotive Audio Performance Testing
August 6, 2019 by audioXpress Staff

HEAD acoustics Introduces coreA2B High-Performance Solution for Automotive Audio Performance Testing

Providing high-quality audio is an important part of modern audio systems in vehicles. For this purpose, Analog Devices has developed Automotive Audio Bus (A2B) technology, optimized for delivering superior audio quality. Now, HEAD acoustics launched coreA2B, a high-performance solution for testing audio performance on the A2B bus technology implemented on a measurement extension board for the company's multi-channel hardware platform labCORE.
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