All items tagged with audio DSP (11)

Dirac AudioIQ Now Supported by Asahi Kasei Microdevices’ Automotive DSPs

May 19, 2025 by Joao Martins

Dirac AudioIQ Now Supported by Asahi Kasei Microdevices’ Automotive DSPs

Asahi Kasei Microdevices (AKM) and Swedish digital audio processing pioneer Dirac have announced a partnership to integrate Dirac’s suite of software-defined smart acoustics solutions, AudioIQ, into AKM’s line of automotive audio digital signal processors (DSPs), including the flagship AK7709. The partnership provides OEMs and Tier 1 partners with a scalable suite of advanced algorithms as an embedded turnkey solution, significantly reducing tuning time while enhancing sound quality within vehicle interiors.

BdSound and NXP Announce Automotive Audio Partnership

June 20, 2024 by Joao Martins

BdSound and NXP Announce Automotive Audio Partnership

BdSound and NXP Semiconductors have joined forces to combine advanced audio signal processing and voice technology with NXP's latest automotive SAF9100 audio DSP device. BdSound aims to provide cutting-edge integrations to improve voice user experience in next-generation vehicles, through NXP’s recently announced high-performance SAF9100 audio DSP. This platform features dedicated neural-network engines that BdSound will be able to fully explore.

NXP Advances AI Audio Processing with SAF9xxx Audio DSPs

June 18, 2024 by Joao Martins

NXP Advances AI Audio Processing with SAF9xxx Audio DSPs

NXP Semiconductors is improving AI audio capabilities in automotive infotainment and marking a significant improvement in automotive audio processing technology in general with the latest SAF9xxx family of audio DSPs. Utilizing Cadence’s latest generation high-performance Tensilica HiFi 5 DSPs, combined with dedicated neural-network engines, the SAF9xxx audio DSPs enable efficient implementation of next-generation, high-quality, self-learning audio and speech applications.

Sonical and Sigma Connectivity Accelerate Hearables Product Development

April 2, 2024 by Joao Martins

Sonical and Sigma Connectivity Accelerate Hearables Product Development

Sonical, the company pioneering a fully integrated approach for the product development of headphones and hearables, with a real-time operating system that allows consumers to load their own apps has confirmed a development partnership with Sigma Connectivity, the leading Swedish technology design and engineering house. Sigma will help Sonical accelerate the market transition to Headphone 3.0 and the adoption of user driven wearable audio devices.

Waves Audio Awarded with Engineering, Science & Technology Emmy for Voice Cleaning Engine

August 17, 2023 by Joao Martins

Waves Audio Awarded with Engineering, Science & Technology Emmy for Voice Cleaning Engine

The Television Academy announced the recipients of the 75th Engineering, Science & Technology Emmy Awards honoring an individual, company or organization for developments in broadcast technology. Waves was one of the companies distinguished this year with an Emmy for an audio product or technology, in this case for the Clarity Vx Pro noise-reduction plugin that uses a Neural Networks engine developed by Waves to separate dialog from ambience at the highest quality.

Updated AES70-2023 Standard Presented by OCA Alliance at ISE 2023

January 23, 2023 by Joao Martins

Updated AES70-2023 Standard Presented by OCA Alliance at ISE 2023

The OCA Alliance is heading to Integrated Systems Europe 2023 in Barcelona to promote the latest AES70-2023 set of updates to the AES70 open control and monitoring standard for professional audio and AV media network devices. The AES70-2023 standard brings new features, options, usability and flexibility additions, being fully backwards compatible with all existing AES70 devices. The updates implement important adaptations to work with standard media transports and meet emerging industry requirements.

CEVA Audio DSPs and Audio Front-End Software Available Through Intel Pathfinder for RISC-V Program

December 12, 2022 by audioXpress Staff

CEVA Audio DSPs and Audio Front-End Software Available Through Intel Pathfinder for RISC-V Program

CEVA announced that it will make its CEVA-BX1 and CEVA-BX2 Audio DSPs and audio front-end software stack available for commercial developers through the Intel Pathfinder for RISC-V ecosystem. A Strategic Member of RISC-V International, CEVA is making its audio DSPs and software stack accessible for prototyping and production design through the Intel FPGA based pre-silicon development platform.

Get the Lowdown on Audio and DSP with audioXpress November 2021

October 12, 2021 by audioXpress Staff

Get the Lowdown on Audio and DSP with audioXpress November 2021

The November 2021 edition of audioXpress looks at the latest industry trends in digital signal processing, and enabling fully adaptive audio DSP experiences. Roger Shively (JJR Acoustics) writes about how the unique acoustic space of the car interior can be defined by the use of DSP, and Al Clark (CEO, Danville Signal Processing) shares his company’s journey into the development of the dspNexus DSP Audio Processor. Now available for viewing online, download and in print.

Agreement Between DSP Concepts and Cambridge Consultants Accelerates Audio Product Development and Voice Innovation

January 8, 2021 by Joao Martins

Agreement Between DSP Concepts and Cambridge Consultants Accelerates Audio Product Development and Voice Innovation

Cambridge Consultants, part of Capgemini, and DSP Concepts, the creators of Audio Weaver, the audio DSP platform powering some of the world’s best consumer and automotive brands, announced an agreement that will see Cambridge Consultants offering deep audio product development expertise and technology to the many audio brands in the fast-growing DSP Concepts ecosystem. Cambridge Consultants will be also adding its own voice detection processing to Audio Weaver.

October 20, 2020 by audioXpress Staff

MPEG-H 3D Audio Baseline Profile Now Supported by Analog Devices’ DSPs

Fraunhofer IIS announced that Analog Devices is offering certified decoder implementations supporting the new MPEG-H 3D Audio Baseline Profile on its ADSP-215xx series of audio digital signal processors (DSPs). Analog Devices's DSPs are used extensively for audio video receivers, soundbars, speakers and headphones. Adding MPEG-H 3D Audio Baseline Profile decoding capabilities to Analog Devices’ ADSP-215xx series of audio DSPs will bring immersive and personalized audio experiences to more consumers.

«
1
2
»