All items tagged with TDK (31)

CEVA Appoints Technology Industry Veteran Amir Panush as CEO Effective January 2023

November 9, 2022 by audioXpress Staff

CEVA Appoints Technology Industry Veteran Amir Panush as CEO Effective January 2023

After 17 years as CEO of CEVA and more than 32 years with the company, Gideon Wertheizer is set to retire at the end of the year. The CEVA board of directors has unanimously appointed Amir Panush as CEO effective January 1st, 2023. Wertheizer will continue to serve as an active member of CEVA’s board of directors and will be employed in an advisory role in the near term to ensure a smooth leadership transition.

Highly Anticipated Return for electronica 2022, November 15 to 18

November 8, 2022 by audioXpress Staff

Highly Anticipated Return for electronica 2022, November 15 to 18

electronica, the world’s leading trade fair and conference for electronics, will take place in 14 halls on the Munich exhibition grounds from November 15 to 18, 2022. This is a highly-anticipated return for a show that promises to reengage multiple critical sectors in development and manufacturing, after four years of absence. This year’s highlights in the electronica Conference will deal with Automotive, Embedded Platforms, Sensors, and Wireless Systems and Applications.

YOLE Group Offers Snapshot of MEMS Sensors and Actuators Market and Projects Trends for 2023

September 7, 2022 by audioXpress Staff

YOLE Group Offers Snapshot of MEMS Sensors and Actuators Market and Projects Trends for 2023

2021 was an exceptional year for MEMS companies, says YOLE Group, the international market analysis firm, which has just released its latest MEMS market report. The MEMS industry is expected to exceed the $22 billion mark five years from now, growing annually at about 9% between 2021 and 2027, the firm predicts. Interesting findings in the report indicated that Bosch continues to be the overall MEMS leader, while STMicroelectronics and TDK sales grew significantly in 2021.

TDK Expands SmartSound Family of Performance MEMS Microphones and Introduces New MEMS Microphone with SoundWire at CES 2022

January 11, 2022 by audioXpress Staff

TDK Expands SmartSound Family of Performance MEMS Microphones and Introduces New MEMS Microphone with SoundWire at CES 2022

TDK introduced new digital MEMS microphones as part of its SmartSound family of products for mobile, TWS, and other consumer devices, providing advanced feature sets in small package footprints. The T5848 offers the highest dynamic range with I2S direct audio connectivity to a wide variety of SoCs, MCUs and IoT processors. And TDK also introduced the T5828 MEMS microphone with MIPI SoundWire functionality, adding 68dBA SNR and Acoustic Activity Detect features with always-on ultra-low power mode.

Cambridge Mechatronics Announces Ultra-slim, High Precision Rotary Actuator

December 7, 2021 by Joao Martins

Cambridge Mechatronics Announces Ultra-slim, High Precision Rotary Actuator

Cambridge Mechatronics, a leading British company and developer of Shape Memory Alloy (SMA) actuators has developed a new ultra-slim, high precision rotary actuator product. The actuator characteristics include lightweight design, two thousand step positions per revolution and it is completely non-magnetic so it can operate in areas of high magnetic flux that might otherwise exclude conventional motor technologies. With a low profile of around 1mm, it can be used in the most space-constrained applications.

TDK InvenSense Expands Design Options With New SmartSound MEMS Microphones

July 1, 2021 by audioXpress Staff

TDK InvenSense Expands Design Options With New SmartSound MEMS Microphones

TDK introduced three new MEMS microphones as part of the SmartSound family of products for mobile and consumer connected devices. The new TDK T5919 is a high performance PDM digital MEMS microphone and is the first with built in particle ingress filter (PIF) for harsh environments. The new T3903 is a high performance PDM digital MEMS microphone with very low power and wide dynamic range, while the also T4086 is an analog output MEMS microphone in a tiny package, ideal for very space constrained applications.

TDK Launches Inductors for Small Power Systems in True Wireless Stereo Devices

March 29, 2021 by audioXpress Staff

TDK Launches Inductors for Small Power Systems in True Wireless Stereo Devices

TDK Corporation has developed the PLEA67 Series of inductors for use in true wireless stereo (TWS) devices. TDK’s original structure design and newly developed materials in the new thin-film power inductors achieve a rated current of 500mA in a small-sized component with an inductance of 2.2μH. The unique magnetic shield structure reduces magnetic flux leakage, while the low-loss magnetic material provides a highly efficient power supply circuit, ideal for small power supply and low power consumption Bluetooth LE modules.

MEMS and Other Leading-Edge Devices for Wearables - 2021 Update

March 23, 2021 by Mike Klasco

MEMS and Other Leading-Edge Devices for Wearables - 2021 Update

In this article for Voice Coil, Mike Klasco (Menlo Scientific) recaps MEMS Drivers and related hot technologies for 2021, providing an update about products and companies that stood out in 2020. The article, which summarizes the more extensive reports published by audioXpress in January 2020 and 2021, looks at the impact of microelectromechanical systems (MEMS) for audio and discusses the implications for other game-changing technologies that reduce size, increase performance, extend battery life, and enhance features and functionality in headphones, wearables and compact speakers.

CEVA Extends Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software

September 22, 2020 by audioXpress Staff

CEVA Extends Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software

In the wake of the acquisition of the Hillcrest Laboratories (Hillcrest Labs) business from InterDigital in mid-2019, CEVA now introduced the Hillcrest Labs MotionEngine Hear, a sensor and processor agnostic embedded software solution for hearable devices. The new solution allows SoC vendors, OEMs and ODMs to take advantage of a configurable sensor fusion platform to add intuitive user interface, gesture control, activity tracking and spatial audio capabilities to hearable devices.

TDK Unveils New Ultra-High AOP Analog MEMS Microphone Ideal for Noisy Environments

August 6, 2020 by audioXpress Staff

TDK Unveils New Ultra-High AOP Analog MEMS Microphone Ideal for Noisy Environments

TDK Corporation introduced the InvenSense ICS-40638 MEMS analog microphone, a new high-performance solution enabling clear audio capture in loud and noisy conditions, with an extended frequency response from 35 Hz to 20kHz. The ICS-40638 microphone offers an ultra-high Acoustic Overload Point (AOP) of 138 dB Sound Pressure Level (SPL), exceptionally efficient 170 µA low power operation and high Signal to Noise Ratio (SNR) of 63 dB in a small 3.5 mm x 2.65 mm x 0.98 mm bottom port surface‐mount package.

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