All items tagged with MEMS Microphones (127)
TDK InvenSense Expands Design Options With New SmartSound MEMS Microphones
July 1, 2021 by audioXpress Staff

TDK InvenSense Expands Design Options With New SmartSound MEMS Microphones

TDK introduced three new MEMS microphones as part of the SmartSound family of products for mobile and consumer connected devices. The new TDK T5919 is a high performance PDM digital MEMS microphone and is the first with built in particle ingress filter (PIF) for harsh environments. The new T3903 is a high performance PDM digital MEMS microphone with very low power and wide dynamic range, while the also T4086 is an analog output MEMS microphone in a tiny package, ideal for very space constrained applications.
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AIStorm and Knowles Join Forces to Create New Edge AI Audio Solutions
June 16, 2021 by audioXpress Staff

AIStorm and Knowles Join Forces to Create New Edge AI Audio Solutions

AIStorm, a pioneer of AI-in-Sensor SoCs for edge devices, announced a development partnership with Knowles Corporation. The collaboration will focus on achieving the lowest-power, highest-performance audio solutions available to enable emerging features. AIStorm’s patented analog and mixed-signal IP, combined with Knowles’ audio signal processing technology and advanced micro-acoustic microphones and speakers, bring enhanced audio features and power savings to mobile, true wireless stereo (TWS) earbuds, and connected devices.
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Infineon Introduces First AEC-Q103 Qualified High-Performance XENSIV MEMS Microphone for Automotive Applications
April 19, 2021 by audioXpress Staff

Infineon Introduces First AEC-Q103 Qualified High-Performance XENSIV MEMS Microphone for Automotive Applications

Infineon Technologies AG announced the launch of the XENSIV IM67D130A MEMS microphone. The high acoustic overload point (AOP) of 130 dB SPL allows the IM67130A to capture distortion-free audio signals in loud environments, whether in- or outside a vehicle. The microphone also has an increased operating temperature range from -40°C to +105°C to enable various use cases in harsh automotive environments, enabling advanced driver assistance systems and predictive maintenance applications.
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Amazon Introduces All-New True Wireless Echo Buds With Custom ANC
April 14, 2021 by Joao Martins

Amazon Introduces All-New True Wireless Echo Buds With Custom ANC

Amazon introduced the next-generation of Echo Buds, featuring an all-new design, premium audio architecture for crisp, balanced sound, custom-designed Active Noise Cancellation technology, wireless charging capabilities, improved microphones for better call quality, and hands-free access to Alexa. Not many bought the first model anyway, so the announcement of the all-new second-generation Echo Buds is not that surprising, considering Amazon considers hardware as a pure extension of its services ecosystem.
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Knowles Raises Standard of In-Cabin Audio With New Line of Automotive-Grade MEMS Microphones
April 8, 2021 by audioXpress Staff

Knowles Raises Standard of In-Cabin Audio With New Line of Automotive-Grade MEMS Microphones

Knowles Corporation announced the availability of two new SiSonic MEMS microphones for automotive applications: SPH1878 and SPH9855. The new best-in-class analog and digital microphones by Knowles are engineered to a higher standard of quality and supply assurance to support the increasing demands of the automotive market for hands free calling, advanced voice assistance and in-cabin noise cancellation for passenger comfort.
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Vesper Raises $8 Million to Expand Production and Enter New Markets
April 7, 2021 by audioXpress Staff

Vesper Raises $8 Million to Expand Production and Enter New Markets

Vesper, the pioneer in piezoelectric MEMS microphones and sensors, closed an $8M financing led by Applied Ventures, the venture capital arm of Applied Materials, the world’s largest semiconductor equipment company. Vesper also received investments from Accomplice, Amazon Alexa Fund, Bose Ventures, Sands Capital, and other undisclosed investors. The round brings Vesper's total funding to date to $65M. The funding will enable the Boston-based startup to scale the mass production of its microphones and support expanded research and development.
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Libre Wireless Forms Strategic Alliance with Knowles Corporation on MAVID Voice AI Platform
March 17, 2021 by audioXpress Staff

Libre Wireless Forms Strategic Alliance with Knowles Corporation on MAVID Voice AI Platform

Leading embedded wireless voice/AI solutions provider Libre Wireless Technologies announced a strategic alliance with Knowles Corporation to jointly promote and market new solutions based on the MAVID (Multiprotocol-Audio-Voice-IoT-Devices) platform. These miniature-sized and low power mic-to-cloud edge voice/AI computing solutions now feature Knowles' micro-acoustic microphones and speaker technology, optimized for smart product development.
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Developers Get Easy Access to Amazon Voice Services with OKdo and Qualcomm
February 24, 2021 by Cristina Costa

Developers Get Easy Access to Amazon Voice Services with OKdo and Qualcomm

OKdo, the global technology company from Electrocomponents, announced it is now supplying the Qualcomm Home Hub 100 Development Kit for Amazon Voice Services (AVS), a ready to use environment for voice-controlled applications in connected devices. Based on Qualcomm’s highly integrated, multi-mode System-on-Chip (SoC), the QCA4020, the Home Hub 100 kit is provided with pre-integrated software support for AVS, to help kickstart the development of voice-controlled applications.
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TDK Introduces Lowest Pulse Density Modulation Multi-Mode MEMS Microphone With Acoustic Activity Detect
January 13, 2021 by audioXpress Staff

TDK Introduces Lowest Pulse Density Modulation Multi-Mode MEMS Microphone With Acoustic Activity Detect

InvenSense, a TDK Group company, announced a comprehensive portfolio of new technology solutions during the 2021 Consumer Electronics Showcase. Among the expanded MEMS portfolio, the new T5838 SmartSound MEMS microphone offers a low power mode of just 130uAmps and a high-quality mode of 330uAmps, while supporting a dynamic range of 68dN SNR and 133dB AOP at 20kHz bandwidth. Optimized for smartphones, microphone arrays, smart speakers, and headsets, the T5838 supports configurable wake-on-sound at power levels as low as 20 µA.
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CUI Devices Adds Digital I2S Output Devices to MEMS Microphone Line
October 22, 2020 by audioXpress Staff

CUI Devices Adds Digital I2S Output Devices to MEMS Microphone Line

CUI Devices' Audio Group announced the addition of two new digital I2S output models to its comprehensive line of MEMS microphones. The bottom port CMM-3526D-261-I2S-TR and top port CMM-4030D-261-I2S-TR are housed in extremely compact, low profile packages measuring 3.50 x 2.65 x 0.98 mm and 4.00 x 3.00 x 1.25 mm, respectively. Thanks to their digital I2S interface, these MEMS microphones eliminate the need for a codec, allowing for the microphones to connect directly to digital signal processors and microcontrollers in an end application.
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