All items tagged with Invensense (25)

TDK Expands SmartSound Family of Performance MEMS Microphones and Introduces New MEMS Microphone with SoundWire at CES 2022

January 11, 2022 by audioXpress Staff

TDK Expands SmartSound Family of Performance MEMS Microphones and Introduces New MEMS Microphone with SoundWire at CES 2022

TDK introduced new digital MEMS microphones as part of its SmartSound family of products for mobile, TWS, and other consumer devices, providing advanced feature sets in small package footprints. The T5848 offers the highest dynamic range with I2S direct audio connectivity to a wide variety of SoCs, MCUs and IoT processors. And TDK also introduced the T5828 MEMS microphone with MIPI SoundWire functionality, adding 68dBA SNR and Acoustic Activity Detect features with always-on ultra-low power mode.

On-Device Voice Interfaces Driving Growth in MEMS and ECM Microphone Market

October 21, 2021 by audioXpress Staff

On-Device Voice Interfaces Driving Growth in MEMS and ECM Microphone Market

According to SAR Insight & Consulting, the market for MEMS and ECM microphones continues to see strong growth, with ten billion units shipped in 2020. This was driven by two main factors: increased use of voice interfaces and multiple microphones per device, according to SAR’s latest report “MEMS Microphones Focus: Market Growth, Mic Type, Input Type, SNR, Volume, Performance Density.” With the emergence of TWS, earbuds and headphones are now the second largest market.

TDK InvenSense Expands Design Options With New SmartSound MEMS Microphones

July 1, 2021 by audioXpress Staff

TDK InvenSense Expands Design Options With New SmartSound MEMS Microphones

TDK introduced three new MEMS microphones as part of the SmartSound family of products for mobile and consumer connected devices. The new TDK T5919 is a high performance PDM digital MEMS microphone and is the first with built in particle ingress filter (PIF) for harsh environments. The new T3903 is a high performance PDM digital MEMS microphone with very low power and wide dynamic range, while the also T4086 is an analog output MEMS microphone in a tiny package, ideal for very space constrained applications.

MEMS and Other Leading-Edge Devices for Wearables - 2021 Update

March 23, 2021 by Mike Klasco

MEMS and Other Leading-Edge Devices for Wearables - 2021 Update

In this article for Voice Coil, Mike Klasco (Menlo Scientific) recaps MEMS Drivers and related hot technologies for 2021, providing an update about products and companies that stood out in 2020. The article, which summarizes the more extensive reports published by audioXpress in January 2020 and 2021, looks at the impact of microelectromechanical systems (MEMS) for audio and discusses the implications for other game-changing technologies that reduce size, increase performance, extend battery life, and enhance features and functionality in headphones, wearables and compact speakers.

TDK Introduces Lowest Pulse Density Modulation Multi-Mode MEMS Microphone With Acoustic Activity Detect

January 13, 2021 by audioXpress Staff

TDK Introduces Lowest Pulse Density Modulation Multi-Mode MEMS Microphone With Acoustic Activity Detect

InvenSense, a TDK Group company, announced a comprehensive portfolio of new technology solutions during the 2021 Consumer Electronics Showcase. Among the expanded MEMS portfolio, the new T5838 SmartSound MEMS microphone offers a low power mode of just 130uAmps and a high-quality mode of 330uAmps, while supporting a dynamic range of 68dN SNR and 133dB AOP at 20kHz bandwidth. Optimized for smartphones, microphone arrays, smart speakers, and headsets, the T5838 supports configurable wake-on-sound at power levels as low as 20 µA.

CEVA Extends Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software

September 22, 2020 by audioXpress Staff

CEVA Extends Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software

In the wake of the acquisition of the Hillcrest Laboratories (Hillcrest Labs) business from InterDigital in mid-2019, CEVA now introduced the Hillcrest Labs MotionEngine Hear, a sensor and processor agnostic embedded software solution for hearable devices. The new solution allows SoC vendors, OEMs and ODMs to take advantage of a configurable sensor fusion platform to add intuitive user interface, gesture control, activity tracking and spatial audio capabilities to hearable devices.

TDK Unveils New Ultra-High AOP Analog MEMS Microphone Ideal for Noisy Environments

August 6, 2020 by audioXpress Staff

TDK Unveils New Ultra-High AOP Analog MEMS Microphone Ideal for Noisy Environments

TDK Corporation introduced the InvenSense ICS-40638 MEMS analog microphone, a new high-performance solution enabling clear audio capture in loud and noisy conditions, with an extended frequency response from 35 Hz to 20kHz. The ICS-40638 microphone offers an ultra-high Acoustic Overload Point (AOP) of 138 dB Sound Pressure Level (SPL), exceptionally efficient 170 µA low power operation and high Signal to Noise Ratio (SNR) of 63 dB in a small 3.5 mm x 2.65 mm x 0.98 mm bottom port surface‐mount package.

TDK Announces T3902 Lowest-Power PDM MEMS Microphone

June 29, 2020 by audioXpress Staff

TDK Announces T3902 Lowest-Power PDM MEMS Microphone

TDK Corporation introduced the InvenSense T3902, which the company touts as the world’s lowest power Pulse Density Modulation (PDM) microphone for consumer devices. The new T3902 offers a high SNR of 64.5 dB, and high Acoustic Overload Point (AOP) of 120 dB in a very small package, optimized for mobile devices, wearables, headsets, TV remotes and more, supporting far-field communications, enabling clear audio capture in loud conditions, and ideal for voice recognition.

TDK Announces First MIPI Standard SoundWire MEMS Microphone

January 21, 2020 by audioXpress Staff

TDK Announces First MIPI Standard SoundWire MEMS Microphone

Among the many interesting demonstrations of new audio solutions for developers presented by TDK at CES 2020, the T5808 MIPI standard SoundWire microphone stands out as a "world's first," using the MIPI Alliance SoundWire compliant digital interface which allows bi-directional data flow. The T5808 is a multi-mode, low noise digital MEMS microphone in a small package, consisting of a MEMS microphone element and an impedance converter amplifier followed by a fourth-order Σ-Δ modulator.

TDK Announces InvenSense CTO as Inductee to MSIG Hall of Fame

October 25, 2019 by audioXpress Staff

TDK Announces InvenSense CTO as Inductee to MSIG Hall of Fame

Dr. Peter G. Hartwell, Chief Technology Officer at InvenSense, a TDK group company, has been named a 2019 inductee into the SEMI-MEMS & Sensors Industry Group (MSIG) Hall of Fame for his outstanding contributions to MSIG and well-known industry activity.. The recognition honors those who inspire a sense of mission, purpose and dedication that drives the MEMS and sensors industry forward.

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