All items tagged with DSP (434)

Noveto Promotes SoundBeamer Headphones Alternative on Kickstarter

February 19, 2021 by Joao Martins

Noveto Promotes SoundBeamer Headphones Alternative on Kickstarter

Noveto is the Israeli company that successfully demonstrated its sound-beaming technology for web conferencing and automotive zoning applications at CES 2018, and more recently partnered with electronics giant Foxconn to bring to market its own audio chipset. Now, the company launched a limited pre-sale Kickstarter campaign to bring to market a proof-of-concept of its technology with the SoundBeamer 1.0 integrated speaker.

DSP Concepts Opens Advanced Design Center in Mexico

February 17, 2021 by audioXpress Staff

DSP Concepts Opens Advanced Design Center in Mexico

DSP Concepts, maker of the Audio Weaver platform and a leading company in embedded audio development, announced it has opened a design center in Queretaro, Mexico. The center is host to a team of engineers that are focused on audio for automotive and consumer electronics, with an emphasis on customer engagement, product development, and test and validation. DSP Concepts plans to double the headcount in Queretaro by the end of 2021.

Yamaha Family of Communication Products Adapts to Hybrid Workplaces

February 16, 2021 by Joao Martins

Yamaha Family of Communication Products Adapts to Hybrid Workplaces

Following the introduction of the Yamaha YVC-200 Portable USB + Bluetooth Speakerphone in 2018, Yamaha Unified Communications gradually increased its range of professional-quality portable conference solutions, including new YVC Speakerphone models, the CS-700 Video Soundbar and further conference room speaker and microphone solutions. Since 2020, Yamaha refocused this powerful range of communication products to respond to the more diverse needs of work from home and remote collaboration.

Best Kept Secrets: The Continuous Search for Reference Speakers

January 28, 2021 by Joao Martins

Best Kept Secrets: The Continuous Search for Reference Speakers

I frequently learn about new products from brands large and small, which sometimes remain unnoticed for multiple reasons (and I don't mean by the press) regardless of how innovative they are. That's a topic in itself to be addressed in a separate editorial one of these days... This week, I spent some time looking at a few speakers that I think deserve a spotlight. Please note that I have not heard those speakers. I just think they are interesting products that deserve a mention.

Antelope Audio Announces Zen Go Synergy Core Bus-Powered Audio Interface with DSP

January 27, 2021 by audioXpress Staff

Antelope Audio Announces Zen Go Synergy Core Bus-Powered Audio Interface with DSP

During NAMM Believe in Music week, Antelope Audio announced Zen Go Synergy Core, its first USB-C bus-powered, truly portable (4x8) audio interface, available as a powerful DSP-based desktop design powered by the same Synergy Core onboard effects processing platform found in the manufacturer’s top-tier audio interfaces with which it shares its technology, and yet attractively priced in the sub-$500 USD/€500 EUR market segment.

KEF Launches New KC62 Subwoofer with Uni-Core Technology

January 21, 2021 by audioXpress Staff

KEF Launches New KC62 Subwoofer with Uni-Core Technology

As previously teased, KEF announced the launch of the new KC62 powered subwoofer with three innovative technologies that successfully prioritize design and sound in equal measure. Combining the brand's technologies and skills, KEF's engineers have developed a brand new approach to subwoofer performance, allowing maximum bass in a minimum space. Using KC62's force-canceling and Uni-Core technologies, KEF surpasses traditional expectations of what a subwoofer can achieve based on its size.

CEVA Expands Possibilities in Sensor Hub DSPs with 2nd Generation SensPro Family

January 13, 2021 by audioXpress Staff

CEVA Expands Possibilities in Sensor Hub DSPs with 2nd Generation SensPro Family

CEVA introduced its 2nd generation SensPro DSP family, a hub for AI and DSP processing workloads associated with a wide range of sensors including camera, Radar, LiDAR, Time-of-Flight, microphones and inertial measurement units (IMUs). The new, lower power, SensPro2 DSPs deliver up to 10X performance improvement versus CEVA-BX2 DSP for AI networks used for voice assistants, natural language processing and spatial audio. They are also automotive-ready with high-precision floating-point capability.

Dirac Teams Up With OSM Group to Offer Spatial Audio Solutions for Next-Generation Headphones

January 12, 2021 by audioXpress Staff

Dirac Teams Up With OSM Group to Offer Spatial Audio Solutions for Next-Generation Headphones

Swedish digital audio pioneer Dirac and OSM Group, a global designer, developer and manufacturer have entered into an agreement to include Dirac’s industry-leading spatial audio solution in headphones created by OSM for its global portfolio of electronics customers. Under the terms of the agreement, OSM Group will license the Dirac spatial audio solution for integration into headphones that the company develops for leading brands around the world.

Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Applications

January 7, 2021 by audioXpress Staff

Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Applications

Syntiant Corp., the AI for edge devices chip technology company from Irvine, California, announced the availability of its latest Syntiant NDP120 Neural Decision Processor (NDP), a new generation of special purpose chips for audio and sensor processing for always-on applications in battery-powered devices. The low-power Syntiant Core 2 technology in the NDP120 processor delivers 25x the tensor throughput of the core technology found in earlier Syntiant NDP devices that are currently shipping in high volumes.

CEVA Establishes Partnership with DARPA for Technology Innovation

January 5, 2021 by audioXpress Staff

CEVA Establishes Partnership with DARPA for Technology Innovation

CEVA announced an open licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation for DARPA programs. The commercial partnership, as part of the DARPA Toolbox initiative, establishes an access framework under which DARPA organizations can access all of CEVA’s commercially available IPs, tools and support to expedite their programs. This provides DARPA researchers with access to CEVA’s portfolio of wireless connectivity and smart sensing IPs.

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