All items tagged with 5G (34)

Particle Unveils Tachyon, a Qualcomm Snapdragon-Powered, 5G, AI-Enabled Single-Board Computer

July 31, 2024 by Joao Martins

Particle Unveils Tachyon, a Qualcomm Snapdragon-Powered, 5G, AI-Enabled Single-Board Computer

Particle, a company from San Francisco focused on edge-to-cloud connectivity and platforms, has launched Tachyon, its first Qualcomm Snapdragon-powered single-board computer (SBC), comprising a powerful NPU for AI/ML workloads, built-in high-bandwidth cellular 5G and Wi-Fi 6E connectivity, and a Linux-powered Ubuntu operating system. The board is now available for pre-order on Kickstarter starting at $149.

Flip Phones, AI, Naturally Dumb Glasses, and Enhanced Audio: MWC 2024 Major Impressions

March 13, 2024 by Joao Martins

Flip Phones, AI, Naturally Dumb Glasses, and Enhanced Audio: MWC 2024 Major Impressions

What is like to explore audio technologies in the massive show that is Mobile World Congress. A report from MWC 2024 in Barcelona from an audio product development perspective. Audio for mobile platforms, wireless technologies, wearables and true wireless earbuds and hearables. And lot's of AI! MWC 2024 has nearly returned to pre-pandemic size levels, closing with 101,000 attendees from 205 countries.

January 2, 2023 by audioXpress Staff

Meta Materials to Showcase Global Technology Collaborations at CES 2023

Meta Materials, a developer of materials and nanocomposites will showcase a range of interesting technologies at CES 2023, which highlight global collaborations in the areas of 5G communications, augmented reality eyewear, and Li-ion battery components. The demonstrations include cutting-edge projects with Sekisui Chemical, Covestro, PPG, DuPont Teijin Films and Mitsubishi Electric Europe. During CES 2023, Meta Materials will be at the Las Vegas Convention Center, North Hall, booth 9417.

MediaTek Launches Flagship Dimensity 9200 Smartphone Chipset with Support for Bluetooth LE Audio

November 9, 2022 by audioXpress Staff

MediaTek Launches Flagship Dimensity 9200 Smartphone Chipset with Support for Bluetooth LE Audio

MediaTek launched the Dimensity 9200, its latest 5G chipset powering the next era of flagship smartphones. Boasting extreme performance and intelligent power efficiency, the new SoC brings immersive all-day gaming experiences, ultra-sharp image capturing and support for both mmWave 5G and sub-6GHz connectivity to consumers around the globe. Most importantly for the audio industry, this new solution will bring Bluetooth LE Audio support to many smartphones in 2023.

Worldwide Wearable Shipments Will Reach 344 Million by the End of 2022

August 12, 2022 by audioXpress Staff

Worldwide Wearable Shipments Will Reach 344 Million by the End of 2022

Demand for wearables and accessories slowed during 2021 due to economic and geopolitical factors impacting consumer's priorities. Despite this decline, global technology intelligence firm ABI Research expects continuous growth until 2027. More than 300 million wearables devices were shipped by the end of 2021 and will reach around 344 million by the end of this year. Additionally, more than 650 million of these devices are expected to be shipped worldwide by 2027, a CAGR of 13.2% between 2022 and 2027.

Rohde & Schwarz and Cadence Combine EDA Simulation with Hardware Testing

September 10, 2021 by audioXpress Staff

Rohde & Schwarz and Cadence Combine EDA Simulation with Hardware Testing

Rohde & Schwarz and Cadence Design Systems have collaborated on a solution aimed at simplifying the engineering process from RF design to implementation and enhancing accuracy by using realistic signals for both simulation and testing. The new R&S VSESIM-VSS signal creation and analysis tool speeds up the development process for RF components and is particularly useful manufacturers of active components and systems.

Wi-Fi 6 Adoption on the Rise to Reach 81% of Total Wi-Fi CPE Market in 2026

September 9, 2021 by audioXpress Staff

Wi-Fi 6 Adoption on the Rise to Reach 81% of Total Wi-Fi CPE Market in 2026

The COVID-19 pandemic has accelerated demand for broadband services, driving 214.8 million Wi-Fi Customer Premises Equipment (CPE) unit shipments in 2020, a 5% increase from the prior year. The demand for broadband devices will continue to increase as the industry continuously moves toward better broadband access to support both home and business users, says ABI Research.

HEAD acoustics and Rohde & Schwarz Test Voice over 5G New Radio Communication Quality

May 10, 2021 by audioXpress Staff

HEAD acoustics and Rohde & Schwarz Test Voice over 5G New Radio Communication Quality

Working together with Rohde & Schwarz, HEAD acoustics have created a test solution that was able to successfully verify the communication quality of 5G (VoNR)-capable devices. VoNR, or “Voice over 5G New Radio” is a call service which fully explores the capabilities in the SA architecture for 5G networks. Compared to other communication services, VoNR provides significantly lower latency and improved sound and picture quality, improving the calling experience.

Qualcomm Unveils Snapdragon Sound End-To-End Audio System

March 5, 2021 by Joao Martins

Qualcomm Unveils Snapdragon Sound End-To-End Audio System

Following previous announcements in development platforms and solutions for wireless audio, Qualcomm announced Qualcomm Snapdragon Sound, a new end-to-end approach to promote high resolution digital audio and enhanced voice communications across devices. The approach combines and optimizes multiple Qualcomm technologies for mobile platforms, processing, connectivity, plus the latest aptX Adaptive audio technologies needed to improve the sound experience for consumers.

Qualcomm and Amazon Deepen Strategic Engagement with the Pre-Integration of Alexa Custom Assistant with Snapdragon Automotive Cockpit Platform

January 27, 2021 by Joao Martins

Qualcomm and Amazon Deepen Strategic Engagement with the Pre-Integration of Alexa Custom Assistant with Snapdragon Automotive Cockpit Platform

Qualcomm Technologies and Amazon announced new joint efforts to pre-integrate the Alexa Custom Assistant with the Qualcomm Snapdragon Automotive Cockpit Platforms - the new-generation of automotive-optimized SoCs from Qualcomm. This new system is designed to support automotive OEMs and Tier-1 suppliers to build customizable, in-vehicle intelligent assistants and is offered as an extension module to the Alexa Automotive Software Development Kit (SDK).

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