All items in category Industry News
PCB Piezotronics Adds Miniature ICP Triaxial Accelerometers with TEDS
by audioXpress Staff

PCB Piezotronics Adds Miniature ICP Triaxial Accelerometers with TEDS

PCB Piezotronics introduced new TLD356A01 and TLD356A03 Miniature ICP Triaxial Accelerometers with TEDS. These new models are upgrades to PCB's current 356A01 and 356A03 models with the addition of TEDS functionality. The new triaxial sensors are primarily used to measure vibration inside devices, where space is restricted and are highly valued for automotive systems development, modal and structural analysis, and general purpose vibration testing.
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Resonado Partners with Parts Express to Make Res-Core Woofer Available Direct to Consumers
by audioXpress Staff

Resonado Partners with Parts Express to Make Res-Core Woofer Available Direct to Consumers

Resonado Labs announced that, for the first time ever, its technology is now available directly to the public. Previously, Resonado's high-performance racetrack drivers, featuring the proprietary Res-Core architecture, were exclusively offered to companies through licensed manufacturers. Meeting requests from speaker builders and developers, Resonado partnered with Parts Express to make the NW7 Gen 1 racetrack woofer directly available to the market.
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New Automotive-Qualified XENSIV MEMS Microphone With Analog Interface for Audio and Active Noise Cancelation Systems
by audioXpress Staff

New Automotive-Qualified XENSIV MEMS Microphone With Analog Interface for Audio and Active Noise Cancelation Systems

For ANC systems with an analog interface, Infineon Technologies expanded its automotive microphone portfolio with the XENSIV MEMS microphone IM68A130A with a flat frequency response to frequencies below 10Hz. It builds on the successful launch of Infineon’s first automotive-qualified digital MEMS microphone, the IM67D130A, and combines the company’s automotive expertise with its technical know-how in high-end MEMS microphones.
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Worldwide Shipments of Smart Home Devices Continue to Decline in 2023 Due to Lack of Upgrades
by audioXpress Staff

Worldwide Shipments of Smart Home Devices Continue to Decline in 2023 Due to Lack of Upgrades

Global shipments of smart home devices continued to decline in the first quarter of 2023 as shipments fell 5.6% year over year to 186.0 million units, according to the International Data Corporation (IDC) Worldwide Quarterly Smart Home Device Tracker. The lack of new models and noteworthy updates to existing smart speakers, lack of progress in voice assistants, and the transition to the Matter smart home interoperability standard are to blame.
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Zound Industries Now Fully Transformed into Marshall Group
by Joao Martins

Zound Industries Now Fully Transformed into Marshall Group

Audio, tech and design powerhouse Zound Industries International AB is formally changing its name to Marshall Group following the fusion between Zound and Marshall Amplification in March 2023. More than just a name change, the new Swedish-Anglo company says this represents the beginning of the next chapter in a decade-long partnership to build the iconic Marshall brand. Marshall Group AB anticipates revenue growth and operating margins in the second half of 2023.
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Dolphin Design Unveils Innovative IP for Sound Classification Reducing Power Requirements by 99%
by audioXpress Staff

Dolphin Design Unveils Innovative IP for Sound Classification Reducing Power Requirements by 99%

Dolphin Design, a semiconductor designer of power management, audio, and processing devices with in-house ASIC design services, announced the launch of WhisperExtractor, a mixed-signal technology for voice and audio-enabled SoCs, enabling voice and sound classification at a record µW level power budget. The new technology paves the way to breakthrough always-on voice user interface, real time speech-to-text, and always-on sound detection.
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Silicon Labs Opens Connectivity Lab in Boston for Real-World Matter Testing
by audioXpress Staff

Silicon Labs Opens Connectivity Lab in Boston for Real-World Matter Testing

Silicon Labs announced the opening of the new Silicon Labs Connectivity Lab in their Boston facility. The Connectivity Lab simulates a modern Smart Home, with a range of connected devices, applications, ecosystems, and networks. It offers developers an ideal environment to test their Matter prototypes, operating within real-world scenarios across a variety of protocols and device brands.
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Knowles Balanced Armatures Pack High-Fidelity Punch into 21-Driver UE PREMIER IEM
by audioXpress Staff

Knowles Balanced Armatures Pack High-Fidelity Punch into 21-Driver UE PREMIER IEM

As Ultimate Ears Pro rolls out its most ambitious in-ear monitor (IEM) to date, the UE PREMIER, unveiled at the 2023 NAMM show, Knowles revealed the full extent of its collaboration with the Logitech company. The new UE PREMIER features a five-way crossover design with 21 drivers per earpiece, an industry-first. The IEM design features Knowles receivers, including supertweeters and dual-diaphragm balanced armatures, to achieve extended treble range and exceptionally crisp audio.
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TDK InvenSense Low-Power T5838 MEMS Microphones Selected for Edge AI Development Kit
by Joao Martins

TDK InvenSense Low-Power T5838 MEMS Microphones Selected for Edge AI Development Kit

The latest low-power T5838 and T5837 digital PDM MEMS microphones, part of the TDK InvenSense SmartSound family, have been elected by Syntiant as a microphone of choice for low-power edge AI application processors that perform keyword detection, due to its innovative Acoustic Activity Detect (AAD) feature that enables system power savings, thus prolonging battery life, and ability to intelligently detect keywords or voice commands.
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Qualcomm Extends S3 Gen 2 Sound Platform Portfolio to Deliver Best-In-Class Gaming and LE Audio Experiences
by audioXpress Staff

Qualcomm Extends S3 Gen 2 Sound Platform Portfolio to Deliver Best-In-Class Gaming and LE Audio Experiences

Qualcomm Technologies International unveiled an addition to the Qualcomm S3 Gen 2 Sound platform portfolio. This newly enhanced solution is optimized for gaming and ready for use in dongles and adapters. It combines Snapdragon Sound and LE Audio to deliver ultra-low latency of less than 20ms for lag-free wireless audio with voice back-channel for in-game chat. When delivering game audio only, the latency is further reduced.
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