All items in category Industry News
DirectOut Celebrates 10 Years of Ravenna AoIP Partnership
by audioXpress Staff

DirectOut Celebrates 10 Years of Ravenna AoIP Partnership

DirectOut is celebrating a decade as a trusted Ravenna partner, helping to promote real-time distribution of audio through IP-based network environments. To celebrate the company’s efforts and achievements with the technology, DirectOut launched a limited edition of their latest EXBOX.RAV AoIP-to-MADI converter in Ravenna green. Only 50 units of the anniversary edition will be made.
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FLUX:: and L-Acoustics Promote ADM-OSC Standardization for Object-Based Audio
by audioXpress Staff

FLUX:: and L-Acoustics Promote ADM-OSC Standardization for Object-Based Audio

FLUX:: Immersive, L-Acoustics, and Radio France have joined in an initiative to standardize Open Sound Control (OSC) as a streaming protocol for interoperability among immersive audio systems. Originally intended as a protocol for networking sound synthesizers, computers, and other multimedia devices for musical performance and show control, OSC is a de-facto standard when it comes to controlling and translating metadata for very complex object-based systems, such as those required for immersive audio performance.
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15th Anniversary of Meyer Sound’s Constellation Acoustic System
by audioXpress Staff

15th Anniversary of Meyer Sound’s Constellation Acoustic System

Meyer Sound’s Constellation acoustic system was introduced in 2006 and has been discreetly and gradually leading a revolution in variable acoustics and the design of performance spaces. Using an array of ambient sensing microphones, sophisticated digital signal processing, and loudspeakers, Constellation modifies the reverberant characteristics of a venue and redistributes sound throughout the space, ensuring a natural acoustic experience in every seat.
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Renesas Announces Development of Next-Generation Wireless MCUs Supporting New Bluetooth 5.3 Low Energy Specification
by audioXpress Staff

Renesas Announces Development of Next-Generation Wireless MCUs Supporting New Bluetooth 5.3 Low Energy Specification

Renesas Electronics announced that it is developing new microcontrollers (MCUs) that will support the recently released Bluetooth 5.3 Low Energy (LE) Specification. The new devices will be part of the Renesas Advanced (RA) Family of 32-bit Arm Cortex-M microcontrollers, joining the RA4W1 Bluetooth 5.0 LE device introduced in 2020. Renesas expects to have first samples of the new MCUs in the first quarter of 2022.
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Sony Licenses MPEG-H Audio Decoder Software and Joins MPEG-H Trademark Program
by audioXpress Staff

Sony Licenses MPEG-H Audio Decoder Software and Joins MPEG-H Trademark Program

Fraunhofer IIS, the primary developer of the MPEG-H 3D Audio standard, announced that Sony Corporation (Sony) has licensed Fraunhofer’s MPEG-H 3D Audio Baseline Profile Decoder software and joined the MPEG-H Trademark Program. Among many other applications, the announcement allows reinforcing Sony’s 360 Reality Audio and MPEG-H 3D Audio implementations in a wide variety of products from the company.
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On-Device Voice Interfaces Driving Growth in MEMS and ECM Microphone Market
by audioXpress Staff

On-Device Voice Interfaces Driving Growth in MEMS and ECM Microphone Market

According to SAR Insight & Consulting, the market for MEMS and ECM microphones continues to see strong growth, with ten billion units shipped in 2020. This was driven by two main factors: increased use of voice interfaces and multiple microphones per device, according to SAR’s latest report “MEMS Microphones Focus: Market Growth, Mic Type, Input Type, SNR, Volume, Performance Density.” With the emergence of TWS, earbuds and headphones are now the second largest market.
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Second Modeling and Measurement Webinar on Designing Audio Devices With Digital Twins Scheduled for October 27
by Audio Engineering_Society

Second Modeling and Measurement Webinar on Designing Audio Devices With Digital Twins Scheduled for October 27

The AES Audio Product Education Institute (APEI) continues to explore the practice and benefits of simulation-driven audio architecture design. In the second Modeling and Measurement webinar in this series (October 27, 12pm EDT), experts from COMSOL, JJR Acoustic and Facebook, will describe and detail a real virtual architectural design story. Registration for this webinar is now available.
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CEDIA Names Daryl Friedman as Global President & CEO
by audioXpress Staff

CEDIA Names Daryl Friedman as Global President & CEO

Culminating a year-long search process, CEDIA has named veteran association executive Daryl Friedman as its new Global President and CEO. Friedman is no stranger to CEDIA or the custom installation market. He has spent more than 30 years in nonprofit leadership roles, having overseen membership, advocacy, industry relations, and the technical wing for the 25,000-member Recording Academy.
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NFC Forum Wireless Charging Specification 2.0 Allows Charging TWS Earbuds From Smartphones
by Joao Martins

NFC Forum Wireless Charging Specification 2.0 Allows Charging TWS Earbuds From Smartphones

The NFC Forum latest Wireless Charging Technical Specification 2.0 allows for wireless charging by enabling a single antenna in an NFC-enabled device to manage both communications between the devices and charging. Users who need to charge low-power devices such as wireless earbuds, digital stylus pens, fitness trackers, and other small consumer products can now do so from NFC-enabled smartphones and other devices, just by placing both devices directly in contact.
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Avnu Alliance Launches Streamlined Milan Advanced Certification Program
by audioXpress Staff

Avnu Alliance Launches Streamlined Milan Advanced Certification Program

The Avnu Alliance industry consortium promoting deterministic networking based on IEEE 802.1 AVB/TSN standards, introduced a new Milan Advanced Certification Program for faster, and less expensive testing and certification of professional audio and video end devices for its members. This initiative is intended to encourage further adoption of the Milan network protocol by more manufacturers.
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