TDK Acquires Ultrasonic MEMS Sensing Solutions Developer Chirp Microsystems
TDK Corporation announced that it has reached an agreement with Chirp Microsystems, a pioneer in high-performance ultrasonic sensing, headquartered in Berkeley, California. With the acquisition, Chirp becomes a wholly owned subsidiary of TDK, enhancing its existing technology in fingerprint sensors, MEMS sensors, and Piezoelectric transducer product lines. “TDK aims to be the leader in the ultrasonic MEMS sensors and solutions market,” says Shigenao Ishiguro, TDK’s President and CEO.
Social Music Platform BandLab Technologies Buys What's Left of Cakewalk
In the middle of all the turmoil around the rumors of the collapse of Gibson Brands, there's some sort of good news for musicians and many home and project studios. Following the hard-to-understand news, back in November 2017, that Gibson was closing Cakewalk - the first clear sign that the group was facing serious financial troubles - there is now a confirmation that not everything is lost for users of Cakewalk's products. Singapore-based BandLab Technologies confirmed the acquisition of Cakewalk Inc. remaining assets.
CEVA Extends its IP Platforms for Bluetooth 5 and Wi-Fi Applications with RISC-V
Audio and voice signal processing specialists CEVA announced that the complete RivieraWaves suite of Bluetooth 5 (low energy and dual mode) and Wi-Fi 802.11a/b/g/n/ac/ax intellectual property (IP) platforms are now offered with an optional integrated open-source RISC-V MCU. These integration-ready system solutions are ideal for those manufacturers seeking freedom from standard 3rd party processor architectures.
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QuickLogic Collaborates with Shenzhen Horn Audio Company to Develop Bluetooth Headset Reference Design with Alexa Support
QuickLogic Corporation announced it has partnered with Shenzhen Horn Audio Co., Ltd. to deliver a Bluetooth-enabled headset reference design supporting Amazon Alexa Voice Services (AVS) for both Apple and Android smartphones and tablets. Based on QuickLogic's EOS S3 Voice and Sensor Processing Platform, the new reference design features advanced always-on and always-listening voice processing capabilities with the industry's lowest power consumption.
Bragi Introduces Bragi Intelligent Edge Software Suite featuring Bragi nanoAI
After 4 years of development, Bragi has made a breakthrough in ultra-efficient artificial intelligence and says it is ready to deliver the first edge computing AI suite. During Mobile World Congress 2018, in Barcelona, Bragi, the company behind The Dash hearable, now the world’s first intelligent Edge Headphone, announced a B2B offer of Bragi nanoAI as a software solution, which the company says helps to overcome major challenges of the current IoT architecture.
THX Announces End-To-End MPEG-H Positional Audio Solution
THX Ltd., announced the THX Spatial Audio Platform using MPEG-H and jointly demonstrated by Qualcomm Technologies and THX for the first time at Mobile World Congress 2018. The THX Spatial Audio Platform is an end-to-end universal positional audio solution built with the flexibility to support emerging immersive content formats (object-based and ambisonics) and open standards, as well as legacy content, across mobile, PC and consumer electronic devices.
XMOS Introduces Stereo-AEC Far-Field Linear Development kit for AVS, Qualified by Amazon
XMOS announced its VocalFusion Stereo Dev Kit for Amazon AVS, the first linear mic array solution qualified by Amazon for far-field performance that supports stereo acoustic echo cancellation. This new voice processor development kit is designed for developers working in the growing Alexa-enabled smart TV, soundbar, set-top box, and digital media adapter market segments, all of which require true stereo-AEC support to deliver compelling “across the room” voice-interface solutions.
STMicroelectronics Introduces Next-Generation Wireless Platform for Higher-Performing Bluetooth Devices
Powering the next generation of smart connected objects like digital-home products and wearable electronics, STMicroelectronics has revealed an advanced dual-processor wireless chip that supports new features and enhanced performance with extended battery life. The fusion of 32-bit ultra-low-power microcontroller and highly integrated Bluetooth 5 (BLE) and IEEE 802.15.4 radio creates a high-performing wireless platform for feature-rich smart connected objects.
Speakers and Voice Development - A Conversation with NXP
After reviewing my notes from CES 2018 and the announcements from NXP, I decided it was fitting to share some parts of my interview with Martyn Humphries, vice president and general manager Media IoT and i.MX Applications Processors at NXP (and former Freescale executive). Basically, we discussed the environment that lead NXP to create its i.MX 8M single-chip media application processors, currently the most advanced integrated platform available for audio manufacturers.
HEAD acoustics Complimentary Voice Quality Webinars
HEAD acoustics announced open enrollment for their new series of complimentary educational voice quality web based seminars. These one hour sessions are designed to provide short but focused information on voice quality topics that are normally not taught in college level classes. Anyone interested in learning more about the fundamentals of voice quality testing is invited to attend.