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All items tagged with wireless earbuds and ultrasonic transducers (2)
xMEMS Achieves Extended Bass Response, Making ANC Applications Possible From a Single MEMS Driver
November 14, 2023 by Joao Martins

xMEMS Achieves Extended Bass Response, Making ANC Applications Possible From a Single MEMS Driver

The new Cypress MEMS speaker from xMEMS Labs achieves 40X louder bass response on a single monolithic, miniaturized device, achieving well above the 130dB SPL at low frequencies, required for ANC implementations on TWS earbuds. The new xMEMS Cypress achieves this groundbreaking performance by using ultrasound technology. The new development will be demonstrated at CES 2024 by appointment only, with mass production scheduled for late-2024.
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SonicEdge MEMS Ultrasound Speaker-In-Chip: Next Gen MEMS for TWS Earbuds and Hearing Aids
February 24, 2023 by Mike Klasco

SonicEdge MEMS Ultrasound Speaker-In-Chip: Next Gen MEMS for TWS Earbuds and Hearing Aids

Mike Klasco writes all about the cutting-edge SonicEdge MEMS Ultrasound Speaker-In-Chip. A next-gen MEMS solution for TWS earbuds, hearing aids, and hearables. Entering production in 2023, this unique ultrasonic shutter MEMS-based speaker system represents a decade's work in a unique topology. The core of the design is one or more apertures driven by the ultrasonic carrier signal and one or more movable and over-sized obstruction elements that are configured to modulate the ultrasonic carrier signal (think of a shutter) thereby generating audio.
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