Infineon Introduces New High-Performance XENSIV MEMS Microphones Using Sealed Dual Membrane Technology

Infineon Technologies is launching its next-generation XENSIV MEMS microphones that the German company says will define a new industry standard. The IM69D127, IM73A135 and IM72D128 are the latest additions to Infineon’s growing MEMS microphone portfolio. Combined with selectable power modes, the MEMS microphones are a perfect match for consumer electronics such as headphones with active noise cancellation (ANC), TWS earbuds, and more.

Showing its importance to the CE industry as one of the world's largest advanced semiconductor manufacturers, Samsung Electronics announced the first all-in-one power management integrated circuits (PMIC), MUA01 and MUB01, optimized for True Wireless Stereo (TWS) devices. The new Samsung PMICs integrate multiple discrete components in one chip to make room for longer battery life and more efficient designs in today’s true wireless earbuds and other very low power designs.