All items tagged with wireless earbuds and headsets (20)

Airoha Technology Launches Flagship Wireless AI Audio SoC

December 30, 2024 by Joao Martins

Airoha Technology Launches Flagship Wireless AI Audio SoC

Airoha Technology announced the launch of a new flagship wireless audio chip with integrated AI processing. The AB1595 chip integrates essential functions that currently require multiple chips into one single system-on-chip (SoC). The announcement follows a recent press conference where the MediaTek subsidiary confirmed its intention to lead the market as a Bluetooth audio supplier and to outgrow the industry with AI-powered solutions in 2025.

Development & Design: The Impact of Microphone Specifications on Active Noise Cancellation Performance

January 3, 2024 by Nikolay Skovorodnikov

Development & Design: The Impact of Microphone Specifications on Active Noise Cancellation Performance

Active noise cancellation (ANC) is a popular feature for consumer electronics headsets, headphones, and earbuds. Designing effective ANC imposes particular specification requirements on audio chain components, including microphones. This article explains how to achieve better true wireless stereo ANC designs, offering valuable insights for this trending application.

HEAD acoustics ViBRIDGE: Holistic Testing of In-Ear Headsets with Bone Conduction Sensors

July 26, 2023 by audioXpress Staff

HEAD acoustics ViBRIDGE: Holistic Testing of In-Ear Headsets with Bone Conduction Sensors

With the availability of the HEL/HER 4.4 ViBRIDGE Flexible Pinna for HMS II.3/5, the industry as gained a vital testing tool for in-ear headset designs that utilize bone conduction sensors. Evaluating these systems is vital to optimize near-end structure-borne sound to improve speech quality in the presence of background noise, improve echo cancellation, and double-talk performance. The unique technology developed by HEAD acoustics is being enthusiastically embraced by the industry.

Qualcomm Extends S3 Gen 2 Sound Platform Portfolio to Deliver Best-In-Class Gaming and LE Audio Experiences

June 21, 2023 by audioXpress Staff

Qualcomm Extends S3 Gen 2 Sound Platform Portfolio to Deliver Best-In-Class Gaming and LE Audio Experiences

Qualcomm Technologies International unveiled an addition to the Qualcomm S3 Gen 2 Sound platform portfolio. This newly enhanced solution is optimized for gaming and ready for use in dongles and adapters. It combines Snapdragon Sound and LE Audio to deliver ultra-low latency of less than 20ms for lag-free wireless audio with voice back-channel for in-game chat. When delivering game audio only, the latency is further reduced.

HEAD acoustics Introduces ViBRIDGE Holistic In-Ear Headset Testing Solution

February 14, 2023 by Joao Martins

HEAD acoustics Introduces ViBRIDGE Holistic In-Ear Headset Testing Solution

As many audioXpress readers already learned from reading the article by Hans W. Gierlich on the Benefits of Using Structure-Borne Sound in Headset Signal Processing, HEAD acoustics created a complete test solution for in-ear and headset devices using bone-conduction sensors. There are good reasons for developers and manufacturers to explore the use of bone-conduction sensors and test them with the new ViBRIDGE solution.

How Many Headphones Can You Sell? Harman Claims 200 Million JBL Headphones Milestone

December 15, 2022 by Joao Martins

How Many Headphones Can You Sell? Harman Claims 200 Million JBL Headphones Milestone

We all know that sales of headphones are booming and that volumes are very significant, in particular true wireless earbuds. We just don't know how many exactly are sold. Harman International, a wholly-owned subsidiary of Samsung Electronics says that it has achieved a significant new milestone, as its JBL-branded headphones have reached 200 Million units sold.

CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection

June 10, 2022 by Cristina Costa

CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection

CEVA announced an expansion to its family of sensor fusion products with the introduction of the FSP201, a high-performance and low-power sensor hub MCU that delivers precise, accurate sensor fusion for motion tracking, heading and orientation detection. The FSP201 is ideal for consumer robotics and other emerging smart devices employing sensor fusion technologies, including XR glasses, 3D audio headsets and the wide range of 6-axis motion use cases across IoT and the metaverse.

7 Sensing Software Supports Analog Devices' Low Power Audio Codecs

November 19, 2021 by audioXpress Staff

7 Sensing Software Supports Analog Devices' Low Power Audio Codecs

7 Sensing Software, a company working in advanced embedded audio DSP and machine learning solutions, announced that it has entered into a collaboration with Analog Devices, Inc. The two companies are working together to incorporate 7 Sensing’s state-of-the-art audio solutions for wireless earbuds and headsets embedded into Analog Devices’ recently expanded family of low power codecs. 7 Sensing's Pure Voice solution and Hearing Augmentation suite will expand Analog Device's hardware platform with a valuable, differentiated feature set for manufacturers and brands.

Synaptics Announces AudioSmart AS33970 Edge AI Headset Platform

October 18, 2021 by audioXpress Staff

Synaptics Announces AudioSmart AS33970 Edge AI Headset Platform

Synaptics announced its newest AudioSmart AS33970 headset platform SoC, directly targeting the fastest growing product categories, from work-from-anywhere TWS earbuds to hearables. As the San Jose, California-based company details, the new SoC offers the world’s first highly integrated AI-enabled ENC (Environmental Noise Cancellation) and hybrid ANC (Active Noise Cancellation) single-chip solution integrating neural and voice processing engines for optimal audio performance.

CEVA, Beken and VisiSonics Announce Reference Design for 3D Spatial Audio in Headsets and TWS Earbuds

September 30, 2021 by audioXpress Staff

CEVA, Beken and VisiSonics Announce Reference Design for 3D Spatial Audio in Headsets and TWS Earbuds

CEVA, together with Beken Corporation, a key player in wireless communication solutions, and VisiSonics, the 3D spatial audio technologies specialists, announced the availability of a complete 3D audio reference design for the rapid deployment of headsets and True Wireless Stereo (TWS) earbuds supporting spatial audio for use in gaming, multimedia and conferencing. The integration delivers a complete 3D spatial audio hardware and software solution to consumer electronics OEMs and ODMs.

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