STMicroelectronics Announces All-in-One Motion and Bone-Conduction Sensor for Hearables

STMicroelectronics has announced the LSM6DSV16BX, a unique highly integrated sensor that delivers important space savings inside hearable devices or general-purpose TWS earbuds, including for sports. The new device delivers longer listening experiences and superior hearing by combining a 6-axis inertial measurement unit (IMU) for head tracking and activity detection with an audio accelerometer for detecting voice through bone conduction in a frequency range that exceeds 1KHz.

CEVA, together with Beken Corporation, a key player in wireless communication solutions, and VisiSonics, the 3D spatial audio technologies specialists, announced the availability of a complete 3D audio reference design for the rapid deployment of headsets and True Wireless Stereo (TWS) earbuds supporting spatial audio for use in gaming, multimedia and conferencing. The integration delivers a complete 3D spatial audio hardware and software solution to consumer electronics OEMs and ODMs.

Demand for True Wireless Stereo (TWS) products reflect the growing demand for multi-function, health care, and connected wearable solutions, all requiring smaller and longer battery life devices. Asahi Kasei Microdevices (AKM) has recently introduced the AKM AK4336ECB ultra low power audio codec, a 4-channel ADC and one channel DAC that supports active noise cancelling designs, complementing its complete portfolio of audio systems and sensors for TWS development.