Qualcomm Unveils Snapdragon 888 Mobile Processing Platform

During the annual Snapdragon Tech Summit Digital 2020, Qualcomm introduced its latest flagship Qualcomm Snapdragon 888 5G Mobile Platform, which will set the benchmark for flagship Android smartphones in 2021. This new platform packs industry-leading mobile innovations in 5G, artificial intelligence (AI), gaming, and camera technologies, while offering all the processing and connectivity power to enable next-generation immersive audio experiences, including support for Bluetooth 5.2 with LE Audio features.

DSP Group announced TensorFlow Lite for Microcontrollers SDK support for its DBMD7 family of low-cost, high-performance, multicore AI and DSP processors. The SDK for the DBMD7 allows developers of AI and high-performance machine learning applications on edge devices to avoid latencies and ensure end-user privacy devices to cost-effectively deploy high-performance machine learning (ML) inference at the edge to avoid network latencies, minimize power consumption, ensure end-user privacy, and free up scarce network bandwidth.

CEVA and Fluent.ai, a leading provider of on-device, multilingual speech understanding solutions, announced a partnership to offer ultra-low power speech-to-intent solutions for intelligent edge devices. Fluent.ai’s suite of speech-to-intent technologies has been ported and optimized for CEVA’s low power audio and sensor hub DSPs, providing a high performance, robust solution for OEMs and ODMs looking to integrate intelligent voice activation and control into their wearables, consumer devices and IoT products.